Products/Services for Thermal Wafer Chuck
Environmental Test Chambers and Rooms - (354 companies)
Environmental Exposure (Climatics) Testing Services - (245 companies)
Chucks - (426 companies)
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Grinders and Grinding Machines - (1001 companies)
Wafer and Thin Film Instrumentation - (377 companies)
Thermal Cutoffs and Thermal Protectors - (62 companies)
Thermal Cyclers - (71 companies)
Magnetic Chucks - (34 companies)
Thermostats and Thermal Switches - (669 companies)
Product News for Thermal Wafer Chuck
Wafer Carriers in Sapphire Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco is now able to offer multiple hole wafer carriers in sapphire for GaAs and other semiconductors. •Superior chip resistance. •Chemically resistant to all reagents used in processing. •Scratch resistant. Harder than any other optical material except diamond. •Transparent. •Durable. Withstands repeated... (read more)
ValueTronics International, Inc.
Electroglas 2080X 8 Inch Wafer Prober Electroglas 2080X. 8 Inch Wafer Prober. . Electroglas 2080X Features: 8 inch wafer prober. Includes: Microscope. Monitor. 8 inch Gold Chuck. View more information on the Elegtoglas 2080X. View more Items on Sale at ValueTronics. (read more)
Accupol Lapping & Polishing Wafer Thinning Jig The Lapmaster line of Accupol Lapping & Polishing Wafer Thinning Jig Fixtures are designed to control precision thickness and parallelism of thin, fragile components made of semiconductor, compound semiconductor and electro-optics materials. A vacuum chuck retains the wafers during processing. The spring-loaded weight (down-force) is available in applying just a few ounces or can be adjusted to applying several pounds. Single or multiple wafers can be retained and processed within a fixture... (read more)
AL120 Wafer Handler The NEW AL120 wafer handler series transfers both silicon and compound semiconductor wafers from the cassette to the microscope stage with enhanced capabilities and flexibility, while maintaining an ergonomic design. Continuing the world-renowned performance and reliability of previous Olympus wafer handlers, the AL120 now transfers wafers with thicknesses down to 90µm to specifically meet the demands of thin wafer manufacturers. The new system offers 360-degree rotation, for full macro... (read more)
MTI Instruments Inc.
Wafer Metrology Measurement Tool The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 150mm, 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns... (read more)
Check-All Valve Mfg. Co.
Wafer Insert Valve The WV is designed to fit between two mating ANSI flanges. Two gaskets are required, instead of one that is normally used. The valve body fits inside the bolt circle for quick installation and removal in rigid piping applications. Many valves in this series meet API 594 requirements. Simply change the spring settings and you can use the WV as: Check Valve. Low Pressure Relief Valve. Vacuum Breakers. Consult the factory for complete details. Available Materials. 316 Stainless Steel (SS). Carbon... (read more)
Semiconductor Wafer Processing Nesting Specialty custom machining of sapphire and ceramic wafers allows Insaco to respond to customer needs for nesting of wafers in larger carriers. Insaco capability to machine and jig grind precise features to extreme tolerance in ceramic materials allows developmental engineers in the semiconductor and compound semiconductor industries to handle small process wafers on a large wafer line. Insaco is a precision machining company that fabricates parts from all technical ceramics, sapphire and quartz... (read more)
GF Piping Systems
Wafer Check Valve Offering expanded application versatility, GF Piping Systems has introduced the Type 369 Wafer Check Valve, the company's first check valve to be offered in sizes as large as 12-inches. This feature, combined with its simple installation ability, unique spring option for horizontal mounting, and excellent flow characteristics, make it an ideal check valve solution for a variety of applications. Suitable uses include aquatics, chemical processing, municipalities, water and wastewater treatment... (read more)
MTI Instruments Inc.
Cost-effective manual wafer measurement The Proforma 300i is a portable non-contact manual wafer inspection system for thickness, total thickness variation (TTV) and bow measurements. Capable of measuring sizes up to 300mm, the on-board intelligence provides fast, accurate, repeatable measurements for all types of wafer materials. Using MTI's proprietary non-contact capacitance probes, the Proforma 300i is fast, accurate and reliable. The Proforma 300i is capable of storing data directly to a USB flash drive. It also comes... (read more)
CMP Wafer Polishing Pressure Distribution The I-Scan ® system provides the diagnostic tools necessary to evaluate, view, and balance the forces acting on a silicon wafer during the polishing process. A study was conducted to collect and analyze the pressure distribution under a polishing head. Using a unique I-Scan pressure sensor with a sensing area of 9 1/2" X 9 3/4", measurements were taken to determine the pressure distribution of the polishing head and the wafer interface. Balancing these pressures during machine set-up can... (read more)
Etched foil element heaters to heat acid in portable wafer processing baths, High Temperature Binder Inorganic and Organic coatings and with fabrication materials such as fiberglass cloth, fiberglass mat, mica, and ceramic fiber insulating carriers, etc... Thermal Circuits -Semiconductor etched...
...significant advantages over traditional wafer chucks. Three to five times stiffer than glass or metal components, the ceramic chucks are available in several materials, including UltraSiC silicon carbide, PureSiC chemical vapor deposition silicon carbide, PlasmaPure alumina, and StatSafe ESD alumina...
...and lowers chip manufacturing costs. An integrated heater assembly platform helps optimize the performance of heaters and electrostatic chucks in chipmaking equipment. The custom assembly, a critical subsystem in semiconductor wafer chambers, combines customer-specific mechanical, electrical...
...and all metrology tools that handle copper-processed wafers. Based on extensive data, this article investigates the spin-process contamination elimination (S CE) technology developed by SEZ (Villach, Austria and Phoenix), an effective means of eliminating copper from the wafer backside, bevel/edge...
...is problematical. Cooled wafer chucks are one way to. dissipate heat when testing VCSELs on the wafer plane, but localized thermal gradients may still induce mechanical stresses. that degrade these devices. To avoid self-heating of an uncooled DUT, short pulse testing may be conducted. Similarly...
...dielectrics. The rate of the chemical. reaction that causes this degradation in κ can be accelerated by high temperatures. High temperature aging of a wafer is difficult due to issues with thermal expansion of. the probe and hot chuck. However, high temperatures can easily he developed within small...
Engineering Web Search: Thermal Wafer Chuck
Thermal Challenges During Microprocessor Testing
THERMAL CHALLENGES AT SORT Wafer sort is the first step in the test process with its main purpose being to reduce assembly
Environmental Chambers | Temperature Testing | Thermal Testing
Wafer Hot & Cold Chuck Testing, Probing and Failure Analysis - Thermal Systems - Thermal Chambers - Data Sheets/Application Notes
See Temptronic Corporation Information
106-914-E Summit 11_12K User's Guide
1 Chuck: Summit 11500, 12500, 11700, 12700 and 11800, 12800 .................... 1 Guarded Thermal Chuck Option
Bonding) Purpose: Handle bonding is a necessary procedure for through-wafer etches (DRIE) and the etching of dies and substrates smaller than 6inch
Deactivation Induced Within Wafer Nonuniformity During Nonmelt...
This additional thermal budget is associated with the chuck temperature and duration a wafer is left on the chuck after LSA. The deactivation is
FEA thermal investigation on plasma etching induced heating...
FEA thermal investigation on plasma etching induced heating during wafer thinning process
Extreme ultraviolet lithography - Wikipedia, the free...
The thermal production of multicharged positive ions is only possible in a hot dense plasma, which itself strongly absorbs EUV.[2[3 The Xe or Sn
CCMR - Shared Experimental Facilities
Aremco Wafer cutting Diamond Saw Location: Duffield Hall
Heated Chuck For Laser Thermal Processing invention
Abstract: A chuck for supporting a wafer and maintaining a constant background temperature across the wafer during laser thermal processing (LTP) is
Wafer Chuck Having Thermal Plate With Interleaved Heating And...
Wafer chuck having thermal plate with interleaved heating and cooling elements -> Monitor Keywords