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Description: adhesives loaded with thermally conductive ceramic fillers. Pressure is needed to form a bond. Heat and pressure may be needed on some substrates to achieve an acceptable bond. • The specialized acrylic chemistry of these tapes provide for good thermal stability of the base polymer. &bull
- Compound Type: Thermally Conductive
- Industry: Electronics
- Features: UL Approved
- Chemical / Polymer System Type: Acrylic / Polyacrylate
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Supplier: Master Bond, Inc.
Description: Master Bond X-5TC is an aluminum oxide filled, thermally conductive elastomer-based, one component adhesive for high performance bonding and sealing. This thermally conductive adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System
- Rubber Based / Elastomeric: Yes
- Composition: Unfilled, Filled
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Compound EP45HTAO is a two component thermally conductive epoxy compound for high performance structural bonding, and casting. It is suitable for applications where long term exposure to temperatures from -60° to +500°F is required. lt is 100% reactive and does
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), Photonics / Optoelectronics, Semiconductors / IC Packaging, Other
- Cure Type / Technology: Two Component System, Specialty / Other
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Description: Covers requirements and test methods for thermally conductive dielectric adhesives used to bond components in place.
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is an easy-to-use, one component, thermally conductive, electrically isolating, high performance silicone for bonding, sealing and coating. The material is an off-white colored paste. It cures readily at ambient temperatures when exposed to atmospheric moisture
- Compound Type: Thermally Conductive
- Compound Type: Thermal Compound / Heat Conductive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Features: Non-corrosive Cure
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Supplier: Master Bond, Inc.
Description: at elevated temperatures. Other attractive properties include superb dimensional stability and superior physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent adhesive/sealant forming durable
- Compound Type: Thermally Conductive
- Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, Electrical Power / HV
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer Adhesive EP21HTAOTDC is a two component thermally conductive epoxy adhesive for high performance bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength
- Compound Type: Electrically Conductive, Thermally Conductive
- Type / Form: Adhesive, Sealant / Gap Filling Compound, Thermal Compound / Interface, Specialty / Other
- Electrically Conductive: Yes
- Anti-static / ESD Control: Yes
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Supplier: Master Bond, Inc.
Description: at elevated temperatures. Other attractive properties include superb dimensional stability and superior physical strength properties. Its low viscosity and excellent flow characteristics make it an ideal thermally conductive potting epoxy. EP30AN-1 is also an excellent adhesive/sealant forming durable
- Compound Type: Thermally Conductive
- Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, Electrical Power / HV
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product
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Supplier: Quist Electronics
Description: High bond strength with long term exposure to heat and high humidity
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Industry Applications: OEM / Industrial, Other
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Supplier: Master Bond, Inc.
Description: of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AOSP is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy
- Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Optical Grade / Material, Semiconductors / IC Packaging, Building / Construction, Tooling / Mold Material, Other
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
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Supplier: Master Bond, Inc.
Description: of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. EP30FLAO is also
- Material Form: Adhesive, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
- Use: Die Bonding Adhesive / Compound
- Form: Liquid
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Supplier: Master Bond, Inc.
Description: of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AO is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy
- Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), Semiconductors / IC Packaging, Other
- Chemical / Polymer System Type: Polysulfide, Epoxy (EP)
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Supplier: Allied Electronics, Inc.
Description: Offering higher performance qualities over conventional RTV silicones. MG Chemicals sealants will bond to many clean surfaces without the aid of primers. Many of these one-part RTV silicone adhesive sealants are suitable for assembly applications. Can be dispensed manually or with automated
- Chemical / Polymer System Type: Silicone
- Features: Flame Retardant (e.g. UL 94 Rated)
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Supplier: Master Bond, Inc.
Description: Bond Polymer Compound EP45HTN is widely used in aerospace, electronic, electrical, computer, con-struction, metal working, appliance, automotive and chemical industries where a high thermally conductive bond is desired.
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Semiconductors / IC Packaging, Building / Construction, Other
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Hi-Tech Seals, Inc.
Description: preparation and bond well to dirty and oily surfaces. Other acrylic features include the ability to bond a wide range of materials, excellent gap fills and fast fixturing times. HERNON® offers two families of acrylic adhesives: the ReAct® bonding systems, and the Dissipator® thermally conductive
- Compound Type: Thermally Conductive
- Material Type: Grease / Paste
- Industry: Electronics
- Chemical / Polymer System Type: Acrylic / Polyacrylate
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Supplier: Quist Electronics
Description: Maintains structural bond in severe-environment applications
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound
- Cure Type / Technology: Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Howard Computers
Description: Thermal Conductive Grease for Heatsink creates a thermal bond between CPU and heatsink for maximum cooling capacity.
- Compound Type: Thermally Conductive
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Supplier: Quist Electronics
Description: Provides a mechanical bond, eliminating the need for fasteners or screws
- Compound Type: Thermally Conductive
- Industry: Electronics, OEM / Industrial, Other
- Cure Type / Technology: Contact / Pressure Sensitive (PSA)
- Features: Electrical Insulation / Dielectric Material, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Interface (Thermally Conductive), UL Approved
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Supplier: Master Bond, Inc.
Description: , computer, construction, metal working, appliance, automotive and chemical industries where a high thermally conductive bond is desired. The cured compound fully meets the requirements of MIL-MMM-A-132 Type III.
- Form / Function: Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors)
- Industry Applications: Aerospace, Automotive, Military / Government (MIL-SPEC / GG), Other
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Ellsworth Adhesives
Description: ECCOBOND 285 is a highly filled, thermally conductive, thixotropic, non-sag epoxy adhesive paste; it has a low coefficient of thermal expansion and good bond strength.
- Compound Type: Thermally Conductive
- Industry: OEM / Industrial
- Features: Filled, Thermal / Heat Conductive
- Industry: OEM / Industrial
Find Suppliers by Category Top
Featured Products for Thermally Conductive Bonds Top
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Quist Electronics
Bergquist Sil Pad 1500T Thermally Conductive
Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Quist Electronics
Thermally Conductive, Liquid Gap Filler - Berquist
Gap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a twocomponent, room or elevated temperature curing system.The material is formulated to provide a balance of cured material properties highlighted by a low modulus and good compression set (memory).The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Arlon LLC
Secure™ 1500FG Thermally Conductive Adhesive
contractors. Secure ™ adhesives have been developed specifically for LED and Power applications where long-term reliability is a top concern. Secure ™ adhesives form chemical bonds with the substrates they are in contact with during cure to produce robust adhesion that is resistant to heat, humidity, and shock. This eliminates the need for mechanical fasteners and concern with screws coming loose, clips loosing clamping force, gap pads taking a compression set, or thermal greases... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC -
Quist Electronics
Bergquist (Thermal Conductive) Gap Filler 2000
Gap Filler 2000 is a high performance, thermally conductive, liquid gap filling material supplied as a two-component, room or elevated temperature curing system.The material provides a balance of cured material properties and good compression set (memory).The result is a soft, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, it flows under pressure like grease.After cure, it won't pump from... (read more)
Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist Liqui-Bond SA 1000
Features and Benefits. High thermal performance. Eliminates need for mechanical fasteners. Low viscosity for ease of screening or stenciling. Can achieve a very thin bond line. Mechanical and chemical stability. Maintains structural bond in severe-environment applications. Heat cure. Liqui-Bond SA 1000 is a thermally conductive, one-part liquid silicone adhesive with a low viscosity for easy screenability. Liqui-Bond SA 1000 features a high thermal performance and maintains it's structure even... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Conduct Research Top
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Thermally Conductive Adhesives Keep Things Cool
are an important. weapon in the war against heat raging within. today's powerful electronic devices. Master Bond Inc. 154 Hobart Street, Hackensack, NJ 07601 USA. Phone +1.201.343.8983 | Fax +1.201.343.2132 | WhitePaper@masterbond.com. T E C H S P O T L I G H T. Thermally Conductive. Adhesives Keep Things Cool
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative
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Managing Heat Transfer With Potting Compounds
and thermal expansion and more security and protection of intellectual property. A. thermally conductive adhesive will provide a permanent bond between a power supply or IC. and a heat sink. The selection of the appropriate thermally conductive potting solution involves many factors: · Temperature range
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Alternative Energy: Solar / Wind / Batteries
Alternative energy production requires a much broader and innovative use of materials, such as in solar, where there are semiconductors for photovoltaics (PV), enhanced thermally conductive materials for cooling PV materials, ceramic insulators and glasses for thin film solar cell panels. Warning
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Low Speed Carbon Deposition Process for Hermetic Optical Fibers (.pdf)
be necessary when working. the glass. The applied carbon layer is. with thermally-cured coatings that. typically thin (<100 nm), opaque, elec-. require a longer time to solidify on the. trically conductive, highly adherent to. fiber. Another limiting factor may be. the glass surface via chemical bonding
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A cleaner path to cool chips
package and the bottom surface of an attached heat sink. No matter how tightly the heat sink screws onto the processor, heat will not flow efficiently without a thermally conductive material sandwiched between. This is because tiny air gaps remain between the mating surfaces and air is a poor thermal
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Thermal Interface Materials - A Brief Overview
of thermally conductive interface material is necessary to fill the interstices between the mating surfaces. Moreover, to ensure that electrical problems are not inadvertently introduced while solving the thermal problems, it is often essential that these same thermal interface materials simultaneously
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Resistance Welding Fundamentals (.pdf)
brazing material, such as gold or solder, is used to join either. materials are also more thermally conductive and are softer. dissimilar materials or widely varied thick/thin material combinations. The. brazing material must "wet" to each part and possess a lower melting point than. These categories
Engineering Web Search: Thermally Conductive Bonds Top
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Conductive polymer - Wikipedia, the free encyclopedia
Conductive polymer From Wikipedia, the free encyclopedia (Redirected from Conductive polymers)
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Semiconductor - Wikipedia, the free encyclopedia
Because the conductive properties of a semiconductor can be modified by controlled addition of impurities or by the application of electrical fields
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Thermal Compound / Heat Conductive Rubber...
This thermally conductive adhesive bonds well in both shear and peel to similar and dissimilar surfaces including metals, woods, most plastics,...
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Thermal Compounds and Thermal Interface Materials Suppliers in...
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Btech Corp
Highly Electrically and Thermally Anisotropic Conductive Film Adhesives
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Bondline Electronic Adhesives
SMT TAPE HEADS WET COIL WINDING Adhesive by Properties ELECTRICALLY CONDUCTIVE FLEXIBLE HIGH TEMPERATURE RESISTANT LOW OUTGASSING LOW TEMPERATURE
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Thermally Conductive, Low Viscosity Epoxy Features Cryogenic...
Thermally Conductive, Low Viscosity Epoxy Features Cryogenic Serviceability
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Current and reliable Paints & Coatings news stories
Thermally Conductive Epoxy also offers electrical insulation."> Thermally Conductive Epoxy also offers electrical insulation.