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Thermally Conductive Epoxies
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Supplier: Epoxies Etc...Description: 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and is RoHS compliant.
- Compound Type: Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Material Form: Encapsulant / Potting Compound
- Polymer / Chemical Type: Silicone
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Supplier: Master Bond, Inc.Description: of properties including high thermal conductivity, excellent electrical insulation properties, good physical strength properties and a high degree of flexibility. EP37-3FLFAN has low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy. EP37-3FLFAN is also
- Compound Type: Electrically Conductive, Electrical Insulation / Dielectric Material
- Material Form: Conformal Coating, Die Bonding Adhesive / Compound, Encapsulant / Potting Compound, Gap Filling Compound
- Electrical / Electronics Applications: Electrical Power (Coils, Motors), Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Industry Applications: Automotive, OEM / Industrial, Other
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Supplier: Aremco Products, Inc.Description: thermal and electrical resistance, enable engineers to solve problems that were previously impossible using conventional epoxies and other organic-based products.
- Compound Type: Electrically Conductive, Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Hi-Tech Seals, Inc.Description: preparation and bond well to dirty and oily surfaces. Other acrylic features include the ability to bond a wide range of materials, excellent gap fills and fast fixturing times. HERNON® offers two families of acrylic adhesives: the ReAct® bonding systems, and the Dissipator® thermally conductive
- Substrate / Material Compatibility: Metal, Plastic
- Industry: OEM / Industrial
- Cure Type / Technology: Reactive / Moisture Cured, Two Component System
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Description: chemistry combines the low temperature performance characteristics heretofore found only in silicones with the excellent encapsulating properties of epoxies.
- Compound Type: Thermal Compound / Thermally Conductive
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Casting Resin
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxy TechnologyDescription: used epoxy; popular choice for non-silver-filled die-attach epoxies; opto-packaging, hybrids, and many types of substrates including kovar, ceramic and BT. Available in many different viscosity ranges – contact Technical Services at techserv@epotek.com for best recommendation Can be used
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Epoxies Etc...Description: 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and is RoHS compliant.
- Compound Type: Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...Description: 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and is RoHS compliant.
- Compound Type: Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...Description: 50-3107 is a two component potting and encapsulating compound. This system is designed to be self- extinguishing and meets the stringent requirements of UL 94-VO. 50-3107 is thermally conductive and is RoHS compliant.
- Compound Type: Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
Featured Products for Thermally Conductive Epoxies Top
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Product Description. 3M ™ Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. Key Features. Improved thermal conductivity. Curing performance comparable to 3M ™ Scotch-Weld ™ Epoxy Adhesive DP-460 and DP-460 EG. Lower outgassing than Scotch-Weld epoxy adhesive DP-460 or Scotch-Weld epoxy adhesive DP-460 EG. Lower chloride ion content than standard epoxies. Product Information: Adhesive, thermally conductive... (read more)Browse Acrylic Adhesives and Acrylate Adhesives Datasheets for Newark / element14 -
DESCRIPTION: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy... (read more)Browse Electrical and Electronic Resins Datasheets for Epoxies Etc... -
Epoxies etc...'s UL 94 V-O listed 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. It offers a unique combination of properties seldom seen in a Thermally Conductive Potting Compound. 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. Designing electronic assemblies with Epoxies, Etc...'s UL Listed 50-2369 FR Potting Compound... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder. Features: Electrically conductive. Thermally conductive. Room temperature cure. Easy 1:1 mix ratio. Good bond strength. Visit epoxies.com... (read more)Browse Conductive Compounds Datasheets for Epoxies Etc... -
LEDs - Standard Configurations. Bergquist offers a family of standard thermally conductive insulated metal substrate (IMS) circuit boards specifically for LED applications. Now you can get a jump-start on your design with one of these star or square substrates; available in single, strip or array configurations. (read more)Browse Light Emitting Diodes (LED) Datasheets for Quist Electronics -
48A43X008 functional product specifications: Flame Rating (UL94) V-0. Relative Thermal Index 150oC. Thermal Impedance (50oC, 3 MPa) 0.26 (in2-Co)/W. Dielectric Breakdown Strength 640 V/mil. Durometer (rubber only) 77 SAP. Operating Temperature -100 to 204oC. Evaluation samples are available from www.Arlon-STD.com. Ask for 48A43X008 or speak to a regional Sales Engineer for product recommendations specific to your unique application. (read more) -
Secure ™ 1500FG is an adhesive films composed of uncured silicone rubber with functional additives formulated to deliver a specific set of thermal, physical, and electrical properties. The form and function of Secure ™ is born from 60 years of silicone manufacturing knowledge and 20 years of experience formulating silicone adhesive systems under the Thermabond® brand for mission critical, high reliability, extreme environment applications for leading military, defense, and aerospace... (read more) -
Isopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar® Heat Pipe channels. Isopaste comes in three stock sizes ... 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab inside sales agent. Standard Terms and Conditions. A minimum order may apply. Quotes are valid for 30 days. Changes in quantities may affect pricing. Delivery times are based upon stock levels at time of... (read more)Browse Heat Pipes Datasheets for Acrolab Ltd. -
Gap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. Note: Resultant thickness is defined as the final gap thickness of the application. Features and Benefits. Thermal conductivity: 0.8 W/m-K. Enhanced puncture, shear... (read more)Browse Conductive Compounds Datasheets for Quist Electronics -
Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Parts by Number for Thermally Conductive Epoxies Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 7360882 | RS Components, Ltd. | Crydom | Solid State Relays | Product Index:DC Switching; Control Voltage:3.5 - 32 Vdc; Load Voltage:3 - 60 Vdc; Maximum Switching Current:7A; Mounting Type:Panel Mounting; Series:DC60 Series; Weight:86.5g; Operating Temperature Range:-30 - +80C; Housing Material:Thermally conductive Epoxy; Isolation Voltage:4000Vrms |
| 7360914 | RS Components, Ltd. | Crydom | Solid State Relays | Product Index:Instantaneous Switching; Control Voltage:90 - 280 Vac; Load Voltage:48 - 530 Vac; Maximum Switching Current:50A; Mounting Type:Surface; Housing Material:Thermally Conductive Epoxy; Isolation Voltage:4000Vrms; Minimum Load Current:40mA; Maximum Turn Off Time:40ms; Maximum Turn... |
| 7360911 | RS Components, Ltd. | Crydom | Solid State Relays | Product Index:Instantaneous Switching; Control Voltage:4 - 32 Vdc; Load Voltage:48 - 660 Vac; Maximum Switching Current:90A; Mounting Type:Panel Mounting; Operating Temperature Range:-40 - +80C; Housing Material:Thermally Conductive Epoxy; Isolation Voltage:4000Vrms; Minimum Load Current:150mA... |
| 7259971 | RS Components, Ltd. | Electrolube | PCB Compounds and Adhesives | Primary Application Category:Thermally conductive; Product Category:Thermally conductive epoxy; Pack Size:75ml; Pack Type:Syringe; Thermal Conductivity:2.2 W/mk |
| 832TC-2L | Allied Electronics, Inc. | MG CHEMICALS | Not Provided | Epoxy Compound; thermally conductive; 2 part; black; .5 gal liquid |
Conduct Research Top
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Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications (.pdf)
the adhesive to be both electrically conductive and thermally conductive. For potting applications, heat sinking, and general encapsulation where high electrical isolation is required, aluminum oxide has been the filler of choice. Today, advanced Boron Nitride filled epoxies challenge alternative...
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Managing Heat Transfer With Potting Compounds
are generally not a good choice. for addressing a heat transfer challenge in an electronic assembly such as a printed circuit. board with transformers or a power supply attached. Epoxies, Etc... incorporates non-. electrically conductive fillers in its epoxy, urethane and silicone formulations. Thermally...
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Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
as masked off saw streets and I/Os across the wafer. Thickness comparisons are made between the 2 methodologies. Thermally Conductive Epoxies SCREEN PRINTABLE POLYMERS FOR WAFER LEVEL PACKAGING: A TECHNOLOGY ASSESSMENT. James Clayton and Michael J. Hodgin. Polymer Assembly Technoloy, Epoxy...
Engineering Web Search: Thermally Conductive Epoxies Top
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Epoxies, Etc... - Epoxy, Urethane & Silicone Formulations Electrically Conductive Resins Thermally Conductive Resins Electrically Conductive Ink Water Resistant Potting Compound See Epoxies Etc... Profile & Catalog |
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Epoxies, Etc... - Thermally Conductive Electrically Conductive Resins Thermally Conductive Resins Find Epoxies On Thermally Conductive Resins See Epoxies Etc... Profile & Catalog |
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K.R. Anderson, Inc. - Thermally Conductive Browsing: Thermally Conductive Manufacturers See K.R. Anderson, Inc. Information |
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Epoxies for Electronics | Conductive Adhesives | Epoxies... Conductive Adhesives ? Electrically Conductive Coatings ? Potting Adhesive ? Silicones for Assembly ? Epoxies for Electronics ? Epoxies for See Polycast Industries, Inc. Information |
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Heat sink - Wikipedia, the free encyclopedia |
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Master Bond Thermally Conductive Compounds Master Bond manufactures both one and two component thermally conductive systems including epoxies, silicones and other elastomeric systems. See Master Bond, Inc. Profile & Catalog |
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Adhesives, Sealants, Coatings, Potting and Encapsulation... Thermally Conductive Other Properties Biocompatible Electrically Conductive Graphite Filled Adhesives See Master Bond, Inc. Profile & Catalog |
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Performance comparisons for electrically conductive epoxies in... Performance comparisons for electrically conductive epoxies in wireless applications |
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832 MG Thermally Conductive Epoxy - ABRA Electronics Inc. Epoxies 832 MG Thermally Conductive Epoxy 832 MG Thermally Conductive Epoxy Click to enlarge See ABRA Electronics, Inc. Information |
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Thermally Conductive Epoxies Thermally Conductive Epoxies and Thermally Conductive Grease Thermally Conductive Epoxies Click for larger image. See OMEGA Engineering, Inc. Profile & Catalog |
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