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Thermally Conductive Potting Compound
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Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product.
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Supplier: Master Bond, Inc.Description: superior resistance to a wide range of chemicals including water, oil, fuels, and some solvents over the temperature range of -60° to +250°F. A lower viscosity version called EP21ANLV is also available. The flowability of that system makes it an excellent thermally conductive potting compound.
- Compound Type: Electrically Conductive, Thermally Conductive
- Material Form: Grease / Paste, Gap Filling Compound, Specialty / Other
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Semiconductors / IC Packaging
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Supplier: GS Polymers, Inc.Description: Two part, 1:1, thermal conductive compound, available in cartridges
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Epoxies Etc...Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...Description: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Compound Type: Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
- Industry Applications: OEM / Industrial
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Supplier: Epoxies Etc...Description: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Compound Type: Thermal Compound / Thermally Conductive
- UL Approved: Yes
- Flame Retardant / UL 94V-0 Rated: Yes
- Material Form: Encapsulant / Potting Compound
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Supplier: Epoxies Etc...Description: 50-1225 is a low viscosity, room temperature curing, RTV silicone potting and encapsulating compound. When cured, this material forms a soft, highly flexible, flame retardant, and thermally conductive package.
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
- Industry: Electronics
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Supplier: Allied Electronics, Inc.Description: Encapsulatind and Potting Epoxy, 190 °C Flash Point, 1.80 Specific Gravity Provides excellent protection from impact, shock, conductivity, moisture, abuse, chemicals and analysis. Provides technology security. Excellent for explosion proof components. Use encapsulating and potting compound
- Material Form: Die Bonding Adhesive / Compound
- Polymer / Chemical Type: Epoxy (EP)
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Supplier: Ellsworth AdhesivesDescription: STYCAST 4954 is a RTV condensation cure, thermally conductive, silicone rubber potting compound. It yields a flexible, very thermally conductive material having excellent electrical properties and high temperature resistance. Sold as a pack (12/pk).
- Compound Type: Thermally Conductive
- Industry Applications: OEM / Industrial
- Chemical / Polymer System Type: Silicone
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Description: RTVS 920 is a two-component, low viscosity silicone that cures at room temperature to a transparent gel. It is supplied in a convenient kit with a 1:1 mix ratio by weight or volume.
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Silicone
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Supplier: Henkel Corporation - ElectronicsDescription: Superior environmental protection, extreme thermal cycling resistance
- Compound Type: Thermally Conductive
- Material Form: Conformal / Encapsulating Coating
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: OMEGA Engineering, Inc.Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products.
- Compound Type: Electrical Insulation / Dielectric Material, Thermal Compound / Thermally Conductive
- Material Form: Encapsulant / Potting Compound
- Polymer / Chemical Type: Silicone
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Supplier: Aremco Products, Inc.Description: High temperature, thermally conductive, low viscosity
- Material Form: Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors
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Supplier: Quist ElectronicsDescription: Specially formulated for use as a thermally conductive insulator
- Material Form: Composite, Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
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Supplier: Epoxy TechnologyDescription: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages
- Material Type: Grease / Paste
- Industry: Electronics, Semiconductors / IC Packaging
- Features: Electrical Insulation / Dielectric
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: of performance properties including high thermal conductivity, superior dimensional stability, physical properties, toughness and electrical insulation. EP30FLAO is a low viscosity epoxy with excellent flow characteristics making it ideal as a thermally conductive potting compound. EP30FLAO is also
- Coating Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Industry Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Aerospace, Automotive, OEM / Industrial, Other
- Flexible / Dampening: Yes
Featured Products for Thermally Conductive Potting Compound Top
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Epoxies etc...'s UL 94 V-O listed 50-2369 FR is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound available on the market today. It offers a unique combination of properties seldom seen in a Thermally Conductive Potting Compound. 50-2369 FR provides a quick heat dissipating system in a polyurethane chemistry, while also passing UL's 94 V-O self extinguishing test. Designing electronic assemblies with Epoxies, Etc...'s UL Listed 50-2369 FR Potting Compound... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
and encapsulating compounds: Electronic grade insulating. Thermally conductive. Flexible compounds for low stress on sensitive components. High temperature resistance. Low viscosity. UL rated compounds. Flame retardant compounds. Low density. DOT non-hazardous. Epoxies, Etc... is an ISO 9001:2000 registered company. (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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DESCRIPTION: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy... (read more)Browse Electrical and Electronic Resins Datasheets for Epoxies Etc...
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Get information about the latest materials for LED Lighting Assembly. Video, podcast, and literature links provide information on thermally conductive materials, optical encapsulants, and secondary optical molding materials. Ellsworth Adhesives. (read more)Browse Encapsulants and Potting Compounds Datasheets for Ellsworth Adhesives
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. Aremco-Bond tm 2315 is useful for potting and encapsulating densely packaged power supplies, rectifiers, integrated circuits, thick film hybrid devices, digital-analog converters, oscillators, amplifiers, relays, transformers, and semiconductors. Aremco-Bond tm 2315 is supplied in easy to mix pint, quart and gallon kits. (read more)Browse Specialty Adhesives, Sealants, and Compounds Datasheets for Aremco Products, Inc.
Parts by Number for Thermally Conductive Potting Compound Top
| Partb # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| 0283460 | RS Components, Ltd. | Acc Silicones | Potting Compounds | Primary Application Category:Thermally Conductive; Low Viscosity; Curing Type:2 Part; Material:Silicone; Pack Type:Twin Pack; Pack Size:250g; Colour:Grey; Temperature Range:-50 to 260C; Hardness:32 Shore A |
| 4480258 | RS Components, Ltd. | Acc Silicones | Potting Compounds | Primary Application Category:Thermally Conductive, Non-Corrosive, Electrical Resistance; Curing Type:1 Part; Material:Silicone; Pack Type:Cartridge; Pack Size:75ml; Hardness:55 IRHD; Temperature Range:-50 to 220C; Colour:White |
| 0552668 | RS Components, Ltd. | RS Components | Potting Compounds | Primary Application Category:Thermally Conductive; Curing Type:2 Part; Material:Epoxy; Pack Type:Twin Pack; Pack Size:250g; Hardness:D90Shore; Temperature Range:-40 - 110C; Curing Time at Room Temperature:8 to 24h; Colour:White |
| 0195984 | RS Components, Ltd. | RS Components | Potting Compounds | Primary Application Category:Thermally Conductive; Curing Type:2 Part; Material:Polyurethane; Pack Type:Twin Pack; Pack Size:250g; Curing Time at Room Temperature:8 to 24h; Hardness:A95Shore; Colour:Clear White; Temperature Range:-50 to 120C |
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
and require additional power to operate. Molded plastics are used in place of metal enclosures due to cost control and weight savings. In most cases, these plastics are not as effective at transferring heat away from its source. Thermally conductive potting compounds are an effective way to control
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The Coolest Compounds (.pdf)
Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today's electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovative, highly advanced solutions capable
Engineering Web Search: Thermally Conductive Potting Compound Top
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Thermally Conductive Polyurethane Potting Compound from...
Home > Company Directory > Epoxies Etc... > Thermally Conductive Polyurethane Potting Compound
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Thermal Compound / Interface (Thermally Conductive)...
Features: High Dielectric; Encapsulant, Potting Compound; Thermally Conductive
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Epoxies, Etc... - Epoxy, Urethane & Silicone Formulations
Electrically Conductive Ink Water Resistant Potting Compound Potting, Encapsulating and Casting Electrically Conductive Resins
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Epoxies, Etc... - Potting, Encapsulating & Casting Resins
Electrically Conductive Ink Water Resistant Potting Compound Thermally conductive polyurethane potting compound.
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Potting Compound withstands temperature extremes., Master...
Master Bond EP37-3FLFAN is a thermally conductive, electrically insulative potting compound. Thermally Conductive Adhesives Potting Compounds
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Current and reliable Adhesives & Sealants news stories
Thermally Conductive Epoxy also offers electrical insulation."> Thermally Conductive Epoxy also offers electrical insulation.
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Epoxies for Electronics | Conductive Adhesives | Epoxies...
Conductive Adhesives ? Electrically Conductive Coatings ? Potting Adhesive ? Silicones for Assembly ? Epoxies for Electronics ? Epoxies for
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Aavid Thermalloy - 100200F00000G - Chemicals - Chemicals &...
Products > Chemicals & Adhesives > Chemicals > Potting Compounds > 100200F00000G
- Epoxy Compounds - Chemicals from Allied Electronics
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ITW Insulcast | RTVS 3-95-2 Very Highly Thermally Conductive...
INSULCAST RTVS 3-95-2 Very Highly Thermally Conductive RTV Silicone Compound
