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Thermally Conductive Underfill
-related products, suppliers, datasheets and CAD.|
Product Announcements
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Epoxy Technology 
Quist Electronics 
Arlon LLC - Silicone Technologies Division 
MINTEQ® International Inc, Pyrogenics Group
Arlon LLC - Silicone Technologies Division
Quist Electronics |
Products/Services for Thermally Conductive Underfill
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Thermal Compounds and Thermal Interface Materials - (147 companies)Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product. Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate... Search by Specification | Learn More -
Electrical and Electronic Resins - (451 companies)...interference (RFI). They are also used in thick film metallization and to provide electrical interconnections at both the device and circuit board level. Thermally conductive electrical and electronic resins are applied between a heat-generating... Search by Specification | Learn More -
Encapsulants and Potting Compounds - (221 companies)...to form a thermally conductive layer between components or within a finished product. These thermally conductive products are used between a heat-generating electrical device and a heat sink to improve heat dissipation. There are many types of encapsulants... Search by Specification | Learn More -
Conductive Compounds - (156 companies)Conductive compounds provide an electrically and/or thermally conductive path between components. Electrically conductive compounds provide low resistivity and are used to prevent electrostatic discharge (ESD), electromagnetic interference (EMI... Search by Specification | Learn More -
Tempering Valves and Thermally Actuated Valves - (79 companies)Tempering valves and thermally actuated valves contain a thermal sensing component that opens or closes in response to temperature changes. They are used to regulate the temperature of hot water and prevent scalding. Thermally actuated valves... Search by Specification | Learn More -
Conformal Coatings - (128 companies)...interconnections at both the device and circuit board level. Thermally conductive conformal coatings are applied between a heat-generating electrical device and a heat sink in order to improve heat dissipation. They form a thermally conductive layer... Search by Specification | Learn More
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Thermal Insulation and Fireproofing Materials - (644 companies)Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials. There are four basic material types of thermal... Search by Specification | Learn More
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Printer and Copier Rollers - (36 companies)...include thermally conductive rollers and electrically conductive rollers. With thermally conductive rollers, the fuser roller transfers thermal energy both to the toner and to the paper. For best results, the silicone elastomer must have high thermal... Learn More
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Heat Sinks - (323 companies)Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel. Larger heat sinks hold... Search by Specification | Learn More
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Metallized and Coated Films - (95 companies)Metallized and coated films have a coating or thin metal film for decorative or functional applications. Search by Specification | Learn More
Product News for Thermally Conductive Underfill
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Quist Electronics
Thermally Conductive IMS for LED - BergquistLEDs - Standard Configurations. Bergquist offers a family of standard thermally conductive insulated metal substrate (IMS) circuit boards specifically for LED applications. Now you can get a jump-start on your design with one of these star or square substrates; available in single, strip or array configurations. (read more)Browse Light Emitting Diodes (LED) Datasheets for Quist Electronics -
Newark / element14
3M Thermally Conductive Epoxy AdhesiveProduct Description. 3M ™ Thermally Conductive Epoxy Adhesive TC-2810 is a boron nitride filled, two-part, thermally conductive epoxy adhesive. Key Features. Improved thermal conductivity. Curing performance comparable to 3M ™ Scotch-Weld ™ Epoxy Adhesive DP-460 and DP-460 EG. Lower outgassing than Scotch-Weld epoxy adhesive DP-460 or Scotch-Weld epoxy adhesive DP-460 EG. Lower chloride ion content than standard epoxies. Product Information: Adhesive, thermally conductive... (read more)Browse Acrylic Adhesives and Acrylate Adhesives Datasheets for Newark / element14 -
Arlon LLC - Silicone Technologies Division
Thermally Conductive Electrically Insulative TIM48A43X008 functional product specifications: Flame Rating (UL94) V-0. Relative Thermal Index 150oC. Thermal Impedance (50oC, 3 MPa) 0.26 (in2-Co)/W. Dielectric Breakdown Strength 640 V/mil. Durometer (rubber only) 77 SAP. Operating Temperature -100 to 204oC. Evaluation samples are available from www.Arlon-STD.com. Ask for 48A43X008 or speak to a regional Sales Engineer for product recommendations specific to your unique application. (read more) -
Epoxies Etc...
Thermally Conductive Polyurethane Potting CompoundDESCRIPTION: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy... (read more)Browse Electrical and Electronic Resins Datasheets for Epoxies Etc... -
Arlon LLC - Silicone Technologies Division
Secure™ 1500FG Thermally Conductive AdhesiveSecure ™ 1500FG is an adhesive films composed of uncured silicone rubber with functional additives formulated to deliver a specific set of thermal, physical, and electrical properties. The form and function of Secure ™ is born from 60 years of silicone manufacturing knowledge and 20 years of experience formulating silicone adhesive systems under the Thermabond® brand for mission critical, high reliability, extreme environment applications for leading military, defense, and aerospace... (read more) -
Acrolab Ltd.
Isopaste - Thermally Conductive Bridging CompoundIsopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar® Heat Pipe channels. Isopaste comes in three stock sizes ... 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab inside sales agent. Standard Terms and Conditions. A minimum order may apply. Quotes are valid for 30 days. Changes in quantities may affect pricing. Delivery times are based upon stock levels at time of... (read more)Browse Heat Pipes Datasheets for Acrolab Ltd. -
Quist Electronics
Gap Pad Thermally Conductive Gap Filling MaterialsGap Pad VO is a cost-effective, thermally conductive interface material.The material is a filled, thermally conductive polymer supplied on a rubber-coated fiberglass carrier allowing for easy material handling.The conformable nature of Gap Pad VO allows the pad to fill in air gaps between PC boards and heat sinks or a metal chassis. Note: Resultant thickness is defined as the final gap thickness of the application. Features and Benefits. Thermal conductivity: 0.8 W/m-K. Enhanced puncture, shear... (read more)Browse Conductive Compounds Datasheets for Quist Electronics -
Quist Electronics
Bergquist Sil Pad 1500T Thermally ConductiveBergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Quist Electronics
Thermally Conductive, Liquid Gap Filler - BerquistGap Filler 1000 is a thermally conductive, liquid gap filling material. It is supplied as a twocomponent, room or elevated temperature curing system.The material is formulated to provide a balance of cured material properties highlighted by a low modulus and good compression set (memory).The result is a soft, thermally conductive, form-in-place elastomer ideal for coupling "hot" electronic components mounted on PC boards with an adjacent metal case or heat sink. Before cure, Gap Filler 1000... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Quist Electronics
Bergquist Hi-Flow 650P - Thermally ConductiveFeatures and Benefits. Thermal Impedance: 0.20°C-in2/W (@25 psi). 150°C high temperature reliability. Natural tack one side for ease of assembly. Exceptional thermal performance in an insulated pad. Hi-Flow 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side.The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow 650P offers high temperature reliability ideal for automotive... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
Engineering Web Search: Thermally Conductive Underfill
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K.R. Anderson, Inc. - Thermally Conductive Browsing: Thermally Conductive Manufacturers See K.R. Anderson, Inc. Information |
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High thermally conductive and high reliability under-fill High thermally conductive and high reliability under-fill |
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Epoxy/h-BN composites for thermally conductive underfill... Epoxy/h-BN composites for thermally conductive underfill material |
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Home | AI Technology, Inc. Thermally conductive and/or electrically conductive adhesive tapes and pastes See AI Technology, Inc. Information |
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Thermal characterization of thermally conductive underfill for... Thermal characterization of thermally conductive underfill for a flip-chip package using novel temperature sensing technique |
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Georgia Tech :: Chemistry & Biochemistry :: Faculty :: C.... R. Bollampally, C.P. Wong, "Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging," IEEE |
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Browsing Polymers and Nano Science Chemistry by Title Comparative Study of Thermally Conductive Fillers for Use in Liquid Encapsulants for Electronic Packaging |
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MasterBond.com | Adhesives, Sealants & Coatings Thermally Conductive Other Properties Biocompatible Electrically Conductive Graphite Filled Adhesives See Master Bond, Inc. Profile & Catalog |
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Thermally Conductive Polymers--An Assessment of Technology... Thermal Characterization of Thermally Conductive Underfill for a Flip-Chip Package Using Novel Temperature Sensing Technique |
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Xilinx UG112 Device Package User Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . See Xilinx, Inc. Information |
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