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Thermally Insulating Compound
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Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
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Supplier: Epoxies Etc...Description: 50-3120 is a filled, single component, thermally conductive, electrically insulating epoxy system. This material is thixotropic and designed for the placement of SMD's on printed circuit boards or other substrates prior to wave soldering. It may also be used in heat sink applications.
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound, Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Sauereisen, Inc.Description: Sauereisen Electric Insulating Cement No. 12 is an inorganic cement used for applications requiring high dielectric strength and volume resistivity through 2200oF. No. 12 offers low shrinkage and coefficient of thermal expansion making it an excellent cement for bonding or potting high-alumina
- Material Type: Die Bonding Adhesive / Compound
- Industry: Electronics, Electrical Power / HV
- Features: Electrical Insulation / Dielectric
- Composition: Unfilled
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Supplier: Epoxy TechnologyDescription: EPO-TEK® T7110 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: Master Bond Polymer System 125 is a two component toughened epoxy resin for prolonged service above 500°F with truly outstanding chemical resistance. High strength bonds serviceable up to 600°F can be obtained with this exceptionally thermally stable and chemically resistant epoxy resin
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Form: Grease / Paste, Powder
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Epoxies Etc...Description: 50-3115 is a one part thermally conductive electrically insulating epoxy. This epoxy system is designed and engineered for demanding electronic bonding applications. It is formulated with low ionic high performance polymers and new proprietary thermally conductive fillers.
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Master Bond, Inc.Description: UV10LVDC compound can be used over the wide temperature range of -60°F to 300°F. For UV curing, the maximum absorption is found in the 320-360 nanometer range. Cures can also be effected by heating the UV10LVDC compound in an oven at 250°F for approximately 20 minutes. The dual cure
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
- Dissimilar Substrates: Yes
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, Military / Government (MIL-SPEC / GG), OEM / Industrial, Other
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
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Supplier: Aremco Products, Inc.Description: Low cte, good strength, tubes, vessels, sensors
- Compound Type: Thermally Conductive
- Material Form: Die Bonding Adhesive / Compound, Grease / Paste, Gap Filling Compound
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: BASF CorporationDescription: A 50% fiberglass reinforced injection molding PA6 compound
- Material Type / Grade: Composite Material, Thermoplastic, Thermoset
- Chemical / Polymer System Type: Polyamide / Nylon
- Filler Material: Fiber Glass
- Features: Thermally Insulating
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Supplier: Saint-Gobain Oil & GasDescription: The Meldin 2030 bearing compound operates with extremely low friction in both dynamic and static applications and provides thermal and electrical insulation.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Polyimide
- Filler Material: Other
- Features: Thermally Insulating
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Electrical and Electronic Resins - Loctite 315 Thermally Conductive Adhesive 25ml Cartridge -- 31520Supplier: Ellsworth AdhesivesDescription: LOCTITE 315 is a self-shimming thermally conductive, one part adhesive for bonding electrical components to heat sinks with an insulating gap. This item does not ship on Fridays! Required Activator 7387: 20263 13ml yellow or 18861 1.75oz amber
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Semiconductors / IC Packaging
- Polymer / Chemical Type: Acrylic / Polyacrylate
- Filler Material: Unfilled
Featured Products for Thermally Insulating Compound Top
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Extinguishing- This is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound. 50-2369 FR has been tested to Underwriter Laboratories (UL) stringent flame retardant UL 94 V-O test. The listing of this product is under UL File Number E235584. Electrically Insulating- 50-2369 FR provides excellent electrical insulation properties. It therefore protects assemblies and components while helping to maintain the assemblies electrical integrity. The benefits of this breakthrough... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
and encapsulating compounds: Electronic grade insulating. Thermally conductive. Flexible compounds for low stress on sensitive components. High temperature resistance. Low viscosity. UL rated compounds. Flame retardant compounds. Low density. DOT non-hazardous. Epoxies, Etc... is an ISO 9001:2000 registered company. (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
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Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics
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48A43X008 functional product specifications: Flame Rating (UL94) V-0. Relative Thermal Index 150oC. Thermal Impedance (50oC, 3 MPa) 0.26 (in2-Co)/W. Dielectric Breakdown Strength 640 V/mil. Durometer (rubber only) 77 SAP. Operating Temperature -100 to 204oC. Evaluation samples are available from www.Arlon-STD.com. Ask for 48A43X008 or speak to a regional Sales Engineer for product recommendations specific to your unique application. (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
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pumping out. Secure ™ adhesives are electrically insulating to isolate your LED PCB or power transistor from the heat sink. Secure ™ adhesives are UL listed with a UL94 V-0 flame rating and a 150oC relative thermal index (RTI) for both mechanical and electrical. Additionally, Secure ™ adhesives are RoHS compliant and free of halogenated flame retardants. Secure ™ 1500FG is a fiberglass reinforced adhesive film supplied in 7 or 9 mil standard thicknesses. The addition... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
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Thermally Conductive, Silicone-Free Gap Filling Material. Features and Benefits. Thermal conductivity: 0.9 W/m-K. No silicone outgassing. No silicone extraction. Reduced tack on one side to aid in application assembly. Electrically isolating. The new Gap Pad 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF... (read more)Browse Leveling and Filling Compounds Datasheets for Quist Electronics
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e.g. 1 hour at 250°F (125°C) or 30-40 minutes at 300°F (150°C). Also, squeeze out during bonding is almost non-existent. While FL901AO exhibits a thermal conductivity on a level of 10 BTU •in/ft²hr°F, it is highly electrically insulating, with volume resistivity exceeding 10x1012 ohm-cm. The properties of FL901AO are substantially maintained over a wide temperature range from -100°F to 400°F and upon prolonged exposure to harsh environmental conditions such as moisture, heat and other... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Master Bond, Inc.
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Silicone rubber is a unique elastomer that delivers high performance electrical insulation in both low temperature and high temperature environments. Silicone rubber is particularly useful as a Thermal Interface Material (TIM). TIMs typically take the form of thermally conductive compositions which utilize silicone rubber as the continuous phase, and which are used to facilitate heat transfer between two opposing surfaces. For example, in the fabrication of semiconductor devices, TIMs... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC - Silicone Technologies Division
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both thermally and electrically, they provide excellent thermal insulating properties in extreme cold and help resist additional heat loads in the summer from ultraviolet exposure. While heat transfer of steel is higher than with composites, this is the opposite of what is needed when using trying to keep equipment within the enclosure warm in the winter. Additionally, in the summer months of high solar loading, the transfer of UV energy converted to heat energy to the interior can happen more... (read more)Browse Electronic and Instrument Enclosures Datasheets for Stahlin Enclosures
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Extinguishing- This is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound. 50-2369 FR has been tested to Underwriter Laboratories (UL) stringent flame retardant UL 94 V-O test. The listing of this product is under UL File Number E235584. Electrically Insulating- 50-2369 FR provides excellent electrical insulation properties. It therefore protects assemblies and components while helping to maintain the assemblies electrical integrity. The benefits of this breakthrough... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc...
Engineering Web Search: Thermally Insulating Compound Top
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Thermal Compound / Thermally Conductive...
GlobalSpec Electronics > Datasheets > Encapsulants and Potting Compounds > Thermal Compound / Thermally Conductive
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Thermal Compound / Interface (Thermally Conductive)...
Home > Datasheets > Industrial Sealants > Thermal Compound / Interface (Thermally Conductive)
- Silicon - Wikipedia, the free encyclopedia
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MOSFET - Wikipedia, the free encyclopedia
The gate is separated from the body by an insulating layer (white)
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METHOD FOR MANUFACTURING COMPOUND MATERIAL WAFER AND...
The invention relates to methods for manufacturing compound material wafers, in particular silicon on insulator wafers, by the steps of providing a
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Application Note AN-1012 Mounting Considerations for...
Phase Change grease loaded with electrically insulating, Compound Thermal Isolating 1.6oC/W thermally conductive material such as alumina.
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Thermal Grease - Cooler Master - Leading Provider of Computer...
Thermal Compound Accessories » Case Ultra Tower
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ITW Insulcast - ITW Polymer Technologies
Insulcast epoxies are thermally conductive & electrically insulating.
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ITW Insulcast - ITW Polymer Technologies
Insulcast epoxies are thermally conductive and electrically insulating.
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No Job Name
2003, 42, 7951-7958 Synthesis and Characterization of Volatile, Thermally Stable, Reactive Transition Metal Amidinates Booyong S. Lim, Antti Rahtu,
