Products & Services
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- UL Approved: Yes
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame
- Material Type / Grade: Thermoset
- Filler Material: Unfilled
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive, UL Approved
- Industry: Electronics
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Supplier: OMEGA Engineering, Inc.
Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
- Features: Thermal / Heat Conductive, Electrically Insulating / Dielectric, Encapsulating / Potting
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
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Supplier: Epoxy Technology
Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Features: Optical Grade
- Industry: Optoelectronics, Semiconductor / IC's
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Supplier: Protavic America, Inc.
Description: Clear formulations, made with electronics-grade raw materials
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Filled, Thermal / Heat Conductive
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Supplier: Sauereisen, Inc.
Description: Sauereisen Electric Insulating Cement No. 12 is an inorganic cement used for applications requiring high dielectric strength and volume resistivity through 2200oF. No. 12 offers low shrinkage and coefficient of thermal expansion making it an excellent cement for bonding or potting high-alumina
- Material Type: Die Bonding Adhesive / Compound
- Industry: Electronics, Electrical Power / HV
- Features: Electrical Insulation / Dielectric
- Composition: Unfilled
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Supplier: Master Bond, Inc.
Description: to 500°F for limited time periods and 400°-450°F for prolonged exposures. It is also available in one component and thermally conductive versions. EP121CL has excellent optical clarity and can be used in optical and fiberoptic applications. The mixed compound (based on mixing 100 parts
- Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Electronics, Electrical Power / HV, Optoelectronics / Photonics
- Composition: Two Component System, Unfilled
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Supplier: Epoxy Technology
Description: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Semiconductors / IC Packaging, Electronics
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Supplier: Master Bond, Inc.
Description: of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AOSP is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy
- Use: Die Bonding Adhesive / Compound, Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Semiconductors / IC Packaging, Electronics, Electrical Power / HV
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Supplier: Epoxy Technology
Description: Thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications.
- Material Type: Grease / Paste
- Industry: Electronics
- Features: Electrical Insulation / Dielectric
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Digi-Key Corporation
Description: TAPE MASTIC COMPOUND 1" X 10'
- Features: Thermally Insulating / Insulative
- Type: Industrial Tape
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Description: Highly Thermally Conductive RTV Silicone Compound Specifically Formulated for Applications Requiring Very High Thermal Conductivity, Superior Performance Over a Wide Temperature Range and Ease of Use
- Coating Type: Electrically Conductive, Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Industry Applications: Electronics (PCB / SMT Assembly)
- UL Approved: Yes
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Supplier: Protavic America, Inc.
Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.
- Substrate / Material Compatibility: Ceramic / Glass
- Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Features: Optical Grade, Thermally Insulating
- Industry: Aerospace, Automotive, Electronics, Electric Power, Semiconductor / IC's, Composite Structures, Marine, Industrial, Building / Construction, Tooling / Molds, Other
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Supplier: Quist Electronics
Description: Thermally conductive insulation for clip-mounted plastic power packages
- Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
- Industry: Electronics, OEM / Industrial, Semiconductors / IC Packaging, Other
- Chemical / Polymer System Type: Silicone
- Features: Thermal / Heat Conductive, UL Approved, Electrically Insulating / Dielectric, Flame Retardant (e.g. UL 94 Rated)
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Supplier: BASF Corporation
Description: A 50% fiberglass reinforced injection molding PA6 compound
- Chemical / Polymer System Type: Polyamide / Nylon
- Filler Material: Fiber Glass
- Features: Thermally Insulating
- Industry: Automotive, Electronics, Industrial, Building / Construction
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Supplier: Epoxy Technology
Description: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages
- Substrate / Material Compatibility: Metal, Plastic
- Industry: Electronics, Semiconductors / IC Packaging
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
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Supplier: Saint-Gobain Oil & Gas
Description: The Meldin 2030 bearing compound operates with extremely low friction in both dynamic and static applications and provides thermal and electrical insulation.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Polyimide
- Filler Material: Other
- Features: Thermally Insulating
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Supplier: Bluestar Silicones USA Corp.
Description: White, Semi-Thixotropic, Two-Component, Aerospace Compound Properties Viscosity 450000 Hardness Sha 76 Description Bluesil V-658 is a white, semi-thixotropic, two component, addition cure aerospace compound developed for applications where a flame-resistant thermal barrier or ablation
- Filler Material: Unfilled
- Compound Type: Pellets
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Insulating
- Industry: Aerospace
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass. Upon
- Substrate / Material Compatibility: Ceramic / Glass, Metal
- Industry: Automotive, OEM / Industrial, Other
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Water Based / Latex Dispersion: Yes
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Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly
- Material Type / Grade: Elastomer / Rubber, Thermoset
- Chemical / Polymer System Type: Silicone
- Filler Material: Unfilled
- Resins & Compounds: Liquid
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Description: 3M™ Fluorinert™ Electronic Liquid FC-40 is a clear, colorless, thermally stable, fullyfluorinated liquid ideal for use in many single phase heat transfer applications in the semiconductor manufacturing industry. Its liquid range (-57°C to 165°C) makes it ideal for a variety
- Type / Function: Circulating Coolant (Anti-freeze / Secondary Refrigerant), Dielectric (Transformer / EDM), Heat Transfer Fluid, Specialty / Other
- Composition / Chemistry: Synthetic / Semi-synthetic
- Chemistry / Constituents: CFC / Chlorofluorocarbon
- Applications: Electrical / Electronic
Find Suppliers by Category Top
Featured Products for Thermally Insulating Compound Top
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Quist Electronics
Bergquist Sil Pad 1500T Thermally Conductive
Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Arlon LLC
Thermally Conductive Electrically Insulative TIM
48A43X008 functional product specifications: Flame Rating (UL94) V-0. Relative Thermal Index 150oC. Thermal Impedance (50oC, 3 MPa) 0.26 (in2-Co)/W. Dielectric Breakdown Strength 640 V/mil. Durometer (rubber only) 77 SAP. Operating Temperature -100 to 204oC. Evaluation samples are available from www.Arlon-STD.com. Ask for 48A43X008 or speak to a regional Sales Engineer for product recommendations specific to your unique application. (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC -
Arlon LLC
Secure™ 1500FG Thermally Conductive Adhesive
pumping out. Secure ™ adhesives are electrically insulating to isolate your LED PCB or power transistor from the heat sink. Secure ™ adhesives are UL listed with a UL94 V-0 flame rating and a 150oC relative thermal index (RTI) for both mechanical and electrical. Additionally, Secure ™ adhesives are RoHS compliant and free of halogenated flame retardants. Secure ™ 1500FG is a fiberglass reinforced adhesive film supplied in 7 or 9 mil standard thicknesses. The addition... (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Arlon LLC -
Quist Electronics
Bergquist Gap Pad 1000SF
Thermally Conductive, Silicone-Free Gap Filling Material. Features and Benefits. Thermal conductivity: 0.9 W/m-K. No silicone outgassing. No silicone extraction. Reduced tack on one side to aid in application assembly. Electrically isolating. The new Gap Pad 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad 1000SF... (read more)
Browse Leveling and Filling Compounds Datasheets for Quist Electronics
Conduct Research Top
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Thermally Conductive Adhesives Keep Things Cool
,. system. And remember that thermal adhesives or potting. potted components may have to withstand some level of. compounds do eliminate another troublesome insulator--. stress and strain during the manufacturing process and in. the thermally insulating air gaps that would otherwise exist. use
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Highly Conductive Insulation for Large, High-Speed Machines
. packing-effect in the siloxane matrix and. operational integrity above 180°C. The goal. incorporating highly thermally conductive. of utilizing this type of stator-conductor. yet cost-effective reinforcing filler is. insulating system is reduced coil. necessary to balance improvements in. temperature
Engineering Web Search: Thermally Insulating Compound Top
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Thermal Compound / Thermally Conductive...
GlobalSpec Electronics > Datasheets > Encapsulants and Potting Compounds > Thermal Compound / Thermally Conductive
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Thermally Insulating Resins and Compounds Datasheets
Home > Datasheets > Resins and Compounds > Thermally Insulating Thermally Insulating Resins and Compounds Datasheets
- Silicon - Wikipedia, the free encyclopedia
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MOSFET - Wikipedia, the free encyclopedia
The gate is separated from the body by an insulating layer (white)
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Application Note AN-1012 Mounting Considerations for...
Phase Change grease loaded with electrically insulating, Compound Thermal Isolating 1.6oC/W thermally conductive material such as alumina.
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Xilinx UG112 Device Package User Guide
. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . .
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METHOD AND DEVICE FOR PREPARING A PASTE-LIKE COMPOUND FOR...
Patent application title: METHOD AND DEVICE FOR PREPARING A PASTE-LIKE COMPOUND FOR SEALING AN INSULATING GLASS PANE
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METHOD FOR MANUFACTURING COMPOUND MATERIAL WAFER AND...
The invention relates to methods for manufacturing compound material wafers, in particular silicon on insulator wafers, by the steps of providing a
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CLASS 438 SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS 438 - 1...
material removal semiconductor region 14 WITH MEASURING OR TESTING 46 .Compound semiconductor 15 .Packaging (e.g., with mounting, 47 ..Heterojunction
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Class Schedule for Class 438 SEMICONDUCTOR DEVICE...
Compound semiconductor 47 Heterojunction Thermally responsive