Thermally Insulating Compound

Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame

• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Form / Function: Encapsulant / Potting Compound
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• UL Approved: Yes

Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK E products are flame

• Material Type / Grade: Thermoset
• Filler Material: Unfilled
• Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive, UL Approved
• Industry: Electronics

Description: OMEGABOND epoxy and OMEGATHERM thermal conducting paste are easy to use epoxies and silicone products. They are specially formulated for permanent bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals, ceramics, glass, plastics, paper products.

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Features: Thermal / Heat Conductive, Electrically Insulating / Dielectric, Encapsulating / Potting
• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive

Description: EPO-TEK® 354 is a two component, high Tg epoxy designed for semiconductor packaging in medical, fiber optic and optoelectronic assemblies. It is an electrically and thermally insulating epoxy.

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Features: Optical Grade
• Industry: Optoelectronics, Semiconductor / IC's

Description: Clear formulations, made with electronics-grade raw materials

• Substrate / Material Compatibility: Ceramic / Glass, Metal
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Features: Electrical Insulating / Dielectric, Encapsulating / Potting, Filled, Thermal / Heat Conductive

Description: Sauereisen Electric Insulating Cement No. 12 is an inorganic cement used for applications requiring high dielectric strength and volume resistivity through 2200oF. No. 12 offers low shrinkage and coefficient of thermal expansion making it an excellent cement for bonding or potting high-alumina

• Material Type: Die Bonding Adhesive / Compound
• Industry: Electronics, Electrical Power / HV
• Features: Electrical Insulation / Dielectric
• Composition: Unfilled

Description: to 500°F for limited time periods and 400°-450°F for prolonged exposures. It is also available in one component and thermally conductive versions. EP121CL has excellent optical clarity and can be used in optical and fiberoptic applications. The mixed compound (based on mixing 100 parts

• Chemical / Polymer System Type: Epoxy (EP), Specialty / Other
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: Electronics, Electrical Power / HV, Optoelectronics / Photonics
• Composition: Two Component System, Unfilled

Description: A single component, high Tg, thermally conductive, electrically insulating epoxy adhesive for semiconductor, microelectronic, and opto-electronic packaging applications.

• Form: Grease / Paste
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: Semiconductors / IC Packaging, Electronics

Description: of performance properties including high thermal conductivity, excellent electrical insulation characteristics and superior dimensional stability, as well as good physical strength properties. EP30AOSP is low viscosity with excellent flow characteristics making it ideal as a thermally conductive potting epoxy

• Use: Die Bonding Adhesive / Compound, Conformal Coating, Encapsulant / Potting Compound, Gap Filling Compound
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking
• Industry: Semiconductors / IC Packaging, Electronics, Electrical Power / HV

Description: Thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation. Also ideal for large volume potting applications.

• Material Type: Grease / Paste
• Industry: Electronics
• Features: Electrical Insulation / Dielectric
• Chemical / Polymer System Type: Epoxy (EP)

Description: TAPE MASTIC COMPOUND 1" X 10'

• Features: Thermally Insulating / Insulative
• Type: Industrial Tape

Description: Highly Thermally Conductive RTV Silicone Compound Specifically Formulated for Applications Requiring Very High Thermal Conductivity, Superior Performance Over a Wide Temperature Range and Ease of Use

• Coating Type: Electrically Conductive, Electrical Insulation / Dielectric, Thermal / Heat Insulating
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Industry Applications: Electronics (PCB / SMT Assembly)
• UL Approved: Yes

Description: Non-Conductive Coating for Bonding of Stacked Wafers. This material is perfectly adapted for high reliable ceramic attaching applications. Ideal for screen printing.

• Substrate / Material Compatibility: Ceramic / Glass
• Industry: Electronics, Electrical Power / HV, OEM / Industrial, Semiconductors / IC Packaging, Other
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100% reactive

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Epoxy
• Features: Optical Grade, Thermally Insulating
• Industry: Aerospace, Automotive, Electronics, Electric Power, Semiconductor / IC's, Composite Structures, Marine, Industrial, Building / Construction, Tooling / Molds, Other

Description: Thermally conductive insulation for clip-mounted plastic power packages

• Substrate / Material Compatibility: Ceramic / Glass, Composites, Metal, Plastic
• Industry: Electronics, OEM / Industrial, Semiconductors / IC Packaging, Other
• Chemical / Polymer System Type: Silicone
• Features: Thermal / Heat Conductive, UL Approved, Electrically Insulating / Dielectric, Flame Retardant (e.g. UL 94 Rated)

Description: A 50% fiberglass reinforced injection molding PA6 compound

• Chemical / Polymer System Type: Polyamide / Nylon
• Filler Material: Fiber Glass
• Features: Thermally Insulating
• Industry: Automotive, Electronics, Industrial, Building / Construction

Description: A two component, high Tg, electrically insulating, thermally conductive epoxy designed for thermal management applications found in semiconductor, hybrid microelectronics, PCB, and optical industries. It can be an adhesive for mounting heat sinks and substrates, a seal for many types of packages

• Substrate / Material Compatibility: Metal, Plastic
• Industry: Electronics, Semiconductors / IC Packaging
• Chemical / Polymer System Type: Epoxy (EP)
• Filled / Reinforced: Yes

Description: The Meldin 2030 bearing compound operates with extremely low friction in both dynamic and static applications and provides thermal and electrical insulation.

• Material Type / Grade: Thermoset
• Chemical / Polymer System Type: Polyimide
• Filler Material: Other
• Features: Thermally Insulating

Description: White, Semi-Thixotropic, Two-Component, Aerospace Compound Properties Viscosity 450000 Hardness Sha 76 Description Bluesil V-658 is a white, semi-thixotropic, two component, addition cure aerospace compound developed for applications where a flame-resistant thermal barrier or ablation

• Filler Material: Unfilled
• Compound Type: Pellets
• Features: Flame Retardant (e.g. UL 94 Rated), Thermally Insulating
• Industry: Aerospace

Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and glass. Upon

• Substrate / Material Compatibility: Ceramic / Glass, Metal
• Industry: Automotive, OEM / Industrial, Other
• Chemical / Polymer System Type: Ceramic / Inorganic Cement
• Water Based / Latex Dispersion: Yes

Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly

• Material Type / Grade: Elastomer / Rubber, Thermoset
• Chemical / Polymer System Type: Silicone
• Filler Material: Unfilled
• Resins & Compounds: Liquid

Description: 3M™ Fluorinert™ Electronic Liquid FC-40 is a clear, colorless, thermally stable, fullyfluorinated liquid ideal for use in many single phase heat transfer applications in the semiconductor manufacturing industry. Its liquid range (-57°C to 165°C) makes it ideal for a variety

• Type / Function: Circulating Coolant (Anti-freeze / Secondary Refrigerant), Dielectric (Transformer / EDM), Heat Transfer Fluid, Specialty / Other
• Composition / Chemistry: Synthetic / Semi-synthetic
• Chemistry / Constituents: CFC / Chlorofluorocarbon
• Applications: Electrical / Electronic