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Thermally Insulating Molding Compound
-related products, suppliers, datasheets and CAD.|
Product Announcements
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ELANTAS PDG, Inc. 
ELANTAS PDG, Inc. 
ELANTAS PDG, Inc. 
Epoxies Etc...
Pavco, Inc.
Pittsburgh Corning (FOAMGLAS® insulation) |
Products/Services for Thermally Insulating Molding Compound
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No Image AvailableInsulating Varnishes and Impregnating Resins - (22 companies)Insulating varnishes and impregnating resins are designed for applications that require a low-viscosity resin or varnish for coil impregnation or magnet wire coating insulation. The resin may infiltrate the coil or electrical device through dipping... Search by Specification | Learn More
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Encapsulants and Potting Compounds - (221 companies)...and potting compounds. Common potting compounds and casting resins are used to fill compartments or pockets that contain electronic components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Molding... Search by Specification | Learn More -
Conductive Compounds - (156 companies)...and casting resins, molding and potting compounds, greases and pastes, encapsulants, and conformal coatings. There are many chemical systems and filler materials for conductive compounds. Some chemical systems contain acrylics, elastomers, natural... Search by Specification | Learn More -
Thermal Compounds and Thermal Interface Materials - (147 companies)...components. Encapsulants seal or cover circuits; typically, encapsulant layers are less than 100 mils thick. Double-sided thermal interface tapes and pads, substrates, and shapes are often used as electrical insulators. Molding compounds... Search by Specification | Learn More -
Thermal Insulation and Fireproofing Materials - (644 companies)Thermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials. There are four basic material types of thermal... Search by Specification | Learn More -
Electrical and Electronic Resins - (451 companies)Electrical and electronic resins includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor... Search by Specification | Learn More
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Electrical Insulation and Dielectric Materials - (530 companies)...products. Lubricants, metal working fluids, molding compounds, non-woven products, plates or boards, and polymers are also available. In addition, electrical insulation and dielectric materials may come as potting compounds, powders or grains, precursors... Search by Specification | Learn More
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Industrial Ceramic Materials - (386 companies)How to Select Industrial Ceramic Materials. Industrial ceramic materials are non-metallic, inorganic compounds that include oxides, carbides, or nitrides. They have high melting points, low wear resistance, and a wide range of electrical properties... Search by Specification | Learn More
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Dielectric Ceramics and Substrates - (148 companies)Dielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications. Search by Specification | Learn More
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Molding Compounds and Resins - (284 companies)How to Select Molding Compounds and Resins. Molding compounds and resins are industrial plastics and polymers that are suitable for forming. They are used in injection molding, compression molding, reaction injection molding (RIM), resin transfer... Search by Specification | Learn More
Product News for Thermally Insulating Molding Compound
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Trelleborg Offshore
Thermally Insulating MicrospheresThermal Insulation. Glass and ceramic microspheres are closed-cell, hollow particles that are extremely good insulators. They are used in high temperature applications to protect valuable equipment. The ability to control particle density, size and distribution allows the developer to control the insulation factor of material using glass and ceramic microballoons. The 'flowability' of the product allows for excellent coverage with spray application. (read more)Browse Composite Fillers and Reinforcements Datasheets for Trelleborg Offshore -
Acrolab Ltd.
Isopaste - Thermally Conductive Bridging CompoundIsopaste is a high-temperature thermal bridging compound used in Acrolab's Isoplatens and Heat Transfer Tools to act as a heat conductor in the Isobar® Heat Pipe channels. Isopaste comes in three stock sizes ... 4oz., 8oz., and 16oz. cans. Larger quantities can be arranged with your Acrolab inside sales agent. Standard Terms and Conditions. A minimum order may apply. Quotes are valid for 30 days. Changes in quantities may affect pricing. Delivery times are based upon stock levels at time... (read more)Browse Heat Pipes Datasheets for Acrolab Ltd. -
Epoxies Etc...
Thermally Conductive Polyurethane Potting CompoundDESCRIPTION: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical properties. This system is a good choice for potting applications containing surface mount components or any application requiring low stress, thermal conductivity and flame retardancy... (read more)Browse Electrical and Electronic Resins Datasheets for Epoxies Etc... -
Epoxies Etc...
Thermally Conductive UL 94 V-O Potting CompoundExtinguishing- This is the fastest self extinguishing Thermally Conductive Polyurethane Potting Compound. 50-2369 FR has been tested to Underwriter Laboratories (UL) stringent flame retardant UL 94 V-O test. The listing of this product is under UL File Number E235584. Electrically Insulating- 50-2369 FR provides excellent electrical insulation properties. It therefore protects assemblies and components while helping to maintain the assemblies electrical integrity. The benefits of this breakthrough... (read more)Browse Encapsulants and Potting Compounds Datasheets for Epoxies Etc... -
ITW Polymer Technologies - Insulcast Division
Highly Thermally Conductive RTVS 3-95-2 CompoundINSULCAST RTVS 3-95-2. is a very highly thermally conductive, high temperature RTV silicone compound which meets the flammability requirements of UL 94V-0. Uncured Properties: Part A, Part B. COLOR, VISUAL: Red, Neutral. VISCOSITY @ 25oC, cps: 35000, 35000 -ASTM D 2393. SPECIFIC GRAVITY: 2.36, 2.27. MIX RATIO (by weight or volume): 1:1. MIXED VISCOSITY, cps: 35000 ASTM D 2393. Gel Time, 25ºC, hours 2-4. POT LIFE @25ºC, hours 1.5. SHELF LIFE @25ºC, months: 12. Cured Properties. HARDNESS... (read more)Browse Silicone Adhesives and Sealants Datasheets for ITW Polymer Technologies - Insulcast Division -
Arlon LLC - Silicone Technologies Division
Thermally Conductive Electrically Insulative TIM48A43X008 functional product specifications: Flame Rating (UL94) V-0. Relative Thermal Index 150oC. Thermal Impedance (50oC, 3 MPa) 0.26 (in2-Co)/W. Dielectric Breakdown Strength 640 V/mil. Durometer (rubber only) 77 SAP. Operating Temperature -100 to 204oC. Evaluation samples are available from www.Arlon-STD.com. Ask for 48A43X008 or speak to a regional Sales Engineer for product recommendations specific to your unique application. (read more) -
Arlon LLC - Silicone Technologies Division
Secure™ 1500FG Thermally Conductive Adhesivepumping out. Secure ™ adhesives are electrically insulating to isolate your LED PCB or power transistor from the heat sink. Secure ™ adhesives are UL listed with a UL94 V-0 flame rating and a 150oC relative thermal index (RTI) for both mechanical and electrical. Additionally, Secure ™ adhesives are RoHS compliant and free of halogenated flame retardants. Secure ™ 1500FG is a fiberglass reinforced adhesive film supplied in 7 or 9 mil standard thicknesses. The addition... (read more) -
Quist Electronics
Bergquist Sil Pad 1500T Thermally ConductiveBergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates. Sil Pad 1500T. Thermal impedance: 0.23°C-in²/W (@50 psi). Inherent surface tack on both sides. Pad is re-positionable. Excellent thermal performance... (read more)Browse Thermal Compounds and Thermal Interface Materials Datasheets for Quist Electronics -
Plastics Color Corporation
Custom Molding Compounds and ResinsPlastics Color Corporation (PCC), headquartered in Calumet City, Illinois, is a global provider of custom polymer compounds, solutions, colorants, and additive masterbatches in an extensive range of markets; from pharmaceuticals packaging to medical devices to consumer packaging to sporting goods and many more. (read more) -
Trelleborg Offshore
Electrically Insulating/Low Dielectric MicrosphereEccospheres® glass microspheres are hollow thin-walled glass microspheres composed of sodium-depleted borosilicate glass. To the naked eye they resemble a fine, white, free-flowing powder. However, magnification reveals them to be near perfect spheres. Due to their exclusive glass chemistry Eccospheres® glass microspheres exhibit superior dielectric properties (dielectric constants ranging from 1.1 to 1.6 depending on grade). Trelleborg's own microsphere containing composites (the TG syntactic... (read more)Browse Glass Powders and Precursors Datasheets for Trelleborg Offshore
Engineering Web Search: Thermally Insulating Molding Compound
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Silicon - Wikipedia, the free encyclopedia |
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Mica - Wikipedia, the free encyclopedia The leading use of dry-ground mica in the US was in joint compound for filling and finishing seams and blemishes in gypsum wallboard (drywall). The |
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Xilinx UG112 Device Package User Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Cavity-Down Thermally Enhanced BGA Packages . . . . . . . . . . . . . . . . . . . . . . . . See Xilinx, Inc. Information |
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SAE Standards Works Compound, Insulating And Sealing Silicone (Cancelled Oct 1995) Compound, Zinc Chromate, Slushing (Cancelled Oct 1945) See SAE International Information |
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SAE Standards Compound, Insulating And Sealing Silicone (Cancelled Oct 1995) Compound, Zinc Chromate, Slushing (Cancelled Oct 1945) See SAE International Information |
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Class 438: SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS (... . Compound semiconductor 47 . . Heterojunction |
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END COVER ASSEMBLY FOR AN ELECTROCHEMICAL CELL - Patent... 5. The assembly of claim 1, further comprising an insulating layer under the cover plate. |
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Discontinuous or differential coating, impregnation or bond... IMAGE DETECTING METHOD - An infrared absorbing composition including a compound that is represented by formula (1) and has solubility of 30 mg/mL or |
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Fullproductlist - Henkel Electrically and thermally conductive die-attach. See Henkel AG & Co. KGaA Information |
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Farco Plastics Inc. - AMS Specifications COMPOUND, INSULATING AND SEALING, SILICONE COMPOUND, SILICONE RUBBER, INSULATING AND SEALING 35-55 See Farco Plastics Supply, Inc. Information |
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