Products & Services
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Supplier: Gelest, Inc.
Description: Epoxy - Eq/kg = 1.9 - 2.0, viscosity: 25 cSt. - 35 cSt.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy, Silicone
- Chemical / Polymer System Type: Epoxy, Silicone
- Filler Material: Unfilled
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Supplier: SuperLogics, Inc.
Description: 25g pre-measured 500°F electrically resistant epoxy kit
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Filler Material: Unfilled
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Supplier: Koford Engineering, LLC
Description: E-114 is a low cure temperature, non sag high performance filled single component epoxy adhesive whichcan be cured at 100°C or 120°C to provide good shear strength in combination with good temperatureresistance. Especially suitable for assembley applications such as building precisionelectric
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
- Industry: Electronics
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP101 is a two component, low viscosity semi-rigid epoxy compound for high performance bonding, sealing and casting. It features a long working life at ambient temperatures and can be readily cured at temperatures in the 250-300°F range. Shrinkage upon cure is minimal
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Filler Material: Unfilled
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Supplier: Protavic America, Inc.
Description: Filled epoxy system. Very high performance material designed for difficult bonding applications. This material will bond to stencil foil without holes and can withstand high heat and harsh chemical environments. Requires heat assist.
- Material Form: Adhesive, Composite, Polymer (Plastic / Elastomer)
- Features: Electronics / Semiconductors, Electrical Power / HV
- Substrate / Material Compatibility: Ceramic / Glass, Metal, Plastic, Rubber / Elastomer
- Chemical / Polymer System Type: Epoxy (EP)
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Description: RRTVS 42 CURTIS II is a low viscosity unique silicone-epoxy co-polymer formulated to withstand severe thermal shock, low moisture absorption and excellent dielectric insulation. RTVS 42 CURTIS II contains silane adhesion promoters that enable it to bond well to most metals and plastics. Its unique
- Material Type / Grade: Elastomer / Rubber, Thermoset
- Chemical / Polymer System Type: Epoxy, Silicone
- Chemical / Polymer System Type: Epoxy, Silicone
- Features: Flame Retardant (e.g. UL 94 Rated), Thermally Conductive
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Supplier: GS Polymers, Inc.
Description: Two part economical casting system
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Filler Material: Mineral
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Supplier: Georgia-Pacific Chemical Division
Description: GP® 7565 resin is used as a crosslinker for hydroxyl containing polymers such as epoxies, polyesters, vinyls and acrylics. GP 7565 resin provides outstanding chemical resistance. It can be emulsified into water-based epoxy resins. It is used where light colored coatings are required
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy, Phenolics (Melamine, Furan)
- Chemical / Polymer System Type: Epoxy, Phenolics (Melamine, Furan)
- Industry: Industrial
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Supplier: Hapco, Inc.
Description: Heat cure epoxy powder that is lightweght and passes 94 V-0 testing.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Filler Material: Unfilled
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Supplier: Fiber Instrument Sales, Inc./FIS
Description: Excellent for general connector use, heat cure in 30 minutes
- Industry: Other
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: Fibro, Inc.
Description: Specifically designed for the toolmaking trade; 25min pot life, 24hr cure
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Chemical / Polymer System Type: Epoxy, Specialty / Other
- Filler Material: Unfilled
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Supplier: Gelest, Inc.
Description: Epoxy - eq/ kg = 0.75 - 0.80, viscosity: 4000 cSt. - 5000 cSt.
- Chemical / Polymer System Type: Epoxy, Silicone
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy, Silicone
- Filler Material: Unfilled
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Supplier: Glotrax Polymers Inc.
Description: PL 221 is a two component (2:1 ratio), 100% solids, structural epoxy gel. It is a solvent free, no odour, high strength, non-sag epoxy system. The resin and hardener are uniformly dispensed from a dual cartridge system and mixed simultaneously through a mixing nozzle. User friendly and reliable
- Substrate / Material Compatibility: Concrete / Masonry, Metal, Wood / Wood Product
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Building / Construction
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
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Supplier: Anti-Seize Technology
Description: Can be tapped drilled and painted, steel hard in 20 minutes
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Plastic, Wood / Wood Product
- Chemical / Polymer System Type: Epoxy (EP)
- Filled / Reinforced: Yes
- Industry: Marine, Building / Construction
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which cures
- Material Form: Coating, Composite, Dielectric Coating (Encapsulant, Conformal, etc.), Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electronics / Semiconductors, Electrical Power / HV
- Compound Type: Electrical Insulation / Dielectric
- Form / Function: Conformal / Encapsulating Coating, Encapsulant / Potting Compound, Gap Filling Compound
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Supplier: ELANTAS PDG, Inc.
Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound
- Features: Electrical Power / HV
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Supplier: Applied Industrial Technologies
Description: 25 ml dev-tube, a rapid-curing, general purpose adhesive/encapsulant
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Metal, Porous Surfaces, Wood / Wood Product
- Industry: OEM / Industrial, Building / Construction
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Cole-Parmer
Description: Tool box kit, includes 100 mixing sticks and assortment of 100 epoxies and urethanes. Complete selection of epoxies for all your maintenance needs Single-use adhesives are perfect for quick repair jobs Model: EMIX-100TB-CP Manufacturer number: EMIX-100TB-CP
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking
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Supplier: ELANTAS PDG, Inc.
Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Material Form: Composite, Polymer (Plastic / Elastomer), Potting Compound
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Supplier: ELANTAS PDG, Inc.
Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Filler Material: Mineral
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Supplier: Epoxy Technology
Description: Electrical type, electrical conductivity, oven cure method
- Material Type / Grade: Thermoset
- Chemical / Polymer System Type: Epoxy
- Chemical / Polymer System Type: Epoxy
- Resins & Compounds: Liquid
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Supplier: GS Polymers, Inc.
Description: Two part, 1:1, general purpose adhesive which is flowable and fast curing
- Substrate / Material Compatibility: Ceramic / Glass, Concrete / Masonry, Composites, Metal, Paper / Paperboard, Porous Surfaces
- Dissimilar Substrates: Yes
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: OEM / Industrial
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Supplier: Ellsworth Adhesives
Description: SEC 1233 is a flexible silver filled adhesive. It provides excellent electrical conductivity useful in many electronic applications. 4 gr
- Chemical / Polymer System Type: Epoxy (EP)
- Industry: Aerospace, Automotive, Electronics, Marine, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial, Optical Grade / Material, Photonics / Optoelectronics
- Cure Type / Technology: Thermosetting / Crosslinking
- Composition: Two Component System
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Supplier: ELANTAS PDG, Inc.
Description: of wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Dissimilar Substrates: Yes
- Industry: Aerospace, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Features: Electrical Insulating / Dielectric, Filled, Laminating / Composites, Non-corrosive Cure
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Supplier: BJB Enterprises, Inc.
Description: Stoner E497 Thermoset Mold Release is specially formulated as a release agent and anti-stick lubricant for molded thermoset plastics, rubber, and similar materials. It allows molded parts to be painted, plated, hotstamped, adhesive bonded, labeled, or otherwise decorated. Formulated for epoxies
- Chemistry / Constituents: Petroleum / Mineral Oil Based
- Features: Aerosol / Spray
- Type / Function: Mold Release / Release Agent
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Supplier: Epoxy Technology
Description: UV type, insulative conductivity, UV light cure method
- Form: Liquid
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light)
- Industry: Optoelectronics / Photonics
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Supplier: Dow Automotive Systems
Description: BETAMATE 73352 is a one-part, high performance, heat curing, epoxy adhesive. It is capable of bonding to oily automotive steel. It is weldable and provides superior stress durability, and corrosion resistance for increased body stiffness. It also has good wash-off resistance.
- Substrate / Material Compatibility: Metal
- Industry: Automotive
- Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
- Chemical / Polymer System Type: Epoxy (EP)
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21ARHT is a two component epoxy resin compound for durable, high performance, coating liner and adhesive/sealants with outstanding acid as well as excellent overall chemical resistance. The EP21ARHT compound which is formulated to cure at room temperature or more
- Material Form: Adhesive, Polymer (Plastic / Elastomer)
- Substrate / Material Compatibility: Composites, Plastic, Porous Surfaces
- Dissimilar Substrates: Yes
- Industry: Other
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Supplier: API Technologies Corp - Spectrum Control
Description: the filter’s thermoset epoxy body. The High Frequency PCB Filter offers savings three ways. First is the low cost of the filter assembly. Second is the economy of installation. Three silver plated leads are inserted into holes in a printed circuit board which has a ground path circuit
- Filter Type: DC
- Package / Mounting: Printed Circuit Board
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Supplier: Spectrum Advanced Specialty Products
Description: the filter’s thermoset epoxy body. The High Frequency PCB Filter offers savings three ways. First is the low cost of the filter assembly. Second is the economy of installation. Three silver plated leads are inserted into holes in a printed circuit board which has a ground path circuit
- Filter Type: DC
- Package / Mounting: Printed Circuit Board
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Supplier: API Technologies
Description: the filter’s thermoset epoxy body. The High Frequency PCB Filter offers savings three ways. First is the low cost of the filter assembly. Second is the economy of installation. Three silver plated leads are inserted into holes in a printed circuit board which has a ground path circuit
- Filter Type: DC
Find Suppliers by Category Top
Featured Products for Thermoset Epoxy Top
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Abrisa Technologies
Custom Screen Printed Optical Components
a very high print-to-packaging cleanliness and efficiency standard. The system prints with an accuracy of ±15µm @ 4 sigma; ensuring the highest level of precision printing in formats up to 460 x 460 mm. Print projects can utilize a combination of conductive or display inks, along with custom color matching to meet each unique application requirement. Abrisa Technologies uses epoxy, thermoset, enamel, and ceramic-based inks. In addition, opaque and semitransparent inks can be specified. Combine... (read more)
Browse Glass Fabrication Services Datasheets for Abrisa Technologies
Parts by Number for Thermoset Epoxy Top
| Part # | Distributor | Manufacturer | Product Category | Description |
|---|---|---|---|---|
| HEL V9500DUO PAK | PEI-Genesis | HellermannTyton | Not Provided | EPOXY THERMOSET ADHESIVE |
Conduct Research Top
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Thermoset Composites
or of a combination of carbon and glass fibers, laid up in multilayer fashion to form extremely rigid, strong structures. More than 95% of thermoset composite parts are based on polyester and epoxy resins; of the two, polyester systems predominate in volume by far. Other thermoset resins used
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A Comparison of the Environmental Attributes of Thermoplastic vs. Thermoset Composites
and environmental. materials. Actual cycle times are dependent upon epoxy. control requirements for thermoplastic composites are less. cure temperature, thermoplastic melt temperature, part. thickness, and other factors. Process: A thermoset material must be heated until cure, or cross-. There are other process
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Epoxy
Epoxy polymers are cured to form thermoset resins by either homopolymerization of epoxy groups with themselves, or reaction with curing agents such as anhydrides, amines, and novolacs. Because the curing agent contributes significantly to the cured properties of the resin, this is called
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Epoxy (EP) Resins
Epoxy (EP) resins exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally cured or thermoset one-part epoxies are also available
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Bismaleimide (BMI) Resins
of bismaleimide (BMI) resins can withstand use-temperatures as high as 245-degrees C without a concomitant decrease in thermal stability. Aromatic polyimides are among the most thermally stable organic materials known. BMI thermoset resins have high temperature resistance. Bismaleimide (BMI) resins have
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Self-Healing spacecraft
composite structures: They don't tolerate impacts, i.e., they have low fracture toughness and don't resist crack propagation. Unlike metals that can absorb a significant amount of impact, thermoset composites absorb energy by elastically deforming or fracturing. Impact loads typically generate microcracks
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Adhesives
and prevent damage that might occur if a stiff fastening system were used. Thermoset adhesives, such as epoxies and anaerobics, can be formulated to retain much of their strength over a broad temperature range, up to 300 F. Selecting a curing temperature close to the operating temperature can reduce
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Isomandrel Heat Pipe Technical Paper
- Company Overview. Isomandrel Technology & Filament Winding with carbon fiber epoxy materials. The Isosprue Spreader for thermoset molding - "Independent heating the sprue". Upload your own. Tweet. Wordpress. + Follow. Isomandrel ® Heatpipe Thermosyphon Augmented Mandrels - Advances in filament
Engineering Web Search: Thermoset Epoxy Top
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Epoxy - Wikipedia, the free encyclopedia
As with other classes of thermoset polymer materials, blending different grades of epoxy resin, as well as use of additives, plasticizers or fillers
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Rebar - Wikipedia, the free encyclopedia
"Epoxy Interest Group of CRSI". Epoxy Interest Group of CRSI. http://www.epoxyinterestgroup.org.
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Epoxy Adhesives Information on GlobalSpec
Epoxy adhesives are very common thermoset adhesives used in a wide variety of applications.
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Epoxy (EP) Specialty Adhesives, Sealants, and Compounds...
More ») Chemical Resistant Epoxy System -- 20-3004 HV , Chemical Resistant Epoxy System -- 20-3004 LV , Chemical resistant epoxy system -- 20-3005R ,
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ASTM F602 - 09 Standard Criteria for Implantable Thermoset...
ASTM F602 - 09 Standard Criteria for Implantable Thermoset Epoxy Plastics
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GRADE G-11 â?? HIGH TEMP GLASS EPOXY
Thermoset Grades Contact Us Specifications Thermoset Grades GRADE G-11 â?? HIGH TEMP GLASS EPOXY
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Self-healing thermoset using encapsulated epoxy-amine healing...
Title: Self-healing thermoset using encapsulated epoxy-amine healing chemistry Authors: Henghua Jin, Chris L. Mangun, Dylan S. Stradley, Jeffrey S.
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Cure kinetics behavior of a functionalized graphitic nanofiber...
nanofiber modified epoxy resin Authors: Yu Fu, Wei-Hong Zhong Abstract: Understanding curing behavior of nano-modified thermoset resin is critical