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Supplier: Cascade Microtech, Inc.
Description: Built-in anti-vibration support
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Electrical Test - Parametric / In-line
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Supplier: Imego
Description: MERMAID is a unique measurement instrument for analysis of liquid and thin film properties using magnetoelastic resonance (MER) sensors. Dynamic events such as viscosity change, phase transitions or bio film growth can be analyzed. The MER sensor can measure properties of either a coating on top
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Mounting / Loading: In-situ / System Mounted, Floor Mounted / Stand-alone
- Applications: CVD / PVD Films, Polymers / Photoresists, Other
- Measurement Capability: Deposition Rate, Endpoint Detection / Plasma Diagnostics, Thickness - Film / Layer, Other
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Supplier: KLA-Tencor Corporation
Description: SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens. Utilizing the patented ThermaBond technique, the embedded thermocouple bond
- Form Factor: Wafer Probing System
- Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
- Measurement Capability: Other
- Technology: Other
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Supplier: TELOPS, Inc.
Description: Test heads for LIV, wavelength and FFP slide above the packages to minimize machine size and package handling. Lasers are aligned using the vision system to achieve test data accuracy . An optical fiber for wavelength can move independently in X & Y to measure each VCSEL accurately .
- Form Factor: Monitor / Instrument, Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, Packaged ICs / Ceramic Substrates
- Measurement Capability: Electrical Test - Parametric / In-line, Electrical Test - Wafer Sort / Functional, Other
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Supplier: KLA-Tencor Corporation
Description: The Process Probe 2070 instrumented glass tiles offer a cost-effective and flexible solution for reliable in situ characterization of glass temperature profiles many flat panel processing applications. Employing a number of small, instrumented glass tiles rather than a single, large panel of glass,
- Form Factor: Wafer Probing System
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet
- Measurement Capability: Other
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Supplier: Hitachi High Technologies America, Inc.
Description: with considering the total system performance. This results in exceptional stability, milling performance and resolution, allowing e.g. automated mill-and-monitor operations for 3D reconstructions with slicing steps down to 5nm. NB5000 incorporates two sample stages - one conventional eucentric stage
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, CVD / PVD Films
- Measurement Capability: Critical Dimension / Trench Geometry, Shape / Flatness, Thickness - Film / Layer
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Supplier: Hiden Analytical
Description: The ESPion advanced Langmuir probe for rapid, reliable and accurate plasma diagnostics for industry and academia.
- Form Factor: Controller, Wafer Probing System
- Mounting / Loading: In-situ / System Mounted
- Applications: Etching - Plasma / Wet, Other
- Measurement Capability: Deposition Rate
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Supplier: KLA-Tencor Corporation
Description: stacks using spectroscopic ellipsometry (SE) Precisely measures advanced, ultra-thin gate dielectric films Develops and optimizes thin film dispersion models offline Provides the accuracy, repeatability, and system-to-system matching required to monitor advanced ICs with geometries as small
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, CVD / PVD Films, Etching - Plasma / Wet, Photolithography / Patterning, Polishing / CMP
- Measurement Capability: Thickness - Film / Layer
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Supplier: Nikon Metrology, Inc.
Description: The Optistation-V offers an ergonomic design and a user-friendly operating environment. This compact-size wafer inspection system also offers high accuracy and high throughput. The Optistation-V macro illuminators simplify visual macro inspections of unevenness, defocus, and other items that had
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Defects / ADC
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Supplier: MTI Instruments Inc.
Description: The Proforma 300 is completely menu-driven. The on-board intelligence provides fast, accurate, repeatable measurements for all types of wafer materials. Maximum measurement range or maximum probe/wafer stand-off distance can also be adjusted to meet your specific requirements. Features:
- Form Factor: Wafer Probing System, Sensor / Sensing Element
- Mounting / Loading: Manual Loading
- Applications: Semiconductor Wafers
- Measurement Capability: Roughness / Waviness, Shape / Flatness, Thickness - Wafer / Disc (TTV)
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Wafer and Thin Film Instrumentation Information on GlobalSpec
systems specifically designed for wafer metrology or in-situ monitoring of thin film parameters during thin film or semiconductors wafer processing.
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Optical / Imaging System Wafer and Thin Film Instrumentation...
Home > Datasheets > Wafer and Thin Film Instrumentation > Optical / Imaging System
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Mirror - Wikipedia, the free encyclopedia
5.5.4 Film and television 5.5.5 Literature
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Oscilloscope Probing System features 30 GHz bandwidth.,...
Oscilloscope Probing System features 30 GHz bandwidth. Oscilloscope Probing System features 30 GHz bandwidth.
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DRL | Device Research Laboratory
AJA Sputtering System Lakeshore Probestation
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Synchrotron-based spectroscopy for the characterization of...
thin-film solar cells operable as laboratory surface analysis system using commercial X-ray and UV sources or as end station at the BESSY synchrotron
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STP1015-EB Laser Induced Damage in Optical Materials: 1985
M. U.V. Laser Beam Diagnostics using a Computer Controlled Video Frame Store System Clark S., Emmony D., Laidler I., Omar B., Shaw M. Beam Profiling
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Basic Info on Tin Whiskers
A "Whisker" generally has the shape of a very thin, single filament or hair-like protrusion that emerges outward (z-axis) from a surface.
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Nanotechnology gets a boost
Operated in the Microdevices Laboratory at JPL, the E- Beam lithography system provides a tool for delving into the realm of nanotechnology, where
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NIST Tech Beat - September 3, 2008
In the thin films originally described by the patent, the bulk of the semiconductor molecules end up at the top of the film, as suspected.