Products & Services

See also: Categories | Featured Products | Technical Articles | More Information

Conduct Research Top

  • MICRO:Rosenberg (March 2001)
    nitride (TiN), titanium tungsten, cobalt silicide, tungsten silicide, tantalum, and tantalum nitride. These metal compounds are used for barrier/liner processes because they form high-stress films when deposited. However, high stress, along with plasma and thermal cycling, tends to cause refractory

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire