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  • Thermal Considerations For DC/DC Converters
    . The Arrhenius equation for reliability (see References) indicates that the failure rate of a power device will increase by 3 to 5 times for a 25°C increase in temperature. The ever-increasing demand for higher power density converters delivered at low cost forced manufacturers to push the limits
  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    performance. for products used in high performance RF applications. such as cell phones. Consequently, RF testing is utilized. to assure good RF performance. RF testing is performed. at the package level. The time required to move product. from wafer fab completion through package assembly. delays feedback
  • Applications of the TC62X Solid-State Temperature Sensors
    damage to the CPU. 1. R. 5. 1. NC. Control. NC. 120 k. Protecting power transistors, diodes, etc. is easy when. Ω. 2 TC620. the TC622 in a TO-220 package is used (Figure 7). The. 3. Low 7. tab of the TC622 package is internally connected to. Limit. R. 14. V. 2. High 6. 2 A1. 3. CC, so an insulating
  • Solving Thermal Measurement Problems Using The TC72 And TC77 Digital Silicon Temperature Sensors
    , as shown in Figure 1. The TC72 and TC77 sensors offer many system-level advantages, including the integration of the sensor and signal conditioning circuitry in a small Integrated Circuit (IC) package. Solving Thermal Management Problems Using the TC72 and TC77 Digital Silicon Temperature Sensors
  • Make a White LED Torch Using a Buck Converter
    . (eq. 1). A method to regulate a constant current uses the benefits. of current mirror with a high divider ratio. Two additional. Having R2 = 100 kW leads to R1 = 455 kW. PNP bipolar transistors are required for the proposal shown. This equation puts forward that NCP1529 is still used as. in Figure 3
  • Recent Progress in III-V Devices and Modules for Next Generation Mobile Handsets
    end solutions with functional integration at both the die and package level. In this invited talk,. Skyworks' development strategies for HBT- FET integration (on-die co-integration and/or die stacking approaches). to address the needs of increasing functionality and design flexibility
  • Using the PIC16F639 MCU for Smart Wireless Applications
    . signals with a typical input sensitivity of 3 mVPP. This. device (MCP2030) are bonded together in a single. high input sensitivity allows for extended low-frequency. SSOP package for smart-sensing and bidirectional. detection ranges in applications. communication applications. These two devices
  • Solving Thermal Measurement Problems Using The TC72 And TC77 Digital Silicon Temperature Sensors
    conditioning circuitry in a smal Integrated Circuit. bipolar temperature-sensing diode that is built from the. (IC) package. substrate of a CMOS IC process. The bipolar diode is. created from a PNP transistor that is formed by. The main distinguishing feature of the TC72 is its One-. combining