Page: 1 2 3 Next

Parts by Number Top

Part # Distributor Manufacturer Product Category Description
MS 53-3 ASAP Semiconductor FISCHER ELEKTRONIK Not Provided TRANSISTOR PAD, TO-5; Packages Cooled:TO-5; Insulator Material:F
L14G3 Radwell Fairchild Semiconductor Not Provided PHOTO TRANSISTOR; PACKAGE/CASE:3-TO-18; LEADED PRO
NTE285 Radwell Nte Not Provided BIPOLAR TRANSISTOR; PACKAGE/CASE:TO-3; CURRENT RAT
IRLR8743TRPBF Radwell International Rectifier Not Provided MOSFET IC; TRANSISTOR TYPE:MOSFET; PACKAGE/CASE:3-
M414/TO3 ASAP Semiconductor MULTICOMP Not Provided TRANSISTOR COVER; Packages Cooled:TO-3; Insulator Material:Nylon
More >>

Conduct Research Top

  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Higher memory prices lift Micron to $341 million net income Kyocera to buy majority of CDMA chips from Qualcomm as part of acquisition Semtech rolls out 11 new ECL devices Philips puts two high-voltage transistors in 'mini' package Summit offers Visual IP on Windows PCs C-Cube powers Cisco video
  • Thermal Considerations For DC/DC Converters
    . The Arrhenius equation for reliability (see References) indicates that the failure rate of a power device will increase by 3 to 5 times for a 25°C increase in temperature. The ever-increasing demand for higher power density converters delivered at low cost forced manufacturers to push the limits

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire