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  • MICRO: Process Tool Support
    While PM minimizes unscheduled tool downtime, smooths scheduling, improves yields, and extends the intervals between servicing, it must be balanced against the high cost of shutting equipment down. Contamination Caused by Semiconductor Manufacturing Processes Figure 1 illustrates several
  • MICRO: Tool/Fab Support
    with higher purity, flow, and pressure requirements, placing new demands on CDA system design. This article discusses traditional CDA system design, the role of vendors in supplying CDA to fabs, and lithography tool requirements. It presents measures that existing and future fabs can take to meet their CDA
  • MICRO: Tool/Fab Support Strategies
    Maximizing tool uptime and process stability through an RF system upgrade Brent Rosecrans and Gil P. Dorcey, Like most fabs, the 150-mm wafer facility run by Agilent Technologies in Fort Collins, CO, has limited toolset capacity to manufacture its high-mix product line of CMOS and gallium arsenide
  • MICRO: Tool/Fab Support Strategies
    . The tool may be damaged, and silicon cleanup always requires extensive downtime. For transport and docking systems, out-of-adjustment loadports can fail to latch front-opening unified pod (FOUP) doors securely, which can cause a door to fall off of a pod. Beyond the obvious risk to production
  • MICRO: Tool/Fab Support Strategies
    helped to reduce production costs. Conservation efforts have also led to increased reliability while decreasing the capital expenditures required to support production changes. The optimization of process utilities has many benefits, including conservation of resources, reduced operating
  • Cutting Tool Manufacturer Penetrates New Markets
    with the very best in tool resharpening and manufacturing. "Our previous facility was too small and lacked the utilities needed to support our commitment to growth, " VP of Manufacturing, Scott Ameduri says. "Having upgraded to more sophisticated technology and machines capable of running around
  • MICRO: Tool/Fab Support
    Keyvan Keyhani, Sameer Abu-Zaid, and Haifeng Zhang, Purging front-end unified pods (FOUPs) with an inert gas such as nitrogen or with clean dry air (CDA) removes airborne molecular contaminants that can potentially damage integrated circuits and significantly impact manufacturing yields. Immersing
  • MICRO: Tool/Fab Support
    Mutsuhiro Amari, Aiwen Wu, and Hee Jun Yang, Linda Chen, Thomas Bowling, and Michael Watt, Particulate- and bubble-induced defects cause distinct problems for 193-nm photoresist systems. Microbridging defects in the photoresist and cone defects in antireflective coatings are particularly troublesome

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