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  • MICRO: Process Tool Support
    While PM minimizes unscheduled tool downtime, smooths scheduling, improves yields, and extends the intervals between servicing, it must be balanced against the high cost of shutting equipment down. Contamination Caused by Semiconductor Manufacturing Processes Figure 1 illustrates several
  • MICRO: Tool/Fab Support
    needs and discusses the potential impact of those measures on the manufacturing process. CDA is used in many applications throughout the fab and support areas, including in pneumatic controls and tools, purging equipment, air cylinders for machine actuation, product cleaners and blow-off devices
  • MICRO: Tool/Fab Support Strategies
    helped to reduce production costs. Conservation efforts have also led to increased reliability while decreasing the capital expenditures required to support production changes. The optimization of process utilities has many benefits, including conservation of resources, reduced operating
  • MICRO: Tool/Fab Support Strategies
    Maximizing tool uptime and process stability through an RF system upgrade Brent Rosecrans and Gil P. Dorcey, Like most fabs, the 150-mm wafer facility run by Agilent Technologies in Fort Collins, CO, has limited toolset capacity to manufacture its high-mix product line of CMOS and gallium arsenide
  • MICRO: Tool/Fab Support Strategies
    be minimized. Yet the integration of automation and process tools does not come about without challenges. Engineers must ensure that the reliability of material-handling systems does not affect the ability of the fab to do its essential job processing wafers. The potential of automation to affect
  • MICRO: Tool/Fab Support
    Mutsuhiro Amari, Aiwen Wu, and Hee Jun Yang, Linda Chen, Thomas Bowling, and Michael Watt, Particulate- and bubble-induced defects cause distinct problems for 193-nm photoresist systems. Microbridging defects in the photoresist and cone defects in antireflective coatings are particularly troublesome
  • MICRO: Tool/Fab Support
    Keyvan Keyhani, Sameer Abu-Zaid, and Haifeng Zhang, Purging front-end unified pods (FOUPs) with an inert gas such as nitrogen or with clean dry air (CDA) removes airborne molecular contaminants that can potentially damage integrated circuits and significantly impact manufacturing yields. Immersing
  • MICRO: Tool Fab Support
    ). The current generation of photo engineers has extended optical lithography far beyond what previous generations considered feasible, and many in the industry believe that the next step forward will be the implementation of immersion lithography. While the use of immersion tools is rapidly approaching

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