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Supplier: Keystone Electronics Corp.
Description: Material: Nylon 6/6 Length: #N/A Thread: M4
- Screw Type: Machine Screw
- Metric: M4
- Material: Plastic
Supplier: K & F Electronics, Inc.
Description: BOARD THICKNESS: .125" BOARD FLATNESS TOLERANCE: .001 inch/inch MINIMUM HOLE SIZE: .005" ANNULAR RING: .0075" FINISHED TRACE WIDTH: INSIDE: .004" OUTSIDE: .006" SPACING BETWEEN TRACES: INSIDE: .004" OUTSIDE: .006" SMT PITCH: .012" COPPER TO BOARD EDGE: .015" for scoring BOARD FINISHES: Bare copper
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Location: North America, United States Only, Midwest US Only
Supplier: API Technologies Corp - Spectrum Control
Description: your signals to handle EMI issues at the same time or with as little as a 0.05 pF to protect the integrity of your signal in high speed or digital applications. Features ESD/EFT protection at the I/O ports Low ground impedance Removal of ground traces from the board Complete protection Efficient
- Applications / Categories: PCB Connectors
- Connector Type: Strip Connectors
- Gender: Male / Plug
- Contact Rows: Dual Row
Supplier: Maxim Integrated Products, Inc.
Description: the video or control data is serialized. The MAX9217 pairs with the MAX9218 deserializer to form a complete digital video serial link. Interconnect can be controlled-impedance PCB traces or twisted-pair cable. Proprietary data encoding reduces EMI and provides DC balance. DC balance allows AC-coupling
- Device Type / Applications: Other
- RoHS Compliant: Yes
- Supply Voltage: 3.3 V
- Number of Transmitters: 1
Standards and Technical Documents - PCB Trace Impedance: Impact of Localized Copper Density -- APEXPO12-S07-1
Description: DESCRIPTION "PCB Trace Impedance: Impact of Localized Copper Density" is a paper presented by Gary Brist, staff technologist at Intel Corporation. It was given at the 2012 APEX EXPO Technical Conference. The author describes how the need for controlled impedance is impacted by localized copper
Supplier: Techwell, Inc.
Description: support and line silence preservation 1.2V supply voltage Individual channel power-down (impedance select) Benefits Thinner gauge cable Extends cable reach greater than 3x Improved BER Description The QLx4300-S45 is a settable quad receive-side equalizer with extended functionality for advanced
- Device Type / Applications: Signal Conditioner
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K & F Electronics, Inc.
guidelines. TYPES OF BOARDS MANUFACTURED: Single sided, double sided,multi-later. MANUFACTURING VOLUMES: 1 piece prototypes through production volumes. MAXIMUM NUMBER OF LAYERS: 24. MAXIMUM BOARD SIZE: 17 x 23 inches. MAXIMUM FINISHED BOARD THICKNESS: .125". BOARD FLATNESS TOLERANCE: .001" / in. MINIMUM HOLE SIZE: .005". DRILLED VIA SIZE: .010". ANNULAR RING: .0075". FINISHED TRACE WIDTH: inner layer: .004", outer layer: .006". SPACING BETWEEN TRACES: inner layer: .004", outer layer: .006". SMT PITCH... (read more)
Browse Printed Circuit Board (PCB) Fabrication Services Datasheets for K & F Electronics, Inc.
Enhanced ESD Protection
performance while providing robust ESD protection; reduces designer ’s dependency on accurate trace impedance simulators. Reduces clamping voltage by as much as 66% compared to competitive devices, ensuring chipset reliability. Allows manufacturers to provide ESD protection higher than the IEC standard requires and ensures product reliability in the field. Reduces PCB footprint by more than 50% when compared to other fully integrated, 6-channel protection devices; allows PCB traces to run... (read more)
Browse Diode Arrays Datasheets for Littelfuse, Inc.
Microwave Photonic Systems, Inc.
EMI/RFI Shield Patch Panel
is utilized to carry the front panel RJ45 input signals to the rear DB44 connectors. Signal paths are spread across the five DB44 rear connectors and the PCB was optimized for impedance, time delay, low noise and cross talk as well as current carrying requirements to suite the shipboard phone signals. The enclosure is a 6061 Aluminum Alloy Extrusion developed by MPS inc. to withstand Military testing and shipboard requirements. All components are coated to prevent corrosion but retains conductivity. PCB... (read more)
Browse Patch Panels Datasheets for Microwave Photonic Systems, Inc.
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BBG Tech Tips #5: Controlled Impedance (.pdf)
More and more of today's PCB designs demand faster processing of information requiring the bare board to have what is known as controlled impedance - the elimination or minimizing of discontinuities in the signal that a trace will deliver. Microsoft Word - BBGTech Tip-1.doc. BBG Tech Tips
Multilayer Lamination Methods for PTFE-Based PCBs
Properties and Surface Resistance of Microwave PCBs in the K-band. TLY-5A, TLC-32, DK, dielectric constant ( e), df, loss tangent (tan d), temperature dependance, -50°C to +70°C. Read Abstract Download PDF. Passive intermodulation in printed lines: effects of trace dimensions and substrate
Using Heavy Copper and EXTREME Copper in PCB Design and Fabrication for Maximum Reliability
An increasing number of power electronics products are taking advantage of a growing trend in the printed circuit board industry: Heavy Copper and EXTREME Copper Printed Circuit Boards. Most commercially available PCBs are manufactured for low-voltage/low power applications, with copper traces
Match The Ports Of Differential Devices
port impedances. They also specify Zopt, which represents the impedance that the transceiver should see. for best performance. Ember4 suggests an optimum reflection coefficient of 0.79/65 deg. (expressed in magnitude and phase) for maximum transmit power and best sensitivity. The reference impedance
Designing Loop Antennas for the rfPIC12F675
to resonate. A = loop area inside center of trace width (m2). at a desired frequency. The challenge is matching its. λ = speed of light/frequency = wavelength (m). impedance to the transmitter output for maximum. power transfer and harmonic filtering. Complexity is. Assuming the PCB antenna trace
Medical Device Link . Design Technologies for Immunity to Electromagnetic Threats
effective. This problem has created new solutions in terms of developing effective hardening methods. The key often lies in the printed circuit board (PCB) layout and internal interconnect choices. Thinking in terms of transmission line and high-frequency impedance control methods, even when designing
Medical Device Link . Electromagnetic Compatibility in Microcontroller Applications Combining a number of options can reduce electromagnetic interference at the integrated-circuit level.
a grid-type or solid ground reference plane can control the loop area of signals in the controllers and reduce overall ground impedance. Using multiple ground pins in the package to tie the internal microcontroller ground to the external PCB ground can also improve grounding. To reduce electromagnetic
Medical Device Link . Benchtop EMC Testing Techniques for Medical Equipment Using loop probes to help test devices for electromagnetic compatibility saves costly redesign and complements open area and chamber tests.
resistance (Rr), the simple bulk resistance of the loop (RL), and the inductance of the loop (L). All three of these quantities are usually very small, and the sum of their impedances is usually much smaller than the typical 50- input impedance of most receivers or spectrum analyzers. Consequently
More Information on: Trace Impedance PCB Top
SDRAM interface to LPC18xx/43xx EMC
2.5 EMC PCB trace impedance recommendation .
PTN3363/PTN3366 PCB layout guidelines
2.3 PCB trace impedance .
Gizopoulos / Advances in ElectronicTesting
simulations can predict performance and many parameters of a planned design (e.g. PCB trace impedance or parasitics) before anything is built.
IEEE Standard for Reduced-Pin and Enhanced-Functionality Test Access Port and Boundary-Scan Architecture
The characteristic PCB trace impedance (the combined effect of resistance, conductance, inductance and capacitance in the PCB line) is the load for the output buffer.
Link analysis and design of high speed storage buses in backplane and cabling environments
Simulation models of this eye analysis used nominal chip corner of PVT (process, voltage, temperature) variation and nominal PCB trace impedance – i.e. channel trace was modeled for design target impedance – for nominal cases as compared with eye opening spectrum...
A modular VME or IBM PC based data acquisition system for multi-modality PET/CT scanners of different sizes and detector types
Such component's layout and connectionsallow for a low power dissipationdriver for a single load unit, reduced ground bouncing and noise, easy implementation of matched impedance PCB traces , reduced crosstalk and signal skew, easy construction of the PCB because of no crossing traces...
Application of Artificial Neural Networks to Statistical Analysis and Nonlinear Modeling of High-Speed Interconnect Systems
These parameters are package impedance Zpkg, PCB trace impedance Zpcb, transmitter on-die termination Zsrc, receiver on-die termination Zterm, driver current Is, edge rate of the signal tr, and device capacitance Ci.
University of Missouri-Rolla offers PCB trace impedance and inductance calculators
University of Missouri-Rolla offers PCB trace impedance and inductance calculators .