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Supplier: Microchip Technology, Inc.
Description: media such as PCB traces, backplanes, or cables.SY89325V inputs can be terminated with a single resistor between the true and complement pins of the input.The SY89325V is a member of Micrel's Precision Edge® family of high-speed logic devices. This family features ultra-small
- Logic Family: PECL, LVDS
- Input Voltage: 3.3 volts
- Propagation Delay: 0.7000 ns
- Operating Current: 8.00E7 nA
Supplier: Pico Technology
Description: oscilloscope traces, or loaded from a spreadsheet. Soud level meter / sound waveforms The built-in microphone can be used in two ways. Sound level meter / data logger with a 55 to 100 dB range using PicoLog Oscilloscope / spectrum analyzer with views of sound waveforms using PicoScope
- Signal Converter Type: Analog-to-Digital Converter
- Analog Input Channels: 14
- Signal Converter Package: Printed Circuit Board (PCB)
- User Interface: Computer Programmable
Standards and Technical Documents - PCB Trace Impedance: Impact of Localized Copper Density -- APEXPO12-S07-1
Description: DESCRIPTION "PCB Trace Impedance: Impact of Localized Copper Density" is a paper presented by Gary Brist, staff technologist at Intel Corporation. It was given at the 2012 APEX EXPO Technical Conference. The author describes how the need for controlled impedance isShow More
Supplier: Maxim Integrated Products, Inc.
Description: the video or control data is serialized. The MAX9217 pairs with the MAX9218 deserializer to form a complete digital video serial link. Interconnect can be controlled-impedance PCB traces or twisted-pair cable. Proprietary data encoding reduces EMI and provides DC balance. DC
- Device Type / Applications: Other
- RoHS Compliant: true
- Supply Voltage: 3.3 V
- Number of Transmitters: 1
Supplier: Oak-Mitsui Technologies - FaradFlex®
Description: the need to place discrete capacitors on the surface of the PCB, Module, or chip package. Space is a premium on many of these devices and there are few or no locations to place a capacitor with its vias, pad, and traces. By using Faradflex the device is etched into the copper and
- Thickness: 16 to 25 µm
- Features: Dielectric / Insulating
Printed Circuit Substrate Materials (PCB / PWB) - FARADFLEX® Ultra Thin Advanced Electronic Material, MCxxTM -- MC8TM, MC12TMSupplier: Oak-Mitsui Technologies - FaradFlex®
Description: space by eliminating the need to place discrete capacitors on the surface of the PCB, Module, or chip package. Space is a premium on many of these devices and there are few or no locations to place a capacitor with its vias, pad, and traces. By using Faradflex the device is etched into
- Thickness: 8 to 12 µm
- Electrical Resistivity: 1.20E13 to 1.90E13 ohm-cm
- Features: Dielectric / Insulating
Supplier: Techwell, Inc.
Description: applications. Applications InfiniBand (SDR) 10GBase-CX4 PCI Express (Gen 1) DisplayPort XAUI SAS (1.0) High-speed active cable assemblies High-speed printed circuit board (PCB) traces
- Device Type / Applications: Signal Conditioner
Supplier: K & F Electronics, Inc.
Description: BOARD THICKNESS: .125" BOARD FLATNESS TOLERANCE: .001 inch/inch MINIMUM HOLE SIZE: .005" ANNULAR RING: .0075" FINISHED TRACE WIDTH: INSIDE: .004" OUTSIDE: .006" SPACING BETWEEN TRACES: INSIDE: .004" OUTSIDE: .006" SMT PITCH: .012" COPPER TO BOARD EDGE: .015" for scoring BOARD FINISHES:
- Supplier Capability: PCB Design / Layout, Prototype Quantities, Production Quantities, Testing and Evaluation, PCB Assembly, Just-In-Time Capability
- PCB Type: Single-Sided Boards, Double-Sided Boards, Multi-Layer Boards, Flexible Boards, Rigid-Flexible Boards, SMT Components, THT Components
- Location: North America, United States Only, Midwest US Only
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Enhanced ESD Protection
on accurate trace impedance simulators Reduces clamping voltage by as much as 66% compared to competitive devices, ensuring chipset reliability Allows manufacturers to provide ESD protection higher than the IEC standard requires and ensures product reliability in the field Reduces PCB footprint by (read more)
Browse Diode Arrays Datasheets for Littelfuse, Inc.
Microwave Photonic Systems, Inc.
EMI/RFI Shield Patch Panel
across the five DB44 rear connectors and the PCB was optimized for impedance, time delay, low noise and cross talk as well as current carrying requirements to suite the shipboard phone signals. The enclosure is a 6061 Aluminum Alloy Extrusion developed by MPS inc. to withstand Military testing and (read more)
Browse Patch Panels Datasheets for Microwave Photonic Systems, Inc.
Conduct Research Top
BBG Tech Tips #5: Controlled Impedance (.pdf)
More and more of today's PCB designs demand faster processing of information requiring the bare board to have what is known as controlled impedance - the elimination or minimizing of discontinuities in the signal that a trace will deliver.
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SDRAM interface to LPC18xx/43xx EMC
2.5 EMC PCB trace impedance recommendation .
PCI Express 3.0 ENA Differential
Impedance Test Procedures for
Add-in Cards & Motherboard
(system) Testing using Agilent
E5071C ENA Network Analyzer
3 Measuring System Board PCB Trace Impedance : Calibration and Setup ...
PTN3363 PCB layout guidelines
2.3 PCB trace impedance .
Gizopoulos / Advances in ElectronicTesting
simulations can predict performance and many parameters of a planned design (e.g. PCB trace impedance or parasitics) before anything is built.
Link analysis and design of high speed storage buses in backplane and cabling environments
Simulation models of this eye analysis used nominal chip corner of PVT (process, voltage, temperature) variation and nominal PCB trace impedance – i.e. channel trace was modeled for design target impedance – for nominal cases as compared with eye opening spectrum…
Application of Artificial Neural Networks to Statistical Analysis and Nonlinear Modeling of High-Speed Interconnect Systems
These parameters are package impedance Zpkg, PCB trace impedance Zpcb, transmitter on-die termination Zsrc, receiver on-die termination Zterm, driver current Is, edge rate of the signal tr, and device capacitance Ci.
High-speed signal termination analysis using a co-simulation approach
B. PCB Trace Impedance .