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  • Description: Selection of Collaborative Technology Used by Software Contractors Volume 38, Issue 6 (November 2010) Applying collaborative technology in the software technology can shorten the product design cycle and improve competitiveness. The enterprise and suppliers can use this technology to develop a new

  • Description: Mounting:Through Hole; Output Device:Transistor; Minimum Isolation Voltage:5000Vrms; Minimum Current Transfer Ratio:600%; Supplier Package:DIP; Pin Count:4; Function:Transistor and Photovoltaic Output PhotoCouplers; Product Width:6.5mm; Product Length:4.58mm; Maximum Reverse Voltage:6V

    • Optocoupler Output: Phototransistor
    • Mounting Option: Flat Pack

  • Description: Logic Function:Monostable Multivibrator; Typical Operating Supply Voltage:5V; Number of Elements per Chip:1; Maximum High Level Output Current:-0.4mA; Maximum Low Level Output Current:16mA; Maximum Quiescent Current:13mA; Logic Family:TTL; Fabrication Technology:Bipolar; Supplier Package:PDIP; Pin

    • Supply Voltage: 5 V
    • IC Package Type: PDIP
    • Logic Family: Transistor-Transistor Logic (TTL)
    • Operating Current: -400000 to 1.60E7 nA

  • Description: Type:PUT; Repetitive Peak Reverse Voltage:40V; Rated Average On-State Current:0.15A; Maximum Gate Peak Inverse Voltage:5V; Surge Current Rating:5A; Supplier Package:TO-92; Pin Count:3; Product Width:4.19mm; Repetitive Peak Forward Blocking Voltage:40V; Product Height:5.33mm

    • Thyristor Type: Programmable Unijunction Transistor (PUT)
    • IC Package Type: Other
    • Pin Count: 3
    • VRRM: 40 volts

  • Description: of process capabilities our MEMS Foundry eliminates the need for customers to use multiple suppliers. All front end processing is performed in house and under the supervision of our experienced process engineering team. Maintaining all MEMS process capabilities in house enables us to decrease

    • Services: Design / Engineering, R & D / Development, Prototyping, Pilot / Scale-Up, Production
    • Wafer Processing: PVD Thin Film, CVD Thin Film, Via Forming / Filling
    • Device Type: Analog, ASIC , High Voltage, Logic, Memory, Microprocessor, Oscillator / Transistor-Oscillator (TO), Passive Components, Power Electronics, Sensors, Specialty / Other
    • Device Voltage: 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3 V, 3.3 V, 5 V, Other

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  • Resource: Unijunction Transistor Tutorial
    Microsemiconductor produces a very broad line of standard unijunction transistors. Many of the basic applications include: oscillators, timers, sawtooth generators, SCR triggers, frequency dividers, stable voltage sensing,. << Triac | Unijunction Transistor | Varactor d... >>. view all topics
  • Technical Article: Bipolar Transistor Tutorial
    Bipolar transistors, having 2 junctions, are 3 terminal semiconductor devices. The three terminals are emitter, collector, and base. A transistor can be either NPN or PNP. See the schematic... American Micro Semiconductor -- Semiconductor Tutorials. Home. Online Store. Diodes. Transistors
  • Transistor-Transistor Logic (TTL)
    Transistor-transistor logic (TTL) is a class of digital circuits built from bipolar junction transistors (BJT), diodes and resistors. It is notable, as it was the base for the first widespread semiconductor integrated circuit (IC) technology. All TTL circuits operate with a 5 V power supply. TTL
  • JFET Application Note: Reset Transistor
    In JFETs designed primarily for silicon drift detectors and Si(Li) detectors,. the reset transistor is configured as shown in Figure 1, with the base. shorted to the source, the collector shorted to the gate, and the emitter. connected to the reset pad. Since the gate-source JFET junction
  • Bipolar Junction Transistors
    transistors come in a wide variety of physical packages. Package type is primarily dependent upon the power dissipation of the transistor, much like resistors: the greater the maximum power dissipation, the larger the device has to be to stay cool. There are several standardized package types
  • Operation and Modeling of the MOS Transistor
    Operation and Modeling of the MOS Transistor. Geared toward advanced electrical engineering students, this extensive text provides a unified treatment of the operation and modeling of the MOS transistor, the key element of most modern microelectronic chips. Books24x7
  • Technical Reference: What is an FET and How Is It Different from a Bipolar Transistor?
    A bipolar transistor is a current amplifying device. An input current results in an amplified output current Hfe=Ic/Ib... American Microsemiconductor manufacturers of Diodes, Transistors, Thyristors, Triacs, Diode Array, Integrated Circuits and Semiconductors. Home. Online Store. Diodes
  • Quantum Transport: Atom to Transistor
    Quantum Transport: Atom to Transistor. Written for senior and graduate students, this book presents the conceptual framework underlying the atomistic theory of matter, emphasizing aspects that relate to current flow, including advanced concepts of non-equilibrium quantum statistical mechanics
  • High Electron Mobility Transistors (HEMT)
    High electron mobility transistors (HEMTs) are used in microwave circuit applications. These transistors behave much like conventional field effect transistors (FETs): a conducting channel between drain and source electrodes can be affected by applying a voltage to the gate electrode. This causes
  • Investigation of electron delay in the base on noise performance in InGaP heterojunction bipolar transistors
    Modern InGaP/GaAs heterojunction. bipolar transistors (HBT) demonstrate excellent microwave. and high-speed performance due to high carrier mobility. and bandgap engineering. They have found a niche in. wireless and optical electronics in spite of higher wafer. fabrication costs and lower

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