Trickle Varnish Polymers

Description: Master Bond Polymer System EP19M is a high performance epoxy resin formulation specially formulated to bond to treated fluoropolymer and other difficult to bond surfaces. It is supplied as a single component low viscosity compound and requires cure at elevated temperatures in order to obtain high

• Material Form: Adhesive, Gap Filling Sealant / Gasket, Polymer (Plastic / Elastomer), Potting Compound, Varnish / Impregnating Resin
• Features: Electronics / Semiconductors, Electrical Power / HV
• Use: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound, Gap Filling Compound, Impregnating Resin
• Chemical / Polymer System Type: Epoxy (EP), Specialty / Other

Description: ELANTAS PDG, Inc., founded in 1919 and based in St. Louis, Missouri, is a premier global supplier of specialty resins for applications in the electrical and electronic industries. ELANTAS Electrical Insulation companies are respected as the market leaders in the development and manufacturing of wire

• Form: Liquid
• Chemical / Polymer System Type: Polyester / Vinyl Ester
• Cure Type / Technology: Reactive / Moisture Cured, Room Temp. Cure / Vulcanizing, Thermosetting / Crosslinking
• Industry: Building / Construction, Electronics, Electrical Power / HV, OEM / Industrial, Tooling / Mold Material, Other

Description: RTVS 27 LV is a low viscosity, general purpose, reversion resistant RTV Silicone Compound. RTVS 27 LV finds use in commercial potting/casting application. RTVS 27 LV's one-to-one ratio by weight or volume makes it ideal for dispensing equipment or unskilled labor. With the ability to cure rapidly at

• Compound Type: Encapsulating / Potting
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, RTV / Room Temperature Curing
• Features: Electrical Insulation / Dielectric Material, Thermal / Heat Insulating
• Industry: Electronics

Description: Master Bond Polymer System EP19SC is a one component silver filled electrically conductive epoxy adhesive ocmpound wiht excellent chemical resistant and thermal stability characteristics. This adhesive features very low levels of ionic impurities and provides durable high strength electrically

• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Form / Function: Die Bonding Adhesive / Compound, Encapsulant / Potting Compound, Impregnating Varnish (Dip, Trickle, Vacuum), Gap Filling Compound
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Electrical Power / HV (Coils, Motors), Optoelectronics / Photonics
• Chemical / Polymer System Type: Epoxy (EP), Specialty / Other

Description: ES® H62 C is a solvent-free, liquid silicone resin which is cured by heat. Special features is a methylphenylvinylhydrogen polysiloxane not modified with organic components; is of very low volatility (suitable for vacuum pressure impregnation); is cured by heat through catalysed

• Material Type / Grade: Elastomer / Rubber
• Chemical / Polymer System Type: Silicone
• Filler Material: Unfilled
• Liquid: Yes

Description: Master Bond Polymer System UV19 is a newly developed UV curable, low viscosity optically clear compound specifically designed for high performance laminating, sealing, bonding and coating. This remarkable acrylic based polymer composition can effectively replace conventional heat and/or solvent

• Substrate / Material Compatibility: Ceramic / Glass, Metal, Paper / Paperboard, Plastic, Porous Surfaces, Rubber / Elastomer, Wood / Wood Product, Other
• Form: Liquid
• Chemical / Polymer System Type: Rubber Based / Elastomeric
• Cure Type / Technology: UV / Radiation Cured (also EB, Light)

Description: Master Bond Polymer System EP19HT is a storage stable one component liquid epoxy resin system for durable, high performance adhesive/sealants, impregnants and liners. It features remarkably long shelf life and excellent storage characteristics at ambient temperatures yet cures readily at elevated

• Substrate / Material Compatibility: Metal, Porous Surfaces
• Industry: Electronics, Electrical Power / HV
• Chemical / Polymer System Type: Specialty / Other, Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: INSULCAST 781 is a clear, one-component, flexible, heat cure epoxy system designed for coil impregnation, and potting applications requiring low viscosity and minimal thermal stress.

• Substrate / Material Compatibility: Plastic
• Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Military / Government (MIL-SPEC / GG), OEM / Industrial, Building / Construction, Other
• Cure Type / Technology: Single Component System, Thermosetting / Crosslinking
• Features: Encapsulating / Potting