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Part # Distributor Manufacturer Product Category Description
TSSOP20EV Digi-Key Microchip Technology Programmers, Development Systems BOARD EVAL FOR MCP43X
TSSOP28 National Microchip ELMOS Not Provided Not Provided
TSSOP16 National Microchip AD Not Provided Not Provided
TSSOP-280351 National Microchip SC Not Provided Not Provided
TSSOP38RTY National Microchip ST Not Provided Not Provided
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  • MCP2030 Three-Channel Analog Front-End Device Overview
    TB090 MCP2030 Three-Channel Analog Front-End Device Overview FIGURE 1: PIN DIAGRAM Author: Youbok Lee, Ph.D. Microchip Technology Inc. 14-pin TSSOP, SOIC, PDIP INTRODUCTION V V 1 14SS SS The MCP2030 is a stand-alone, Analog Front-End CS LCCOM (AFE) device for Low-Frequency (LF) sensing and 2 13
  • Tape and Reel Information - RF Modules
    ................................................................................................................13. Figure 11. Carrier Tape Body Size: 4.4 x 6.5 x 1.0 mm – 16L TSSOP ................................................................................................................14. Figure 12. Carrier Tape Body Size: 4.4 x 6.5 x 1.0 mm – 20L TSSOP
  • Signal Chain Design Guide (.pdf)
    . devices, 14-lead TSSOP and 16-lead QFN packages for the. the DAC input code during power-off time allowing the DAC. dual potentiometer devices, and 20-lead TSSOP and QFN. output to be available immediately after power-up. This. packages for the quad potentiometer devices. Non-volatile. feature is very
  • Selecting an ESD Suppressor (.pdf)
    . Metal Oxide Varistor. SCR/Diode Array. TVS Avalanche. Voltage Variable Material. EIA 0402,. EIA 0402, 0603,. 8 or 16 pin. EIA 0402, 0603, 0805. Package Outlines. JEDEC SOT23, SOT143. 1206, 1210. JEDEC DIP or SOIC. JEDEC SOT23. TSSOP, MSOP. Lines of Protection. 1, 4. 4, 6, 14. 1, 2, 3, 4, 5, 6, 8,. 1
  • ESD Suppression Technologies (.pdf)
    , the voltage. of the transient is clamped to a low value. IN. 4 AND 6. IN 1. 3. IN. SP05xx products are available in a wide. variety of package styles and number of. lines of protection. Package options include. SOT-23, SOT-143,TSSOP, MSOP and chip. V- 2. scale package (CSP).The number of lines
  • 1K, 2K and 4K Microwire EEPROM Migration
    . NEW PACKAGING OPTIONS. With the release of the latest Microwire EEPROMs,. Microchip Technology has now introduced ORG-. enabled devices small enough to fit into MSOP and. TSSOP packaging, which translates to more memory in. smaller places. These packages have small footprints. and are only 1.1 mm
  • Can Design Example: Simple Sensor Node
    . The designer does not have to. Three request-to-send pins (can be used as general. settle for the peripherals offered by an MCU with integrated. purpose. inputs). CAN, but rather the designer can choose the MCU which best. matches the application. 18-pin PDIP and SOIC, 20-pin TSSOP. Additionally, the four
  • Simplifying External Memory Connections of PIC17CXXX PICmicro (R) Microcontrollers
    to the RE0/ALE pin of the microcontroller and the. second USART could be used for downloading new. OE pins are tied to ground. These devices can be. code into the FLASH. found in various packages types (DIP through TSSOP). FIGURE 2: PIC17C756 IN EXTENDED. MICROCONTROLLER MODE. PIC17C756. External

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