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  • A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
    . A Room Temperature Low Stress Bonding Process for Sputtering Target Assembly Indium Corporation Tech Paper. A Room Temperature, Low-Stress Bonding. Process to Reduce the Impact of Use Stress. on a Sputtering Target Assembly. Authored by: Amanda Hartnett, Jacques Matteau, Ronnie Spraker
  • Hot Isostatic Pressing: Today and Tomorrow (.pdf)
    rough machined, sintered, HIPped. and final machined. Post HIP can be applied to a variety of powders, but. may be best suited for materials with higher melting points such as car-. bides and ceramics. Sputtering Targets. Targets are made from high-purity metal and. ceramic powders, and are used in thin
  • Medical Device Link .
    in coating thickness. To achieve the desired uniformity, the technique known as microfusion eliminates a separate evaporator and ion gun and replaces them with a process based on magnetically coupled "unbalanced magnetron sputtering." As can be seen in Figure 2, two magnetrons are positioned opposite

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