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  • Epoxy
    an addition reaction. Shrinkage during polymerization of epoxy resins is extremely low. The most widely used epoxy resins are based on the reaction of epichlorohydrin with bisphenol-A. The reaction ratios of these two constituents can be varied to produce products ranging from low-viscosity liquids to high
  • Tech Tip 25 - Dielectric Properties of Epoxies
    between two conductors (as in cross over and multi-layered circuits) and for encapsulating circuits. Dielectric properties, specifically for epoxy adhesives, refer to the electrical properties of a material.
  • Filled UV Curable Epoxy Provides Low CTE For Electronic Potting and Encapsulating
    , the resin and the catalyst (hardener). Epoxies, Etc... has developed a unique low CTE Ultraviolet Curable Epoxy that has many benefits over its two component counterparts.
  • Epoxy Value On-Line Monitoring with a ChemView (R) Photometer
    Purpose: To measure epoxy value and starting liquid resin content with the two-probe Simulplex TM ChemView (R) photometer and fiber optic insertion probes with simple, easy-to-maintain, linear calibrations. Approach: The NIR peak at 2208 nm is traditionally used to measure epoxy value. However
  • Tech Tip 17 - Identifying Particles in an Epoxy Adhesive Using Hegman Gauge Analysis
    For wet particle analysis, a Hegman Gauge (sometimes referred to as a grind gauge) is. frequently used to determine the fineness of the grind and to analyze different types of particles within an epoxy matrix. The test involves a flat, stainless steel block with two top channels, decreasing
  • Crash-Resistant Two-Component Adhesives for Repairs (.pdf)
    For the past ten years or so, specially flexiblilised one-component epoxy structural adhesives have been used alongside conventional joining methods in vehicle body shells. As well as offering a significant increase in stiffness, these adhesives also produce highly durable bonds and improve
  • Life Test Stability/Aging Data Obtained from Two Studies (.pdf)
    To prepare the product for testing, Cornerstone Sensors' customer assembled Cornerstone's T021D103.02.H leadless chip thermistors into the customer's package. The customer used propriety methods to mount the thermistors with conductive epoxy onto the customer's substrate, perform the gold wire
  • Promoter for Increased Bonding of PET and Polyimide with Epoxy Adhesive System (.pdf)
    Creating efficient bonding between two materials is a key requirement in many advanced industrial applications, for example between incompatible materials in a laminate or composite or between a polymer and a curable lacquer on a display screen. The ONTO (R) technology provides a range of effective

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