Products/Services for UMTS Chipset Vendors

  • Chipsets-Image
    Chipsets - (44 companies)
    Chipsets are single chips that provide many of the functions of a motherboard. Generally, they integrate the clock generator, bus controllers, system timer, interrupt controller, DMA controller, CMOS/RAM clock, and keyboard controller functions...
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  • PC/104 Modules-Image
    PC/104 Modules - (134 companies)
    PC/104 modules are tied to the integrated system architecture (ISA) bus standard that is used mainly in embedded systems. Modules are 3.6 " x 3.8 " and can be self-stacked to save space.
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  • Computer Motherboards-Image
    Computer Motherboards - (318 companies)
    ...motherboards. Choices include processors from Intel and AMD. Computer Motherboard Specifications. In addition to CPU type, computer motherboards carry product specifications for processor socket, chipset type, maximum speed, and memory capacity. Types...
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  • Single Board Computers (SBC)-Image
    Single Board Computers (SBC) - (310 companies)
    ...include chipset type, features and environmental parameters. Common Bus Choices. Common bus choices for single board computers include ISA or EISA, STD bus, PCI, PMC bus, VME bus, VXI or VMI bus, PXI bus, CompactPCI, Multibus (I &II), PCMCIA (PC card...
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  • FireWire® Products-Image
    FireWire® Products - (68 companies)
    FireWire products use an interface standard developed by Apple Computer and adopted by the IEEE for very fast digital data transfers. FireWire, a registered trademark of Apple Computer, is a communications protocol for the transmission of data, video, and audio over a single cable at very high bit rates.
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    QPSK Modulators and BPSK Modulators - (27 companies)
    Quadrature phase shift keying (QPSK) modulators and binary phase shift keying (BPSK) modulators are used to change certain characteristics (amplitude, frequency or phase) of a carrier signal in order to transmit information. The changes in the parameter(s) of the carrier are made in accordance with an information-bearing signal (modulation signal).
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    Heat Pipes - (56 companies)
    Heat pipes are self-contained heat pumps that can transport heat at high rates over fairly substantial distances with no external pumping power.
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    I/Q Modulators and I/Q Demodulators - (64 companies)
    I/Q modulators and I/Q demodulators change the amplitude, frequency, or phase of a carrier signal in order to transmit information. I/Q modulators split an incoming data stream into its in-phase (I) and quadrature (Q) components, mix the resulting signals with local oscillators that are 90 o apart in phase, and then combine the outputs vectorially in a 0 o mixer.
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    Heat Sinks - (390 companies)
    Heat sinks are thermally conductive, usually metallic components or devices that absorb and dissipate heat generated by electronic components such as computers. Common heat sink materials include aluminum, copper, and steel.
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    Temperature Indicators - (465 companies)
    Temperature indicators are designed for temperature monitoring and analysis. These devices either come equipped with an integral sensor, or require sensor input.
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  • Interconnecting IPv6 wireless sensors with an Android smartphone in the Future Internet
    To enhance the overall user experience with IPv6 inter- networking on a smartphone, improved IPv6 support must be offered from mobile network providers, as well as the vendors of GPRS/ UMTS radio chipsets .
  • Wireless Communications Networks for the Smart Grid
    3G Cellular (CDMA2000, EDGE, UMTS , HSPA+) Expensive infrastructure already widely deployed, stable and mature; Well standardized; Equipment prices keep dropping; Readily available expertise in deployments; Cellular chipset very inexpensive; Large selection of vendors and service providers Utility must rent the infrastructure from …
  • Challenges and research opportunities in wireless communication networks for smart grid
    CDMA2000, EDGE, UMTS , HSPA+) Wide area wireless networks for voice, video, and data ser- vices … … infrastructure already widely deployed; stable, mature, and well stan- dardized; very inexpensive chipsets , and equipment prices keep … … deployments; large selection of vendors and service providers A …
  • 3GPP LTE: The Future of Mobile Broadband
    The GSMA, UMTS Forum, 3G Americas and other global organizations have reiterated their support of the 3GPP … Additionally, the LTE/SAE Trial Initiative (LSTI) has provided support through early co-development and testing of the entire ecosystem from chipset , device and infrastruc- ture vendors .
  • IPWireless Standardizes on ARC's Patented Configurable Core Technology for 3G Data Communications Chipset
    … a full range of commercially available network solutions and devices based on the UMTS standard, IPWireless allows … The IPWireless Partner Program and chipsets allow device manufacturers and infrastructure vendors to very quickly bring innovative new TD-CDMA solutions to market.
  • S3 and Percello Collaborate to Produce Latest Femtocell Baseband Processor
    … today announced that they completed all of the Integrated Circuit(IC) implementation for Percello’s latest PRC6000 chipset . Percello, a UMTS /LTE femtocell SoC vendor , produce femtocell baseband processors and chose S3 because of their proven expertise and experience in delivering first-time-right designs.
  • Federal Appeals Court Sees Potential Antitrust Violation in Standardization Skullduggery
    Qualcomm, a US chipset manufacturer, supplies some of the essential technology that ETSI ulti- mately included in the UMTS standard, and holds patents on its technology. It is ETSI’s policy to require a commitment from vendors whose technologies are included in its standards …
  • Spirent Communications Advances Certification Of Assisted GPS Devices With Industry's First Fully Validated Test System
    Sunnyvale, CA - Spirent Communications plc, a global provider of performance analysis solutions, maintains its leadership in Assisted GPS (A-GPS) testing by becoming the first test system vendor to validate all the … … test standards on its UMTS Location Test System (ULTS). Mobile device manufacturers, chipset vendors and mobile operators now have access to a single test platform that …
    For example, as mentioned in the industry analysis section, the convergence of multiple 3G chipsets (e.g., CDMA2000, WCDMA, UMTS , etc.) into a single 4G technology (i.e., LTE) creates the potential for larger volumes in the converged market. 69 Some vendors that provide this functionality are: certicom, cellcrypt, koolspan, fortress technologies, etc. 70 Reference Chapter …
  • Moving Beyond 3G [Mobile Radio]
    With the release of UMTS 1.7GHz/2.1GHz solution, Huawei claims that its UMTS solutions can support more extended bands than those of any other vendors . … has announced that dual-mode 3G TD-SCDMA/GSM operation has been achieved on ADI’s SoftFone-LCR chipset .