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  • Labthink A001-2007 Test Methods for Organic Vapor Transmission Rate through Plastic Film ands Sheet
    This isostatic test method covers the determination of organic vapor transmission rate through plastic films and sheeting using Flame Ionization Detector (FID) of gas chromatography method. This method is applicable to materials such as plastic films (including laminated plastic film) and sheeting
  • Vacuum-formed films for fit and function
    for pharmaceutical research, and in food processing. Market demand for thin-gauge, highperformance films has increased as electronics become more mobile, smaller, and have increased functionality. Electronics OEMs use thin-polymer films to provide vapor barrier and electrical insulation, as well as to replace
  • Effect of Pressure Difference on Permeability Test for Plastic Film
    differential pressure and barrier properties based on the actual test data. Barrier properties of packaging material play an important role in food and pharmaceutical packaging. Barrier properties include the gas permeation and water vapor permeation. There are different methods to test
  • The First Choice for Water Vapor Permeability Test of Drug Packaging-Weighing Method
    Abstract: Test methods of water vapor permeability test of drug packaging and the data relationship of various test methods, the relationship between and developmental direction of weighing method and desiccant method. Water vapor permeability is an important index in evaluating barrier property
  • Medical Device Link . Gas Permeability and Medical Film Products
    For many years, glass, paper, and metal were the dominant primary materials for packaging food, beverages, and medical products. However, over the past several years, high-barrier plastics have increasingly replaced these conventional packaging materials. It has become important to understand
  • Medical Device Link .
    are extruded to form self-supporting films, which can be designed for lamination to textile fabrics. The TPE film serves as a barrier membrane to dust or biohazards such as blood-borne pathogens, while still allowing perspiration to escape a process referred to as water-vapor transmission (WVT
  • MICRO: BEOL Equipment
    metallization is an important issue in future semiconductor device manufacturing. As feature sizes shrink, narrow copper trenches need ultrathin barriers because of their resistivity specifications: a thick barrier would consume a disproportionately large area of the cross-section of the trench
  • MICRO: TechEmergent
    Kai Frohberg, Katja Huy, and Hartmut Ruelke, Kaihan Abidi Ashtiani, Josh Collins, and Juwen Gao, As device dimensions shrink to <45 nm, the traditional method of fil- ling contacts and vias using titanium/titanium nitride (Ti/TiN) liner/barrier films may no longer be extendable. PVD Ti liners

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