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  • Description: Contour and roughness measurements in one step, upgradeable to full CNC

    • Measurement Capability: 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
    • Standards Compliance: ASME, ISO / EN, DIN, JIS, Other
    • Technology: Contact / Stylus Based
    • Mounting / Loading: Benchtop

  • Description: Fast 3D noncontact robust factory floor profilometer, roughness AND form

    • Technology: Non-contact - Optical / Laser
    • Form Parameters: Flatness, Step Height, Thickness, Warp / Bow
    • Standards Compliance: ASME, ISO / EN, DIN, JIS
    • Industrial Applications: Aerospace / Defense, Automotive, Coatings (Thin Films, Plating, etc.), Displays / FPD, Electronics, Mechanical Parts (Bearings, Shafting), Medical, MEMS, Nanomaterials, Optics / Photonics, Precision Machining / Grinding, Semiconductor Manufacturing, Storage Media, Other

  • Description: , the MarSurf M 400 fulfills the needs on the shopfloor and in production and the measuring room. Especially skidless tracing with the skidless probe BFW 250 and the drive unit SD 26 enable the measurement and evaluation of not only the roughness depth but also waviness and profile criteria. The magnetic

    • Surface Metrology: Surface Profilometry
    • Measurement Capability: Roughness Parameters (Ra, RMS / Rq, Rz, etc.)
    • Standards Compliance: ASME, ISO / EN, DIN, JIS, Other
    • Technology: Contact / Stylus Based

  • Supplier: Polytec, Inc.

    Description: Roughness (Ra) overthe full surface with results comparable to an AFM, but in a fraction of the time. You can achieve repeatablenano and micro waviness measurements when measuring the same target on different machines and the capability to not only find defects, but to classify nano-pits

    • Measurement Capability: 3D / Areal Topography, Defects / ADC, Flatness, Runout, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Thickness, Waviness Parameters (Wa,Wt )
    • Standards Compliance: ASME, ISO / EN
    • Technology: Non-contact - Optical / Laser
    • Mounting / Loading: Floor / Free Standing

  • Description: Modular machine concept and a wide variety of probes for any measuring problem High-precision shop floor measurements for quickly adapting the manufacturing process Large measuring volume Large weight capacity of the rotary table

    • Technology: Contact / Stylus Based
    • Form Parameters: Coaxiality, Cylindricity, Differential / Taper, Flatness, Eccentricity / Concentricity, Parallelism, Roundness, Runout, Squareness / Angularity, Straightness
    • Standards Compliance: ISO / EN, DIN
    • Industrial Applications: Other

  • Description: profiler and surface analysis system utilizes numerous platform and measurement technologies from KLA-Tencor's most advanced semiconductor profiler systems for surface topography analysis - programmable scan stage, low noise, and high quality, high resolution long scans -- but in a smaller, more

    • Surface Metrology: Surface Profilometry
    • Measurement Capability: 2D / Line Profiles, 3D / Areal Topography, Roughness Parameters (Ra, RMS / Rq, Rz, etc.), Waviness Parameters (Wa,Wt )
    • Technology: Contact / Stylus Based
    • Industrial Applications: Coatings (Thin Films, Plating, etc.)

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Conduct Research Top

  • Beyond Roughness (.pdf)
    and the reasons for doing so go far beyond roughness. ./724ba9e8-bf29-4909-912a-f1f905773451 Quality 101. 3 This measuring system combines. roughness and contour measurements. into a single, integrated system. Using. a single drive unit and incorporating a. laser interferometer within the gage
  • Surface Analysis: Beyond Roughness
    and the reasons for doing so go far beyond roughness. In fact, many experts choose to use the terminology of "surface texture" rather than simply calling these characteristics "roughness.". Some measurements determine how a surface will bear loads, while others determine how well a surface provides
  • Medical Device Link .
    . Rq = the maximum peak-to-valley distance. Rz = the average absolute value of the five highest peaks and the five lowest valleys over the evaluation length. Wa = waviness or the arithmetically averaged roughness, i.e., the average deviation of all points from a plane fit to the waviness data
  • Choosing the Most Suitable Shape Parameter in Morphological Analysis (.pdf)
    . The compactness factor reflects the ratio between the surface of. the particle and the surface of the smallest rectangle that can. contain it. W. A. Compactness factor = W x H. Figure 2: Length characteristic of the. smallest rectangle containing the particle. where A is the surface of the particle