Products & Services

See also: Categories | Featured Products | Technical Articles | More Information
Page: 1

Conduct Research Top

  • The Role of Wafer Bonding in 3D Integration and Packaging (.pdf)
    There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent
  • Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf)
    Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of TSVs (through silicon vias) is used for 3D IC stacking of individual layers as well as in 3D
  • Local Plasma Treatment in a Mask Aligner for Selective Wafer Surface Modification (.pdf)
    Plasma pre-treatment for low-temperature direct wafer bonding is used worldwide in many different applications. In this process the full wafer surface is exposed to the plasma. Recently, a new process for selective plasma treatment has been developed by the FraunhoferIST and SUSS MicroTec
  • | Electronics Industry News for EEs & Engineering Managers
    ST opens automated assembly line in Malaysia, pushes ahead in Singapore As planned, Don Brooks leaves UMC post TI closes $1.2 billion stock acquisition of Unitrode QuickLogic's IPO includes 3.3 million shares offered by Cypress SiGen teams with Electronic Visions on SOI wafer bonding system DSP
  • | Electronics Industry News for EEs & Engineering Managers
    ASE to surpass Amkor in IC-packaging market, says report Merger rumors in foundry biz SiGen, EV Group forge wafer bonding alliance Apple cites Oxford Semi's ARM chip in Firewire drive failures Suppliers get hopeful for 2004 Tronics Microsystems opens Grenoble MEMS wafer fab Struggling Trikon raises
  • MICRO:Industry News:Order Desk (Feb 99)
    a wafer-bonding tool from Electronic Visions of Phoenix. Motorola's automotive and industrial electronics group in Northbrook, IL, will use the system to manufacture micromachined sensors using anodic
  • Thermal Design Considerations for High-Power Single-Chip LEDs
    requiring high lumen output in a small area. By using photonic lattice technology, advanced wafer bonding techniques and high-power packaging technology, these devices can easily be made more than ten times (10X) larger than conventional LED power chips and can be driven reliably at much higher current
  • Failure Analysis of Die Bond Adhesion Failures Caused by Silicone Contamination
    used to mount the wafer during the die sawing operation. The analytical equipment and methodology used to determine the failure mechanism are described. Auger Electron Spectroscopy and X-ray Photoelectron spectroscopy are used to identify the elements and their chemical states on the die bonding

More Information Top

Lock Indicates content that may require registration and/or purchase. Powered by IHS Goldfire