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Supplier: Epoxy Technology
Description: include long pot-life, low viscosity and high thixotropy making it ideal for wafer level stamping as well as syringe dispensing.
- Use: Die Bonding Adhesive / Compound
- Form: Grease / Paste
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking
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Wafer and Thin Film Instrumentation (377 Companies)
Semiconductor Equipment Repair Services (46 Companies)
Electronic and IC Packaging Services (116 Companies)
Featured Products for Wafer Bonding Top
Measurement of Doped Wafers and TSVs
Sensors with submicron height resolution easily serve these typical applications: Wafer thickness on nearly all materials. Topographical measurements on structured samples. Mask thickness. Quality assurance on bondings (length of leads etc.). Measurement of coating thickness. Because of the small spot size, it is possible to use the CHRocodile sensors for measurement on any portion of the wafer, even at the edge. With the high speed and dynamic range, it is also possible to collect large volumes... (read more)
Browse Wafer and Thin Film Instrumentation Datasheets for Precitec, Inc.
Visible and Nonvisible Imaging Techniques
and transmission of the nonvisible wavelengths. Near-IR is used in MEMS manufacturing and in wafer bonding to view the interior of a device to make sure it is sound and fault-free. This is possible because of the transparency of silicon and other substrates at near-IR wavelengths. Using near-IR, fast nondestructive inspection and measurement can be carried out in minutes without the need for any time-consuming or costly sample preparation. Additional demands from the MEMS market are for improved... (read more)
Browse Imaging Workstations Datasheets for Olympus IMS
Fast Measurement for Semiconductor & PV Material
of sensor and probe configurations designed for nearly all materials. Some typical applications are: wafer thickness during grinding, polishing or etching. measurement of structures on semiconducturs, manufacturing of masks. quality assurance on bondings (length of leads etc.). measurement of coatings. determination of layer thickness. Real time measurement of thickness during the processing phase can eliminate waste, reduce overhead and ultimately improve your end product. Contact us for more... (read more)
Browse Process Monitors Datasheets for Precitec, Inc.
. GLASS INDUSTRY. Wall thickness of bottles. Glass thickness. Surface features or defect detection. Foils with sandwich layers. Flat glass inline monitoring, even at extreme temperatures of 700 °C. SEMICONDUCTOR. Wafer thickness from a single side. Measurement of structures on semiconductors. Manufacturing of masks. Quality assurance on bondings. Measurement of transparent coatings. Determination of varnish thickness (e.g. photo lacquer or damping layer on ICs). MEDICAL. Surface analysis... (read more)
Browse Surface Metrology Equipment Datasheets for Precitec, Inc.
PremaTech Advanced Ceramics
How clean are your parts?
The semiconductor industry demands and expects to receive high quality parts that are not only dimensionally accurate but clean … ….semi- conductor clean. We utilize ultrasonic cleaners and hot de-ionized water to ensure our parts are free of all contaminants, grinding fluids, handling marks and fingerprints. When we say clean, it is clean! Although our system was developed to comply with semi-conductor industry requirements, we use the equipment whenever our customers are bonding... (read more)
Browse Production Machining Datasheets for PremaTech Advanced Ceramics
PC Series Conveyor Ovens
and uses 99.97% efficient HEPA filters on recirculation air. Applications: Clean process applications. Wafer-level cure processes. Curing PTFE parts and adhesives. Epoxy curing. Chip packaging - Adhesive cure. PC Series Class A Conveyor Ovens. For use with Flammable solvents - The PC Series Class A conveyor ovens are specifically designed for use with flammable solvents and volatiles. Industrial construction is rugged enough for the most demanding and critical applications. Applications... (read more)
Browse Ovens (Industrial) Datasheets for Despatch Industries
Parts by Number for Wafer Bonding Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|BY-WV-2-30-85-SR||Global Industrial||Avk Carbo-Bond/Bitorq Valve Automation||Not Provided||3" Wafer Style Butterfly Valve W/ Viton Seals And Spring Return Pneum. Actuator|
|BY-WN-2-40-100-SR||Global Industrial||Avk Carbo-Bond/Bitorq Valve Automation||Not Provided||4" Wafer Style Butterfly Valve W/ Buna Seals And Spring Return Pneum. Actuator|
|BY-WE-2-20-200-A-4-P1||Global Industrial||Avk Carbo-Bond/Bitorq Valve Automation||Not Provided||2" Wafer Style Butterfly Valve W/ Epdm Seals And Nema 4 115vac Electric|
Conduct Research Top
The Role of Wafer Bonding in 3D Integration and Packaging (.pdf)
There are numerous process integration schemes currently in place for the implementation of 3D-IC. Via first, via middle, via last along with back end of line (BEOL), front end of line (FEOL) and other variations of these approaches. This work will explore the role of wafer bonding, both permanent
Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf)
Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of TSVs (through silicon vias) is used for 3D IC stacking of individual layers as well as in 3D
Local Plasma Treatment in a Mask Aligner for Selective Wafer Surface Modification (.pdf)
Plasma pre-treatment for low-temperature direct wafer bonding is used worldwide in many different applications. In this process the full wafer surface is exposed to the plasma. Recently, a new process for selective plasma treatment has been developed by the FraunhoferIST and SUSS MicroTec
Balancing Electrical and Thermal Device Characteristics - Thru Wafer Vias vs. Backside Thermal Vias
or minimize the device thermal resistance. substrate (2) and covering the sidewalls with Au in a typical. The device design/process strategies include “flip-chip”. thru-wafer via process. bonding, using metal heat shunts, thru-wafer via (TWV). holes connected to the device through large metal plates[2
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly (.pdf)
size, commensurate with the. • Download. The strength and uniformity of the. article. increase in wafer diameter onto which bond between the target material and. • Share with. the refractory metal is to be deposited. backing plate are critical, as well as the. a friend. Specifically, as wafer
EETimes.com | Electronics Industry News for EEs & Engineering Managers
ST opens automated assembly line in Malaysia, pushes ahead in Singapore As planned, Don Brooks leaves UMC post TI closes $1.2 billion stock acquisition of Unitrode QuickLogic's IPO includes 3.3 million shares offered by Cypress SiGen teams with Electronic Visions on SOI wafer bonding system DSP
EETimes.com | Electronics Industry News for EEs & Engineering Managers
ASE to surpass Amkor in IC-packaging market, says report Merger rumors in foundry biz SiGen, EV Group forge wafer bonding alliance Apple cites Oxford Semi's ARM chip in Firewire drive failures Suppliers get hopeful for 2004 Tronics Microsystems opens Grenoble MEMS wafer fab Struggling Trikon raises
MICRO:Industry News:Order Desk (Feb 99)
a wafer-bonding tool from Electronic Visions of Phoenix. Motorola's automotive and industrial electronics group in Northbrook, IL, will use the system to manufacture micromachined sensors using anodic
Engineering Web Search: Wafer Bonding Top
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Unique in-situ aligned wafer bonding machines & services for IC, MEMS, Compound, Semiconductor & PV Industries
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Wafer Bonding System offers single station bonding.
Silicon on insulator - Wikipedia, the free encyclopedia
Wafer bonding[10[11 â?? the insulating layer is formed by directly bonding oxidized silicon with a second substrate.