Supplier: Grainger Industrial Supply
Description: Compression Tool, Lever Action, Cut No, Strips No, Capacity Coax 6/59, Length (In.) 7, Characteristics Yellow, Non-Adjustable, One-Handed Operation, Handle Clip, Integrated Connector Insertion Feature, Application Attaches RCA, BNC, and F-type Compression Connectors Used On RG-7 -11 and Mini-Coax
- Tool Type: Crimper
- Form Factor: Handheld
- Application / Connector Type: Coaxial
Supplier: Newark / element14
Description: PRO XL COMPRESSION TOOL; For Use With:Ideal BNC, F-Type, RCA, RG11 Mini Coax Connectors
- Tool Type: Crimper
Supplier: Visual Sound, Inc.
Description: Kramer Electronics USA, Inc. Compression connectors for RGB, RG-6 & RG-59 Cables Available models: CONNECTOR BNC 1 RGB Compression BNC Connector for 26-28 AWG Mini Coax Cable - Orange Coded CONNECTOR BNC RG-59 Compression BNC Connector for RG-59 Coax- Yellow or red Coded CONNECTOR BNC RG-6
Supplier: Howard Computers
Description: Quickly customize the length of your home theater or broadcast video cables with these connectors. Nickel-plated brass provides years of reliable service. These connectors are a breeze to install and more reliable than traditional hex crimp RCA connectors. Simply prepare 3- or 5-conductor miniature
- Connector Type: RCA
- Gender: Male / Plug
Supplier: Advance Security Products
Description: 1 piece BNC compression fitting for RG59. The BNC RG59 Compression Connector for Coax features 360-degree true radial compression. Made from precision-machined annealed brass with an anti-corrosion nickel-plated finish, this connector offers a plastic insulator and an Integral center contact. If you
Supplier: MilesTek Corporation
Description: MilesTek's high-quality compression connectors are the perfect solution for all of your RG59 coaxial terminations. Connector Features and Benefits: Unique inspection window assures correct placement of connector on cable Colored identification band helps you match the right connector to the right
- Connector Type: RCA
- Mounting Style: Cable End
- Number of Contacts: 1
- RoHS Compliant: Yes
Supplier: Softchoice Corporation
Description: Quickly customize the length of your home theater or broadcast video cables with these connectors. Nickel-plated brass provides years of reliable service. Barbs within the connector center pin provide a reliable signal path, and ensure a positive connection to the cable's center conductor. These
Supplier: Tributaries Cable
Description: Nickel-plated RCA connector for mini coax One piece, visible entry design Color coded violet for 23AWG TRIBMINI coax Universally fits TRIBMINI1, TRIBMINI3 & TRIBMINI5 75 ohm impedance 360° radial compression connection Durable connection can withstands 80lb pull test Sold in pack/25 each
Supplier: Computer Network Accessories, Inc.
Description: Includes RG59/6/F/RCA/BNC compression tool, cable cutter, 2 blade coax stripper for RG58/59/6 cable, (4) F male for RG59, (4) RG6, (3) BNC male for RG6, (3) RCA male for RG6.
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MEMS Inspection and Testing
tests). Electrical functional MEMS testing is a process used to sort and/or mark die on wafers based on electrical performance. Wafer sorters or probes preform functional tests on dies in wafers or on packaged MEMS or IC devices. Functional tests verify the operation of all device functions
More Information on: Wafer Die Sorter Top
Automated module fabrication
The die sorter uses the updated wafer map to remove the good die from the wafer frame.
Low cost high-speed flip chip assembly processing
In use, die are transferred by automated means (employing well known die bonder and die sorter technology) from diced wafers to individual virtual boundary compartments (sites) in the carrier tape.
Selecting methods for packing, shipping, and handling of low cost good die
The wafer required for direct wafer -to-substrate transfer must be in the same form as that presented to die sorters and die bonders used to assemble die to lead frames prior to encapsulation as a packaged IC; e.g. SOIC, PLCC...
New Series of Embedded Vision Engines First to Feature Industry Standard OS for True Real-Time Automated Machine Control
This makes the vision engine ideal for integration into semiconductor and electronics manufacturing equipment, such as wafer handlers/robots, cluster tools, wafer probers, as well as a variety of back-end IC manufacturing equipment, including die sorters , die/wire bonders, IC test handlers, and...
Application of Two Hopfield Neural Networks for Automatic Four-Element LED Inspection
The dimensions of a die are about 40 × 40 pixels in the acquired wafer image, which was provided by an LED sorter manufacture in Taiwan.
Embedded vision engines offer choice of Windows CE or embedded NT
It was designed for use in a wide variety of automated semiconductor and electronics manufacturing equipment, such as robotic wafer sorter /handlers, cluster tools, wafer probers, as well as in back-end IC manufacturing equipment, including die sorters, die/wire bonders, IC test...
New ruggedized embedded vision engines offer choice of Windows CE or embedded NT
NetSight was specifically designed for use in a wide variety of automated semiconductor and electronics manufacturing equipment, such as robotic wafer sorter /handlers, cluster tools, wafer probers, as well as in back-end IC manufacturing equipment, including die sorters, die/wire bonders, IC...
Research on LED die geometric parameter measurement based on shape recognition and sub-pixel detection
LED manufacturing equipments such as the LED wafer saw, the LED mapping sorter and the LED- die bonding machine are all through visual image processing and analyzing to detect LED die geometric parameters which are used to control the motion platforms and...
Automatic detectand match of LED dies basing on position relations betweenadjacent dies
During the inspection, dies may be broken, fragmentized, tiny moved, or deflected slightly, besides, visual scan can also lead to location deviation when the wafer is moved from prober to sorter .
A case study of applying regional level-set formulation to post-sawing LED wafer inspection
An LED sorter manufacturer in Taiwan provided the fol lowing minimum inspection requirements before die pack aging (glue dispensing): 1) 100% probing tested: The probing test is first automat ically performed on all dies on the wafer with a step-probing machine.
The kinematic design of a planar-cam type pick-and-place device
...also played an important role in the packaging equipment for handling chips from wafer to substrate, tray... Die bonders, chip sorters , and flip-chip bonders are some of the machines that the pick-and-place devices are fre- quently used for the packaging process of semicon- ductor and opto-electronic industry.
On the cost-effectiveness of matching repositories of pre-tested wafers for wafer-to-wafer 3D chip stacking
A wafer map contains the per- die pass/fail results of pre-bond tests [16, 17]. ...to be sorted before being stacked, e.g., with one of many wafer sorter machines that are...
Study on path-optimization by grade for sorting dies
MECHANICAL STRUCTURE OF DIE SORTER Usually, dies are adhered to wafer tape.
Evolution of Supply Chain Management
Intelligent software can specify lot/FOUP (Front Opening Unified Pod called Carrier) splits and merges, and then, if a wafer sorter is attached to the stocker, the wafer transfers can be done while lots are waiting to be processed. The complexities of die /panel, wafer, lot, FOUP, and reticle control are even greater for foundries.
Automatic measurement and grading of LED dies on wafer by machine vision
The dies on the wafer are graded in computer A based on the measurement data, and the position data are displayed on the screen for monitoring (Fig. 9). ...will also be used in the sorting process for the gripper in the sorter to distribute the...