Products/Services for Wafer Ink
Industrial Inks - (361 companies)
Semiconductor Foundry Services - (195 companies)
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Wafer and Thin Film Instrumentation - (379 companies)
No Image AvailablePressure Indicating Films - (10 companies)How to Select Pressure Indicating Films. Pressure indicating films use microencapsulated inks or transfer coatings to visually indicate, measure, and/or map the contact stress or pressure changes across a surface. They consist of one or two sheets... Learn More
Ink Jet Printers - (505 companies)
Ink and Toner Cartridges - (265 companies)...and services. For example: Ink refill kits. Bulk inks. Ink refill machines. Photo papers. Label stock. Greeting card stock. Business card stock. Specifications. Ink cartridges and toner cartridges are available from a variety of manufacturers... Learn More
Resurfacing, Recoating, and Refinishing Services - (307 companies)...or decomposition of a precursor substance on a wafer or other substrate. This results in a deposited coating on the surface of the substrate. CVD processes are used to create semiconductors integrated circuits and solar cells, to coat certain metals (including... Search by Specification | Learn More
Air Heaters - (418 companies)
Product News for Wafer Ink
AL120 Wafer Handler The NEW AL120 wafer handler series transfers both silicon and compound semiconductor wafers from the cassette to the microscope stage with enhanced capabilities and flexibility, while maintaining an ergonomic design. Continuing the world-renowned performance and reliability of previous Olympus wafer handlers, the AL120 now transfers wafers with thicknesses down to 90µm to specifically meet the demands of thin wafer manufacturers. The new system offers 360-degree rotation, for full macro... (read more)Browse Specialty Microscopes Datasheets for Olympus IMS
MTI Instruments Inc.
Wafer Metrology Measurement Tool The Proforma 300SA is a semi-automated thickness measurement system for both semiconducting and semi-insulating wafer materials. Capable of handling 150mm, 200 mm and 300mm wafers, the 300SA provides highly accurate, repeatable measurements of thickness, TTV, bow, warp, site and global flatness. Built around MTI Instruments' exclusive Push-Pull capacitance technology, the Proforma 300SA delivers full wafer surface scanning at the press of a button. User defined and ASTM/SEMI scan patterns... (read more)Browse Wafer and Thin Film Instrumentation Datasheets for MTI Instruments Inc.
Check-All Valve Mfg. Co.
Wafer Insert Valve The WV is designed to fit between two mating ANSI flanges. Two gaskets are required, instead of one that is normally used. The valve body fits inside the bolt circle for quick installation and removal in rigid piping applications. Many valves in this series meet API 594 requirements. Simply change the spring settings and you can use the WV as: Check Valve. Low Pressure Relief Valve. Vacuum Breakers. Consult the factory for complete details. Available Materials. 316 Stainless Steel (SS). Carbon... (read more)Browse Check Valves Datasheets for Check-All Valve Mfg. Co.
Wafer Carriers in Sapphire Insaco, Inc has become recognized as a worldwide leader in custom machined ceramic and sapphire parts for the semiconductor industry. Through this experience, Insaco is now able to offer multiple hole wafer carriers in sapphire for GaAs and other semiconductors. •Superior chip resistance. •Chemically resistant to all reagents used in processing. •Scratch resistant. Harder than any other optical material except diamond. •Transparent. •Durable. Withstands repeated... (read more)Browse Machine Shop Services Datasheets for Insaco, Inc.
Semiconductor Wafer Processing Nesting Specialty custom machining of sapphire and ceramic wafers allows Insaco to respond to customer needs for nesting of wafers in larger carriers. Insaco capability to machine and jig grind precise features to extreme tolerance in ceramic materials allows developmental engineers in the semiconductor and compound semiconductor industries to handle small process wafers on a large wafer line. Insaco is a precision machining company that fabricates parts from all technical ceramics, sapphire and quartz... (read more)Browse Glass Fabrication Services Datasheets for Insaco, Inc.
GF Piping Systems
Wafer Check Valve Offering expanded application versatility, GF Piping Systems has introduced the Type 369 Wafer Check Valve, the company's first check valve to be offered in sizes as large as 12-inches. This feature, combined with its simple installation ability, unique spring option for horizontal mounting, and excellent flow characteristics, make it an ideal check valve solution for a variety of applications. Suitable uses include aquatics, chemical processing, municipalities, water and wastewater treatment... (read more)Browse Check Valves Datasheets for GF Piping Systems
MTI Instruments Inc.
Cost-effective manual wafer measurement The Proforma 300i is a portable non-contact manual wafer inspection system for thickness, total thickness variation (TTV) and bow measurements. Capable of measuring sizes up to 300mm, the on-board intelligence provides fast, accurate, repeatable measurements for all types of wafer materials. Using MTI's proprietary non-contact capacitance probes, the Proforma 300i is fast, accurate and reliable. The Proforma 300i is capable of storing data directly to a USB flash drive. It also comes... (read more)Browse Wafer and Thin Film Instrumentation Datasheets for MTI Instruments Inc.
CMP Wafer Polishing Pressure Distribution The I-Scan ® system provides the diagnostic tools necessary to evaluate, view, and balance the forces acting on a silicon wafer during the polishing process. A study was conducted to collect and analyze the pressure distribution under a polishing head. Using a unique I-Scan pressure sensor with a sensing area of 9 1/2" X 9 3/4", measurements were taken to determine the pressure distribution of the polishing head and the wafer interface. Balancing these pressures during machine set-up can... (read more)Browse Tactile Pressure Sensors Datasheets for Tekscan, Inc.
MEI Solar Wafer Cleaning Equipment Automated Solar Wafer Cleaning. Dry to Dry High Throughput, Process Multiple Lots and Recipes Simultaneously. The MEI Solar Evolution high throughput wet processing systems are in-line, configurable, automated, modular, linear batch immersion systems made for high throughput at a low cost. They are designed to clean photovoltaic/ solar wafers for many applications. We also make custom equipment for polysilicon and ingot cleaning, and wafer re-work. For Solar wafer processing, the MEI Solar... (read more)Browse Semiconductor Wet Process Equipment Datasheets for MEI, LLC
JST Manufacturing, Inc.
Single Wafer Etching and Stripping System Single Wafer Etching System. JST's Single Wafer Etching and Stripping System utilizes an automated chemical spray process on a single wafer. The system includes oscillating spray nozzles, adjustable wafer speed (RPM) and precision adjustment of the distance between the nozzles and the surface of the wafer. It's automated dispense from chemical storage reservoir provides repeatible volume and mixing control. Backside rinsing or isolation is also available. The module can be installed... (read more)Browse Semiconductor Wet Process Equipment Datasheets for JST Manufacturing, Inc.
Laser Processing Equipment and Services Contract UV laser micromachining services for a variety of applications range from semiconductor wafer processing to biomedical and blue LED scribing. The company�s core capabilities include expertise in processing materials at UV wave-lengths of 355...
...and then defective dies or chips are marked. Ink marks were traditionally used, but electronic wafer maps are now being employed. Probing instruments are used for in-line parametric or wafer sorting electrical tests on gates, MEMS devices, IC devices or electrical circuits. In-line parametric tests...
...since become a technology that holds much promise for the medical device industry. Today, thousands of pressure or acceleration sensors can be batch processed from a single silicon wafer, and numerous applications for microfabrication techniques have been identified, including sensing or actuating...
...manufacturing at the Hewlett-Packard facility in Corvallis, OR. The article addresses several challenges facing ink-jet MEMS manufacturers, including varying wafer thicknesses, wafer deformation during fabrication, the etching of channels and holes, and the measurement of vertical CDs and custom...
...forms materials unit; Oxford gets Thermo VG; Edlon inks plastics pact with 3P Meeting process and equipment challenges in MEMS deep silicon-etch processes Photomask cleaning tool, wafer transfer/loadlock system, cordless vacuum wafer wand, enclosed adjustable-speed drives, pressure regulator...
...first; FOUP sales set record; Genus sells first ALD tool Seiko Epson inks SOI pact; Partners offer software; Ibis ups wafer capacity; Brooks buys SEMY; Lambda opens service center; Semtech exiting foundry biz; Chem vendors expands to Asia SCP Global Technology, SPIE's Symposium on Microelectronic...
...can be retrofitted to earlier SEMVision systems as well. The I-Scan electronically measures pressure distribution on a silicon wafer during CMP polishing. The system depends on a <0.08-mm-thick, flexible, grid-based sensor composed of conductive and semiconductive inks. A material whose electrical...
11 to 17 ATE consortium signs on TEL, strikes alliance in China 3M sets up service to address CVD, CMP issues : Sumco to become profitable Taiwan index climbs amid surge in chip-outsourcing services TSMC may hike capex to meet huge wafer demand Xerox devises 'semiconductive ink' for flexible TVs...
...alternatives Survey majority sees copper chips coming in volume by 2002 Korean researchers claim new �super silicon wafer� improves yields, lowers production costs SpeedFam-IPEC, Lucid ink water conservation pact; Entegris debuts, signs piping alliance; EKC opens CMP labs; Veeco to buy...
...against the barbs. Figure 1. A fluidic breadboard fabricated using 4-in. silicon/glass wafer pairs. Inset shows schematic of the interlocking finger joints and the rubber gasket held under compression by the two halves of the breadboard. Figure 1 shows the structure of a connector offered by Lee Co...
Engineering Web Search: Wafer Ink
Micro-electromechanical ink ejection mechanism utilizing...
Micro-electromechanical ink ejection mechanism utilizing through-wafer ink ejection -> Monitor Keywords
Method And Apparatus For Printing Conductive Ink invention
After the conductive ink has been printed through the stencil, pneumatic pressure is applied to the stencil from above, and the stage is lowered to
Microelectromechanical systems - Wikipedia, the free...
by the technique of thermal oxidation, in which the (typically silicon) wafer is exposed to oxygen and/or steam, to grow a thin surface layer of
a plurality of ink supply channels defined in a backside surface of the monolithic wafer substrate and extending longitudinally along a backside of
Silicon Ink high efficiency solar cells
Process, a method for making a high efficiency solar cell on a Cz-Si wafer with a proprietary Silicon Ink.
A Non-Contact Dispensing Inker for Dice Marking of Wafer...
A Non-Contact Dispensing Inker for Dice Marking of Wafer Detection
NREL: News Feature - Silicon Ink Is Spot On, NREL Experiments...
Ink can cause a mess, but the Silicon Ink developed by Innovalight behaves itself so well that when it is added to a solar cell it doesn't clump or
See National Renewable Energy Laboratory Information
IBM Technical Journals
The effects of wafer to wafer defect density variations on integrated circuit defect and fault distributions