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Industrial Inks - LOCTITE CT 5030 E&C (Known as HYSOL ECCOCOAT CT5030 Catalyst B97 conductive ink) -- 8799577899009Supplier: Henkel Corporation - Electronics
Description: (Known as HYSOL ECCOCOAT CT5030 Catalyst B97 conductive ink ) LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications. It is electrically conductive, resistant to abrasion, crease resistant and heat resistant. It is alsoShow More
Supplier: Henkel Corporation - Industrial
Description: (Known as HYSOL ECCOCOAT CT5030 Catalyst B97 conductive ink ) LOCTITE CT 5030 E&C is a conductive ink designed to provide thin coating used in shielding and grounding applications. It is electrically conductive, resistant to abrasion, crease resistant and heat resistant. It is
- Substrate / Surface: Metal
- Form: Transfer Tape
- Features: Conductive, Heat Resistant / High Temperature, Wear Resistant (Abrasion / Erosion)
- Industry: Electronics, OEM / Industrial
Network and Communication Chips - RF-HDT-AJLE Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape) -- RF-HDT-AJLE-G1Supplier: Texas Instruments
Description: RF-HDT-AJLE Tag-it(TM) HF-I Standard Transponder Chip (Wafer, bumped, inked, grind, sawn on tape)
- Technology: Wi-Fi / WiMAX / Wi-Mesh
- TJ: -13 to 158 F
Supplier: Swiss Jewel Company
Description: Aperture Wafers are precision controlled orifices where the ID Length is controlled very tightly. Typical Applications: Hematology Instrumentation, Ink Jet Printing, Flow Control.
- Geometry Type: Circular
- Substrate Material: Glass
- Hole Diameter/Slit Width: 40.64 to 1003 µm
- Thickness: 231 to 660 µm
Supplier: Saint-Gobain Surface Conditioning Group
Description: application, or a custom-engineered product can be made if required. Applications: Media Filler: Video and audio tapes, data storage devices, ink jet media Polishing abrasive Thermal management additive Wear resistance additive Metal matrix Structural ceramics
- Type: Polishing
- Products / Materials Finished: Semiconductors / Electronics (Wafers)
- Form: Powder
- Abrasive Grain Type: Aluminum Oxide
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manufacturing at the Hewlett-Packard facility in Corvallis, OR. The article addresses several challenges facing ink-jet MEMS manufacturers, including varying wafer thicknesses, wafer deformation during fabrication, the etching of channels and holes, and the measurement of vertical CDs and custom
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Laser Processing Equipment and Services Contract UV laser micromachining services for a variety of applications range from semiconductor wafer processing to biomedical and blue LED scribing. The company�s core capabilities include expertise in processing materials at UV wave-lengths of 355
EETimes.com | Electronics Industry News for EEs & Engineering Managers
11 to 17 ATE consortium signs on TEL, strikes alliance in China 3M sets up service to address CVD, CMP issues : Sumco to become profitable Taiwan index climbs amid surge in chip-outsourcing services TSMC may hike capex to meet huge wafer demand Xerox devises 'semiconductive ink' for flexible TVs
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alternatives Survey majority sees copper chips coming in volume by 2002 Korean researchers claim new �super silicon wafer� improves yields, lowers production costs SpeedFam-IPEC, Lucid ink water conservation pact; Entegris debuts, signs piping alliance; EKC opens CMP labs; Veeco to buy
Medical Device Link . Microtechnology Opens Doors to the Universe of Small Space
ighly innovative microfabrication techniques have emerged from the laboratory environment during the last decade, creating a new method for developing and producing microstructures and tiny microsystems. What began about 20 years ago with the three-dimensional micromachining of silicon wafers has
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Optical inspection of MOEMS devices using a configurable and suitable for production image processing system
Results are stored in wafer maps which can be directly used for wafer inking .
Semicon West 2013 to Feature Amicra’s Latest Die and Flip Chip Bonders
With its broad product line of semi-automatic (SIS) and fully automatic wafer ink (AIS) systems, Amicra is currently setting industry standards at a dot size down to 125 µm, and for the inking of diced or undiced wafers.
Optimizing the Cost of Test at Intel Using per Device Data
Historically, wafer lots were sorted and a pass/fail decision was documented on each unit via an "ink dot" (hence the term wafer inking ).
"Chevron"-type piezoelectric inkjet actuator
Through an opening in the cover wafer ink is fed into the channels.
These inked wafers are then shipped from the fabrication site to the assembly site.
A framework and architecture for rapid software development: a success story
Savings are incurred by not having to ink wafers to mark faulty dice before sending them to assembly.
Chemical Aspects of Water Quality and Health
&' inking Wafer .