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  • MICRO: Special Apps
    manufacturing at the Hewlett-Packard facility in Corvallis, OR. The article addresses several challenges facing ink-jet MEMS manufacturers, including varying wafer thicknesses, wafer deformation during fabrication, the etching of channels and holes, and the measurement of vertical CDs and custom
  • Medical Device Link .
    Laser Processing Equipment and Services Contract UV laser micromachining services for a variety of applications range from semiconductor wafer processing to biomedical and blue LED scribing. The company�s core capabilities include expertise in processing materials at UV wave-lengths of 355
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    11 to 17 ATE consortium signs on TEL, strikes alliance in China 3M sets up service to address CVD, CMP issues : Sumco to become profitable Taiwan index climbs amid surge in chip-outsourcing services TSMC may hike capex to meet huge wafer demand Xerox devises 'semiconductive ink' for flexible TVs
  • MICRO:Archive:Back Issue TOC
    alternatives Survey majority sees copper chips coming in volume by 2002 Korean researchers claim new �super silicon wafer� improves yields, lowers production costs SpeedFam-IPEC, Lucid ink water conservation pact; Entegris debuts, signs piping alliance; EKC opens CMP labs; Veeco to buy
  • Medical Device Link . Microtechnology Opens Doors to the Universe of Small Space
    ighly innovative microfabrication techniques have emerged from the laboratory environment during the last decade, creating a new method for developing and producing microstructures and tiny microsystems. What began about 20 years ago with the three-dimensional micromachining of silicon wafers has

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