Products & Services
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Supplier: Atmel Corporation
Description: Wafer Level Chip Scale Packaging (WLCSP) refers to the technology of packaging an integrated circuit at wafer level, resulting in a device practically the same size as the die. WLCSP technology allow devices to be integrated in the design using the smallest possible form factor.
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Supplier: KLA-Tencor Corporation
Description: such as MEMS device/cavity seal inspections from both sides of the wafer, sub-surface inspection for shorts, contact/bridge defects, inclusion tracing, as well as alignment offset measurements for wafer-level packaging are now possible with a high throughput process monitor tool. High performance
- Form Factor: Wafer Probing System
- Mounting / Loading: Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers
- Measurement Capability: Defects / ADC
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Description: For hermetic sealing of wafer-level MEMS packaging micro-mechanical devices
- Type: Other
- Setting / Cure Technology: Heat Setting / Thermoset
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Supplier: Plasma Etch, Inc.
Description: , printed circuit boards, connectors, MEMs, nanotechnology, wafer level packaging as well as many other related semiconductor processes.
- Coating System Type: Laboratory / Benchtop
- Technology / Process: Plasma Etching / Cleaning
- Applications & Materials Processed: Semiconductor Manufacturing, Photovoltaic / Solar, Medical, MEMS, Research / Surface Analysis, Other
- Materials Processed (Deposit or Substrate): Metal, Compound Semiconductors / GaAs, Tungsten / Refractory Metal, Other
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Supplier: KLA-Tencor Corporation
Description: from the back side of the wafer and sub-surface review of shorts contact/bridge defects, inclusion tracing, MEMS device/cavity seal inspections, as well as alignment offset measurements for wafer-level packaging. Infrared inspection wavelength range: 1050-1550nm Simultaneous IR review
- Application: Semiconductor Inspection
- Grade: Benchtop
- Microscope Type: Other
- Eyepiece Style: Monocular
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Supplier: DEK
Description: performance means that the technology is ideally suited to a range of demanding manufacturing applications including BGAs, direct chip attach, flip chip and wafer level packaging. Facilitating apertures of 25µm on 50µm pitch, VectorGuard Platinum stencils offer DEK
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Supplier: Epoxy Technology
Description: it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.
- Compound Type: Electrically Conductive
- Material Form: Grease / Paste
- Cure Type / Technology: Thermosetting / Crosslinking, Single Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Correct Products, Inc.
Description: Ideal for packaging semi-conductor wafer boxes, medical devices, cleanroom gowns, gloves or wipes or any other product requiring similar levels of cleanliness. Class 100 Certified.
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Featured Products for Wafer Level Packaging Top
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BAE Systems Imaging Solutions formerly Fairchild Imaging
Quality imaging under extremely low light levels
and electronic imaging systems. All of our sensor design and prototype engineering are done in our facility while wafer fabrication and higher volume packaging are outsourced for production efficiency and for lower costs. Resident manufacturing processes are maintained for specialty products and include semiconductor wafer dicing, packaging, device butting, fiber-optic element attachment, X-ray scintillator attachment, hybridization, and custom filter deposition. Additionally, our electronic imaging... (read more)
Browse CMOS Image Sensors Datasheets for BAE Systems Imaging Solutions formerly Fairchild Imaging -
ROHM Semiconductor, USA LLC
Switching Regulators Optimize Power Efficiency
variation by as much as 50%. High Reliability: A full suite of built-in protection circuits including over-current, and over-temperature protection, plus under-voltage lock-out. Compact Packaging: Small wafer-level packages and small form factor packages optimize pc-board utilization. "The BD91x regulators represent another series of new devices from ROHM Semiconductor that address the emerging needs for 'green' product designs," said Kevin Turchin, ROHM Semiconductor Field Application Engineering... (read more)
Browse IC Switching Voltage Regulators Datasheets for ROHM Semiconductor, USA LLC
Conduct Research Top
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Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
as masked off saw streets and I/Os across the wafer. Thickness comparisons are made between the 2 methodologies. Thermally Conductive Epoxies SCREEN PRINTABLE POLYMERS FOR WAFER LEVEL PACKAGING: A TECHNOLOGY ASSESSMENT. James Clayton and Michael J. Hodgin. Polymer Assembly Technoloy, Epoxy
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Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf)
Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of TSVs (through silicon vias) is used for 3D IC stacking of individual layers as well as in 3D
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Consortium develops first wafer-level packaging technologies for 300-mm wafers SANTA CLARA, Calif. -- A consortium has demonstrated what is believed to be the world's first wafer-level packaging technologies for 300-mm silicon substrates. The consortium, called the Semiconductor Equipment
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Despite plane crash Appleton plans to speak at Semicon Structured ASIC market to grow 55%, says Semico FlipChip to expand wafer-level packaging capacity Cimetrix rolls out beta program for Interface A software Broadband to continue rapid worldwide growth Broadband-subscriber growth on a worldwide
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Amkor provides glimpse of future chip-packages Japan's Selete takes delivery of first EPL tool Wafer-level packaging group sets up 300-mm line Amkor provides glimpse of future IC-packages Providing a glimpse into the future of IC-packaging, Amkor Technology Inc. outlined its roadmap, disclosing plans
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Semiconductor and IC Package Testing
Semiconductor, microelectronic, and IC package testing includes testing at the wafer, die, or packaged IC level. Semiconductor and IC package testing services may provide wafer sort and packaging services in addition to component evaluation. In the packaging process, fabricated wafers are cut
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Dispelling 10 Myths About Nitrogen Reflow (.pdf)
'. experience in wafer fabrication and. semiconductor packaging materials and. manufacturing. at low percentage levels, for example. Dr. Mackie is an industry expert in. Background. 0.01% = 100ppm. It is also important to. physical chemistry, rheology and materi-. To understand any process using inert. als
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QCW Diode Array Reliability at 80x and 8xx nm
epitaxial design with its Golden Bullet packaging methods. Recently, NGCEO has developed a new epitaxial structure to further increase the reliable output power levels of these. devices. This epitaxial structure contained several advances over the previous structure and included a larger waveguide
Engineering Web Search: Wafer Level Packaging Top
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Wafer-Level Chip-Scale Packaging (WLP)
CYCLOTENE Advanced Electronics Resins - Wafer-Level Chip-Scale Packaging (WLP) Wafer-Level Chip-Scale Packaging (WLP) Multilayer Interconnects
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DuPont Wafer Level Packaging Solutions - 3D/TSV, bonding, fan...
Wafer Level Packaging Home Wafer Level Packaging Home DuPont Home«Wafer Level Packaging Solutions«
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Advanced Packaging, Semiconductor Packaging & Circuit...
Integrated Wafer Level Packaging Solutions Integrated Wafer Level Packaging Solutions
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Wafer Level Packaging - SUSS MicroTec
Wafer Level Packaging Wafer Level Packaging (WLP) is an advanced packaging technology in which all steps of IC packaging are performed
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Wafer Level Packaging - SUSS MicroTec
Wafer Level Packaging Download SUSS MicroTec technical publications, white papers and application notes about wafer level packaging.
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IMAPS - International Microelectronics Assembly and Packaging...
and future of microelectronics: 3D Integration, MEMS, Flip Chip, Wafer Level Packaging,Thermal Management, Printed Electronics, Advanced Materials,
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Packaging Documentation : Fujitsu Canada
Wafer Level Packaging (Super CSP) Super Chip Scale Package (SCSP) is a wafer level package that is a true chip size package.
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FlipChip International
(FCI), the global technology leader in flip chip bumping and Wafer Level Packaging announced today its Elite? OPM technology which provides a wider
