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  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    performance. for products used in high performance RF applications. such as cell phones. Consequently, RF testing is utilized. to assure good RF performance. RF testing is performed. at the package level. The time required to move product. from wafer fab completion through package assembly. delays feedback
  • MICRO:Product News
    Indenter XPW includes an operating and data-analysis software package. The unit characterizes the surfaces of wafers down to a few nanometers by making an indentation with its diamond indenter tip. The indentation depth is monitored continuously, providing data that allow the hardness, Young's modulus
  • MICRO: Tool/Fab Automation
    the tool models included in the ToolSim software package, various processing scenarios were simulated in a series of case studies performed at Texas Instruments' DMOS 5 wafer fab (Dallas). The high-volume/high-mix fab manufactures analog/DSP products. Several benefits were derived from the use

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