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  • Metal Based Wafer Bonding Techniques for Wafer Level Packaging (.pdf)
    Wafer level bonding utilizing metal based technologies are coming to the forefront of manufacturing methods in numerous 3D integration schemes and advanced MEMS processing. Copper to copper bonding of TSVs (through silicon vias) is used for 3D IC stacking of individual layers as well as in 3D
  • Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment (.pdf)
    as masked off saw streets and I/Os across the wafer. Thickness comparisons are made between the 2 methodologies.
  • Medical Device Link . Advanced Electronic Packaging Techniques Enhance Function, Performance, and Portability
    Alternative packaging technologies are moving to the forefront as devices require increased portability and performance. Electronic packaging and assembly technologies are growing more complex, and the rate of technological change is accelerating. While surface-mount technology (SMT) is now
  • | Electronics Industry News for EEs & Engineering Managers
    Consortium develops first wafer-level packaging technologies for 300-mm wafers SANTA CLARA, Calif. -- A consortium has demonstrated what is believed to be the world's first wafer-level packaging technologies for 300-mm silicon substrates. The consortium, called the Semiconductor Equipment
  • | Electronics Industry News for EEs & Engineering Managers
    Despite plane crash Appleton plans to speak at Semicon Structured ASIC market to grow 55%, says Semico FlipChip to expand wafer-level packaging capacity Cimetrix rolls out beta program for Interface A software Broadband to continue rapid worldwide growth Broadband-subscriber growth on a worldwide
  • | Electronics Industry News for EEs & Engineering Managers
    . Amkor provides glimpse of future chip-packages Japan's Selete takes delivery of first EPL tool Wafer-level packaging group sets up 300-mm line Amkor provides glimpse of future IC-packages Providing a glimpse into the future of IC-packaging, Amkor Technology Inc. outlined its roadmap, disclosing plans
  • Medical Device Link .
    Laser Processing Equipment and Services Contract UV laser micromachining services for a variety of applications range from semiconductor wafer processing to biomedical and blue LED scribing. The company�s core capabilities include expertise in processing materials at UV wave-lengths of 355
  • Semiconductor and IC Package Testing
    Semiconductor, microelectronic, and IC package testing includes testing at the wafer, die, or packaged IC level. Semiconductor and IC package testing services may provide wafer sort and packaging services in addition to component evaluation. In the packaging process, fabricated wafers are cut

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