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Supplier: SpeedFam Corporation
Description: Polishing cover the needs of almost all types of materials to be polished. These pads are suitable for most discriminating prepolish and final polish operations with critical surface requirements. The pads offer finest surface finish when used along with suitable polishing media & its napped
Supplier: Zygo Corporation
Description: Simultaneously measures multiple parameters
- Form Factor: Monitor / Instrument
- Mounting / Loading: Autoloading / In-line, Floor Mounted / Stand-alone
- Applications: Semiconductor Wafers, CVD / PVD Films, Electroplated Films, Etching - Plasma / Wet, Photolithography / Patterning, Polishing / CMP, Other
- Measurement Capability: Critical Dimension / Trench Geometry, Roughness / Waviness, Thickness - Film / Layer, Other
Supplier: StellarNet, Inc.
Description: and/or optical measurement requirements. Thin Film Applications Solar PV Increased production of Thin-Film Photovoltaics (TFPVs) is becoming more predominant due to lower costs than their silicon-wafer-based cousins. Getting accurate thickness measurement is extremely crucial to efficiency and reliability
- Form Factor: Monitor / Instrument
- Mounting / Loading: In-situ / System Mounted
- Applications: Semiconductor Wafers, CVD / PVD Films, Data Storage / Memory, Flat Panel Displays, Optical Components , Polishing / CMP, Polymers / Photoresists, Other
- Measurement Capability: Thickness - Film / Layer, Thickness - Wafer / Disc (TTV)
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Featured Products for Wafer Polishing Top
Accupol Lapping & Polishing Wafer Thinning Jig
The Lapmaster line of Accupol Lapping & Polishing Wafer Thinning Jig Fixtures are designed to control precision thickness and parallelism of thin, fragile components made of semiconductor, compound semiconductor and electro-optics materials. A vacuum chuck retains the wafers during processing. The spring-loaded weight (down-force) is available in applying just a few ounces or can be adjusted to applying several pounds. Single or multiple wafers can be retained and processed within a fixture... (read more)
Browse Laps and Lapping Tools Datasheets for Lapmaster International
CMP Wafer Polishing Pressure Distribution
The I-Scan ® system provides the diagnostic tools necessary to evaluate, view, and balance the forces acting on a silicon wafer during the polishing process. A study was conducted to collect and analyze the pressure distribution under a polishing head. Using a unique I-Scan pressure sensor with a sensing area of 9 1/2" X 9 3/4", measurements were taken to determine the pressure distribution of the polishing head and the wafer interface. Balancing these pressures during machine set-up can... (read more)
Browse Tactile Pressure Sensors Datasheets for Tekscan, Inc.
The EPD is a system which improves the Wafer Edge by polishing patterned wafers. The EPD removes foreign and unwanted substances from the edge bevel at critical process nodes. SpeedFam is the pioneer of Edge Polishers for the production of prime wafers. We make use of this system with astonishing results on 300mm, 200mm, and 150mm wafers. SpeedFam has shipped about 550 Edge Polishers for prime wafers since 1988. The SpeedFam Edge Polisher is the global standard in edge preparation used in prime... (read more)
Browse Polishing and Buffing Machines Datasheets for SpeedFam Corporation
LSP Series Dual-Face Lapping & Polishing Machinery
Hamai, a leading manufacturer of lapping & polishing equipment in Japan, has a strong presence in the optics and semiconductor markets in Asia. Established in 1926, they have contributing to the development of specialized industrial equipment for precision finishing ever since. Amongst others, they specialize in general optics applications, hard disk lapping/polishing and virgin silicon wafer lapping. Individually, both Lapmaster and Hamai have a long history of involvement in the precision... (read more)
Browse Polishing and Buffing Machines Datasheets for Lapmaster International
CHRocodile IT Keeps an Eye on Wafer Thickness
under the same conditions, and a measuring range that is ten times greater (up to 3.5 mm air gap) compared with the white light method. This allows the measuring unit to be integrated directly into the wafer production process thanks to its robust and simple configuration. Of course, CHRocodile IT is also ideal for economical and at the same time highly accurate layer thickness measurement in the laboratory. The recorded measured values are available to the user for process monitoring and control... (read more)
Browse Semiconductor Metrology Instruments Datasheets for Precitec, Inc.
Air Bearing Cylinders
of ultra-low friction ball joints used to connect the rod. Using "Force Without Friction" technology offers a level of smooth motion and longevity in a pneumatic driving device for applications such as: Precise tensioning of ultra-fine wire, filaments, or fiber. Positioning mechanisms supporting delicate materials, optics, or liquids. Super-sensitive force control for holding or clamping fragile materials, wafer dicing, or polishing. Counterbalancing and safety support for vertically positioned... (read more)
Browse Air Cylinders Datasheets for Isotech, Inc.
Fast Measurement for Semiconductor & PV Material
of sensor and probe configurations designed for nearly all materials. Some typical applications are: wafer thickness during grinding, polishing or etching. measurement of structures on semiconducturs, manufacturing of masks. quality assurance on bondings (length of leads etc.). measurement of coatings. determination of layer thickness. Real time measurement of thickness during the processing phase can eliminate waste, reduce overhead and ultimately improve your end product. Contact us for more... (read more)
Browse Process Monitors Datasheets for Precitec, Inc.
Conduct Research Top
Low Defect Ceria-Based Slurries: Novel Selectivity, Slurry Characterization, and Polishing Mechanisms (.pdf)
is removed, polishing effectively stops (Figure 5). The additives in this slurry platform can be easily tuned for the desired SHRR, while keeping the. same autostopping behavior. The additives in this slurry platform also bind with the wafer. surface during polishing. Differing from the STI additive
Recent Advances in the Development of Ceria-Based Slurries for Inner Layer Dielectric CMP (.pdf)
Standard Inner Layer Dielectric (ILD) polishing utilizes an endpoint detection or a fixed time process to determine when to stop polishing. This can create non-uniformities across the oxide surface caused by both within die topography variations and within wafer polishing rate variations (1
Ceria Based Slurries for STI and 'Self-Stopping' ILD Polishing: Novel Formulations and Mechanistic Understanding (.pdf)
, the result being that the oxide over. across the oxide surface caused by both within. the active areas is thicker than that over the. die topography variations and within wafer. field areas (trench). CMP is used to reduce the. polishing rate variations. One way to minimize. topography down to the silicon
MICRO:Industry News: 'Round the Circuit (March 2001)
. DuPont already makes colloidal silica slurries for silicon wafer polishing. The market for slurries is an estimated $500 million annually with a 25% yearly rate
MICRO: Characterizing CMP
A case study investigates how conditioning CMP pads with different diamond abrasives affects film removal rates, wafer-to-wafer nonuniformity, wafer defects, and pad lifetime. hemical-mechanical polishing (CMP) has enabled the production of advanced semiconductor devices by producing a globally
Recent Advances in Ceria-Based Slurries for STI and ILD CMP Applications (.pdf)
and within wafer polishing rate variations . Incorporation of a stopping layer. would help, but the standard ILD process does not use any. One way to minimise non-. uniformity and also to widen the process window is to formulate an ILD slurry with auto-. stopping characteristics. An auto-stopping slurry
An Investigation of Ceria-Based Slurries Exhibiting Reverse-Prestonian Behavior (.pdf)
across the oxide surface. CMP-stop layer deposited on the active. caused by both within die topography. areas. An important aspect of the process. variations and within wafer polishing rate. is that it needs to produce minimal dishing. variations . Incorporation of a stopping. in the trench oxide
Non-Contact Thickness Measurement of Semiconductor Wafers
the target surface rather than through the target to ground. The individual output signals are summed by the amplifier producing a single 0 to 10 VDC output. System Design. Processing of semiconductor wafers (slicing, lapping, polishing) introduces bow and warp to the wafer profile. True thickness
Engineering Web Search: Wafer Polishing Top
Wafer Grinding Lapping Polishing CAE
Wafer Grinding, Lapping & Polishing> OKAMOTO: VG 502 MKII 8 Wafer Grinding, Lapping & Polishing> SPEEDFAM: 3B-9P-III
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CMP Wafer Polishing Pressure Distribution from Tekscan, Inc.
Home > Company Directory > Tekscan, Inc. > CMP Wafer Polishing Pressure Distribution Tekscan, Inc. - CMP Wafer Polishing Pressure Distribution
Optical polishing, lapping, dicing and optical components...
Annealing, backgrinding, bonded wafer thinning, chamfering, CMP polishing, coating, cryogenic stress relieving, custom machining, cutting, dicing,
Semiconductor Wafer Polishing and CMP with I-Scan | Tekscan
Wafer Polishing Evaluation with I-Scan Measure pressure between a semiconductor wafer and polishing head.
Cabot Microelectronics | Chemical Mechanical Planarization
On-Site Polishing Services Silicon Wafer Silicon Carbide Wafer SiCceed 1210 A/B Series
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CMP Wafer Polishing 300mm Chemical Mechanical Planarization Equipment, Carriers, Amat, Ebara
- WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS -...