Wafer Polishing

Featured Products for Wafer Polishing Top

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  Tekscan, Inc.
  CMP Wafer Polishing Pressure Distribution
  The I-Scan® system provides the diagnostic tools necessary to evaluate, view, and balance the forces acting on a silicon wafer during the polishing process. A study was conducted to collect and analyze the pressure distribution under a polishing head. Using a unique I-Scan pressure sensor with a sensing area of 9 1/2" X 9 3/4", measurements were taken to determine the pressure distribution of the polishing head and the wafer interface. Balancing these pressures during machine set-up can assist... (read more)
  Browse Datasheets for Tekscan, Inc.
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  Saint-Gobain Surface Conditioning Group
  Polycrystalline Alumina Slurry for Polishing
  Saint-Gobain's 92400.20MIC12 Polycrystalline Alumina Slurry for C plane sapphire wafer polishing is a truly remarkable product. It replaces colloidal silica, SiO2, the traditional final polishing slurry used for many years on C plane sapphire wafers. This slurry can polish the sapphire wafers 2 - 3 times faster than colloidal SiO2, and it doesn't scratch the sapphire wafers, is much more easily cleaned from the wafers and the polishing machinery. Product Benefits. High purity alpha A12O3... (read more)
  Browse Abrasive Compounds and Abrasive Slurries Datasheets for Saint-Gobain Surface Conditioning Group
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  Lapmaster International
  LSP Series Dual-Face Lapping & Polishing Machinery
  Hamai, a leading manufacturer of lapping & polishing equipment in Japan, has a strong presence in the optics and semiconductor markets in Asia. Established in 1926, they have contributing to the development of specialized industrial equipment for precision finishing ever since. Amongst others, they specialize in general optics applications, hard disk lapping/polishing and virgin silicon wafer lapping. Individually, both Lapmaster and Hamai have a long history of involvement in the precision... (read more)
  Browse Polishing and Buffing Machines Datasheets for Lapmaster International
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  Lapmaster International
  Accupol Lapping & Polishing Wafer Thinning Jig
  The Lapmaster line of Accupol Lapping & Polishing Wafer Thinning Jig Fixtures are designed to control precision thickness and parallelism of thin, fragile components made of semiconductor, compound semiconductor and electro-optics materials. A vacuum chuck retains the wafers during processing. The spring-loaded weight (down-force) is available in applying just a few ounces or can be adjusted to applying several pounds. Single or multiple wafers can be retained and processed within a fixture... (read more)
  Browse Laps and Lapping Tools Datasheets for Lapmaster International
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  Isotech, Inc.
  Air Bearing Cylinders
  of ultra-low friction ball joints used to connect the rod. Using "Force Without Friction" technology offers a level of smooth motion and longevity in a pneumatic driving device for applications such as: Precise tensioning of ultra-fine wire, filaments, or fiber. Positioning mechanisms supporting delicate materials, optics, or liquids. Super-sensitive force control for holding or clamping fragile materials, wafer dicing, or polishing. Counterbalancing and safety support for vertically positioned... (read more)
  Browse Air Cylinders Datasheets for Isotech, Inc.
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  Precitec, Inc.
  CHRocodile IT Keeps an Eye on Wafer Thickness
  under the same conditions, and a measuring range that is ten times greater (up to 3.5 mm air gap) compared with the white light method. This allows the measuring unit to be integrated directly into the wafer production process thanks to its robust and simple configuration. Of course, CHRocodile IT is also ideal for economical and at the same time highly accurate layer thickness measurement in the laboratory. The recorded measured values are available to the user for process monitoring and control... (read more)
  Browse Semiconductor Metrology Instruments Datasheets for Precitec, Inc.
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  GE Analytical Instruments
  Boron Analyzer
  Boron-related technical papers), and continuous monitoring of bed effluent provides operators with the earliest indication of changing bed conditions and bed exhaustion. At the outlet of polishing resins. The earliest indicator of polishing resin exhaustion, and a potential contaminant in wafer processing, real-time boron data from the polishing bed effluent is critical to today's advanced fabrication facilities. At the outlet of Electrodeionization units. A well-run EDI balances power consumption... (read more)
  Browse Water Quality Testing Instruments Datasheets for GE Analytical Instruments
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  Precitec, Inc.
  Fast Measurement for Semiconductor & PV Material
  of sensor and probe configurations designed for nearly all materials. Some typical applications are: wafer thickness during grinding, polishing or etching. measurement of structures on semiconducturs, manufacturing of masks. quality assurance on bondings (length of leads etc.). measurement of coatings. determination of layer thickness. Real time measurement of thickness during the processing phase can eliminate waste, reduce overhead and ultimately improve your end product. Contact us for more... (read more)
  Browse Process Monitors Datasheets for Precitec, Inc.