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  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    to the wafer fab process engineer. Adding wafer level RF tests provides quicker feedback. and reduces the time required to complete a cycle of. learning. This paper discusses the RF wafer probe tests. used to evaluate the continuous improvements in. Skyworks' pHEMT wafer process.
  • Discussion on Probe Tip and Device Temperatures when Operating the VectorStar ME7838A Broadband System Application Note
    The VectorStar ME7838A Broadband system operates from 70 kHz to 110 (125) GHz utilizing the small, compact 3743x mmWave module. The ME7838A system offers on-wafer device characterization with significantly improved performance and convenient installation. With the advent of the new ME7838A has come
  • MEMS Inspection and Testing
    tests). Electrical functional MEMS testing is a process used to sort and/or mark die on wafers based on electrical performance. Wafer sorters or probes preform functional tests on dies in wafers or on packaged MEMS or IC devices. Functional tests verify the operation of all device functions
  • Non-Contact Thickness Measurement of Semiconductor Wafers
    removal rates are within customer specifications. The thickness measurement device must not only be capable of producing a highly accurate reading, it must do so without contacting the wafer surface. Capacitance based measurement probes have long been employed as a means of non-contact measurement
  • MICRO: Critical Material-Wafers
    been using mercury-probe or capacitance-to-voltage Schottky (HgCV) techniques to measure the resistivity of wafers sampled from production runs. While these methods adequately measure a wafer's resistivity profile (resistivity as a function of depth into the silicon), any measured wafer must
  • MICRO: Product Extra!
    The m600 developer's kit from allows R &D technologists and OEM engineers to test the technical feasibility and ease of integration of the company's Fluoroptic thermometry. Among other applications, the m600 can be used to control electrostatic chucks in semiconductor wafer tools. The m600 has
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Credence completes ATE acquisition of NPTest UTAC probes UMC's Singapore fab Ellipsiz sets up reliability test lab in Shanghai Dell's new printers--a threat to HP without IP? Intel planning Indian manufacturing, say reports IR plans $40 million spend on Welsh wafer fab Gartner predicts memory
  • MICRO:Top 40 (Nov '00)
    . The 25-capacity, reduced-pitch box complies with I300I requirements, featuring a design that limits the amount of system material that comes in contact with each wafer. Wafer manufacturers can use the FOSB as many as four times before returning it to the company for recycling. A chemical-mechanical

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