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  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    to the wafer fab process engineer. Adding wafer level RF tests provides quicker feedback. and reduces the time required to complete a cycle of. learning. This paper discusses the RF wafer probe tests. used to evaluate the continuous improvements in. Skyworks' pHEMT wafer process.
  • MICRO: Critical Material-Wafers
    been using mercury-probe or capacitance-to-voltage Schottky (HgCV) techniques to measure the resistivity of wafers sampled from production runs. While these methods adequately measure a wafer's resistivity profile (resistivity as a function of depth into the silicon), any measured wafer must
  • Optical Fiber Array With Precise Hole Sizing
    A method of making and an etchable wafer substrate for use in making optical fiber array plates includes forming a progressively increasing series of metrology holes when the plate holes are formed. The variation between designed plate hole diameter and actual plate hole diameter is determined
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    this technology in its etchers, wafer track, and other systems by the middle of 2002. Hynix moves closer to wafer-level test of fast DRAMs SEOUL -- Korea's Hynix Semiconductor Inc. has demonstrated the ability to perform high-speed wafer-level testing of DRAM devices using a probe system from Teradyne Inc
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Pair form epi wafer venture in China Moore Technologies Inc. and Shanghai Simgui Technology Co. Ltd. have quietly established one of China's first foundry services for epitaxial wafers, Data services to grow in Europe, says report It is good news all around for the enterprise data services market
  • MICRO:Product Technology News (March '99)
    mm, Process Probe 1630 instrumented wafers provide multipoint wafer temperature measurement of atmospheric CVD process in situ in real time. They are used to characterize processes, calibrate temperature set points, and evaluate temperature variations along moving belts. They can have up to 16
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Micron says half of revenues to come from Asia Communications IC market to grow 6% in '04, says IDC RIT demos 38-nm resolutions with 193-nm immersion SIA's road map affirms 3-year cycles for chips WTO to probe Hynix DRAM duties imposed by EU, U.S. Azores debuts stepper for large-screen flat-panel
  • EETimes.com | Electronics Industry News for EEs & Engineering Managers
    Heard on the Beat (Nov. 30) Heard on the Beat, Nov. 30 TEL enhances prober to handle mix of 200- and 300-mm wafers TOKYO -- In a move to increase flexibility and throughput in wafer-test operations, Tokyo Electron Ltd. today announced an enhanced version of its P-12XL prober, which adds a new sort

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