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  • Evaluating pHEMT Process Improvements Using Wafer Level RF Tests
    to the wafer fab process engineer. Adding wafer level RF tests provides quicker feedback. and reduces the time required to complete a cycle of. learning. This paper discusses the RF wafer probe tests. used to evaluate the continuous improvements in. Skyworks' pHEMT wafer process. Microsoft Word
  • RF Wafer Testing: An Acute Need, and Now Practical (.pdf)
    automated. measurements. This means that a robot delivers the wafer, the calibration standard, and. the probe card to where they are needed. In other words, a major test system design goal. is absolute data integrity without human intervention. If intervention is required, it should. be accomplished
  • Discussion on Probe Tip and Device Temperatures when Operating the VectorStar ME7838A Broadband System Application Note
    the module test port and the probe. Long cables are used due to the difficulty locating large mmWave modules. close to the probes on a wafer probe station platen. The result of using long 1mm test port cables is a dramatic. reduction in dynamic range, raw directivity, and measurement stability
  • RF Test Gage R&R Improvement
    to the. Gage study passed. Further, the percentage of die. operator. This result was marginal at 13.5%. requiring re-test was reduced significantly. Figure 1. INTRODUCTION. Third Harmonic Gage R &R Results. Wafer Probe 3rd Harmonic Gauge R & R. State of the art multi-throw RF switches need to meet. third
  • Non-Contact Thickness Measurement of Semiconductor Wafers
    removal rates are within customer specifications. The thickness measurement device must not only be capable of producing a highly accurate reading, it must do so without contacting the wafer surface. Capacitance based measurement probes have long been employed as a means of non-contact measurement
  • Thickness, Shape and Flatness Measurement of Semiconductor Wafers
    of point measurements. TTV is expressed in microns or mils (thousandths of an inch). Figure 1. Figure 1 above shows a wafer placed between two non-contact measurement probes. By monitoring changes between the upper probe face and the upper wafer surface (A) and the bottom probe face and the bottom
  • Rapid Deployment OEM Sensor for High Precision Measurement Applications
    manufactures manual, semi-automated and fully automated wafer characterization tools designed to measure wafer thickness, total thickness variation (TTV), bow, warp and flatness of semi-insulating and semiconducting materials. MTII’s Aviation Balancing Instruments group provides state-of-the-art portable
  • Fast Response Optical Sensors Prove Invaluable in Demanding Gaging Applications
    manufactures manual, semi-automated and fully automated wafer characterization tools designed to measure wafer thickness, total thickness variation (TTV), bow, warp and flatness of semi-insulating and semiconducting materials. MTII’s Aviation Balancing Instruments group provides state-of-the-art