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  • MEMS Inspection and Testing
    MEMS inspection and testing encompasses physical and chemical examination of structures using SEM or optical microscopy, ellipsometry, spectroscopy or other analytical technique. MEMS testing is actual wafer probing or device electrical testing (functional back end testing or parametric in process
  • EXPANSIONS AND ACQUISITIONS
    to begin in 1999. Maximum capacity will be 6000 8-in. wafers/week. Electroglas, a supplier of automatic wafer probing equipment, has signed a definitive agreement to purchase Knights Technology of Sunnyvale, CA, for approximately $30 million in stock. Knights manufactures software for yield enhancement and
  • MICRO: Product Extra!
    , lithography, stripping, PVD, etching, wafer probing, and other processes. They're available for use by both OEMs and end-users. Prototyping, in-house foundry casting, and machining are among the services highlighted in the publication. Information: www.durexindustries.com. (Semicon West, S.F., South
  • RF Measurement Techniques
    is shown in. Figure 1. Author: Date: 10/03/2006. Ron Schmidt. Page 2 of 2. Title: Document No.: Revision: RF Measurement Techniques. BAN-TST-1.1. A. The calibration standards are shown in Figure 2. Figure 2. DC ­ 65 GHz On Wafer Probing (GSG). The increased use of LTCC technology at Barry Industries
  • M542: Electrical Characterizations of Packages for use with GaAs MMIC Amplifiers
    A test methodology will be presented which combines the advantage of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel "test fixture" capable of electrically characterizing most any style package or device. This scheme has been used to characterize many

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