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  • Absolutely accurate
    . Wafer-handling Scara robots are going to direct-drive configurations to meet the performance demands of modern fabs. The semiconductor industry is beginning to realize it has a good opportunity to drive down its equipment costs. The opportunity concerns the hundreds of Selective Compliant Assembly Robot Arms
  • MICRO:Product Technology News (April '99)
    also ensures reliable equipment interface and robotic wafer transfer. StableWafer pocket design technology controls the wafer plane even when the wafer is removed from its pocket up to 21 2 in. from the fully seated position. This feature eliminates wafer chatter and flutter. Carriers can
  • Controls help harmonic spray do OK removing residues
    equipped with Rockwell Software RSView32 human-machine interface software lets operators track machine alarm status, wafer mapping, timing and sensor functions for the Rapid Pulse Clean Series. Inside Planar Semiconductor Inc.'s RPC-200 access doors, a six-axis robot arm transports wafers from input
  • Robots That Teach Themselves
    A "feel your way around " strategy can let robot arms learn their surroundings. Robots on production lines must be taught where to move. That is true in spades for robots that move silicon wafers in semiconductor manufacturing. Wafer-handling robots are carefully taught each location from which
    Silicon wafer manufacturer Mitsubishi has ordered $4.5 million worth of automation systems from PRI Automation in Billerica, MA. The gear includes an AeroTrak overhead monorail system, machine-loading robot vehicles, and loading robots for inter- and intrabay transport and storage of 150
  • MICRO: Product Technology News (June '2000)
    The Q200 is an automated 200-mm overlay metrology tool for 0.13- um and smaller processes. The system measures all layers, including CMP, buried layers, grainy images, and image contrast reversals. Fast pattern recognition and robotic wafer handling make possible a throughput of 80 wafers/hr at 20
  • MICRO: Tech Emergent
    -handling systems such as robot arms and chucks, cross-contamination resulting from wafers as they pass from tool to tool, and wafer-handling systems such as lot boxes are sources of backside contamination. Backside defects (particles or scratches) can create local distortions on the wafer, causing DOF issues
  • MICRO: Products
    and energy purity. All systems feature the company's control and positioning systems and a common single-wafer end station. A metrology system for advanced lithography tracks with two or more robot arms, Accura C optimizes equipment and system-to-system performance by providing customers

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