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  • MICRO: Implementing a single-wafer cleaning technology
    The use of a single-wafer spin cleaning process using ozonated water and dilute hydrogen fluoride accommodates a manufacturer's shift to minifab operations, where shorter cycle times are possible. With the dawn of the new millennium, paradigms have been shifting in the semiconductor industry
  • Using a buffered rinse solution to minimize metal contamination after wafer cleaning
    Robert J. Small, Maria L. Peterson, and Aaron Robles, Wet chemical processes are considered effective methods of removing particles, metal ion contaminants, and native oxides from semiconductor devices, with such wafer-cleaning steps accounting for up to 30% of the 300 to 500 process steps
  • MICRO: Wafer Handling and Fab Automation - Pisa (October 2000)
    Wafer Handling and Fab Automation A new system relies on computer-integrated manufacturing to achieve automated material handling and complete fab management. growth by continuing to bring more and more functions to increasingly complex chips while at the same time reducing the cost to the consumer
  • MICRO: Wafer Handling and Fab Automation - Pisa (October 2000)
    Wafer Handling and Fab Automation A new system relies on computer-integrated manufacturing to achieve automated material handling and complete fab management. The semiconductor industry fuels its growth by continuing to bring more and more functions to increasingly complex chips while at the same
  • MICRO: Tech Emergent
    be exploited only if the quality of the incoming wafer is not compromised. The section on difficult lithography challenges and the resist requirements tables of The International Technology Roadmap for Semiconductors (ITRS) stipulate that the industry should be able to detect 40-nm front-surface
  • AN3018: Known Good Die Delivery Specification
    2010, Class B criteria. Die will be delivered on wafer tape per Table 1. Unit of measure is die. Quantity per shipping container will vary. Noncompliant die will be identified per Table 4. Wafer Map Format * SEMI E142 compliant * XML file format * ASCII bin format * Map file name is equivalent
  • Developing the workforce for a high-yield semiconductor fab
    that help fab employees build high-yield microchip devices still need to be developed in the workplace. Fab employee Gary Stephens practices wafer handling in the skill training room. Photos by Reagan Bradshaw. Semiconductor device fabrication technology has advanced quickly, but most operators have
  • Membrane Processing for Water Treatment in the Semiconductor Industry (.pdf)
    by means of a multi-stage process chain, in which membrane technology plays a special role at several points. With the introduction of the 0.25 micron and 0.18 micron wafer technology, the requirements for the high-purity water treatment plants with regard to the specification as well as flexibility

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