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  • Structural Health Monitoring with Piezoelectric Wafer Active Sensors
    Structural Health Monitoring with Piezoelectric Wafer Active Sensors. By providing background information, theoretical modeling, and experimental examples on the principal technologies involved in SHM, this book shows students, engineers and technical specialists how to apply the knowledge
  • MICRO: Implementing a single-wafer cleaning technology
    The use of a single-wafer spin cleaning process using ozonated water and dilute hydrogen fluoride accommodates a manufacturer's shift to minifab operations, where shorter cycle times are possible. With the dawn of the new millennium, paradigms have been shifting in the semiconductor industry
  • Implementing a Table Read
    . Microchip received QS-9000 quality system. certification for its worldwide headquarters,. design and wafer fabrication facilities in. Chandler and Tempe, Arizona in July 1999. The. Company’s quality system processes and. procedures are QS-9000 compliant for its. PICmicro® 8-bit MCUs, KEELOQ® code
  • Using a buffered rinse solution to minimize metal contamination after wafer cleaning
    Robert J. Small, Maria L. Peterson, and Aaron Robles, Wet chemical processes are considered effective methods of removing particles, metal ion contaminants, and native oxides from semiconductor devices, with such wafer-cleaning steps accounting for up to 30% of the 300 to 500 process steps
  • MICRO: Wafer Handling and Fab Automation - Pisa (October 2000)
    Wafer Handling and Fab Automation A new system relies on computer-integrated manufacturing to achieve automated material handling and complete fab management. The semiconductor industry fuels its growth by continuing to bring more and more functions to increasingly complex chips while at the same
  • MICRO: Wafer Handling and Fab Automation - Pisa (October 2000)
    Wafer Handling and Fab Automation A new system relies on computer-integrated manufacturing to achieve automated material handling and complete fab management. growth by continuing to bring more and more functions to increasingly complex chips while at the same time reducing the cost to the consumer
  • Table II
    as 50-100 mgrams possible. Typical parts in the 1 to 100 mm range but larger is possible. Features at 5 mm possible. Large parts possible with tolerances +- 10 mm to submicron dependant on laser type. Part size from a few microns to size of silicon wafer (typically max of 200mm). Feature height
  • Implementing Table Read and Table Write
    in the. U.S.A., All Rights Reserved. Printed on recycled paper. Microchip received QS-9000 quality system. certification for its worldwide headquarters,. design and wafer fabrication facilities in

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