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...with area-array pitch of 0.5 mm or more can employ existing SMT assembly equipment for flip-chip assembly, which can be the most cost-effective assembly method. However, for typical high-pin-count flip-chip assemblies, manufacturers need additional processes such as wafer bumping and specialized equipment...

...typically produced in a wafer fabrication facility and processed in batches of 250 15,000 sensors, depending on size and complexity. MEMS sensors can also be produced for medical products with higher accuracy and reliability than ever before. Currently available micromachining equipment allows...

...temperature to form a wafer stack of hundreds. harsh environmental conditions. Established solutions can. of fi nished sensors. Such components are extremely stable over. Offshore Technology International 29. Colibrys.indd 29. 26/05/2011 10:41...

...and barcodes on product packaging, medical instruments,. electronic devices and automotive components. Laser markers have also been adopted to. perform processing functions such as wafer etching, cutting plastic films and trimming fiber. optic cables. As new applications in manufacturing emerge, laser...

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