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  • Integrated motion module chops $500 from machine cost
    Orthodyne's Model 360C automatic wire bonder without a leadframe feeder has a 24 x 43-in. footprint. Vertical and horizontal actuators in tandem elevate full magazines to working height, push them through the work area, and out the front. Redesigning an ultrasonic wire-bonding machine with a ready
  • Two Solutions to Static Problems in Semiconductor Die Bonder Operation (.pdf)
    One phase of the semiconductor manufacturing process involves a die bonding machine. Several manufactures produce this type of equipment, with similar designs for the actual bonding operation. A fine gold wire (approximately 2 mil. In diameter) is attached from the semiconductor component

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