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Supplier: Leica Microsystems, Inc.
Description: when working on applications where the instrument is inclined, such as wire bonders or prober stations. The compact design makes the integration easier and is very user friendly. With a full range of 9 different objectives and 12 different eyepieces the S6 can fulfill almost all optical requirements.
- Application: Other
- Grade: Benchtop
- Microscope Type: Stereomicroscope
- Total Magnification: 6.3 to 40 X
Supplier: Titan Tool Supply, Inc.
Description: Industrial robotics, Machine vision, Quality control applications, Group viewing, Electronics fabrication of printed circuit boards, Wire bonders, Computer related production and testing techniques and Three Coordinate Measuring Machines all require the Micro-Video-Zoom-Objective Lens offering
- Working Length: 1.32 to 7.87 inch
- Viewing Angle: Direct (0°), Side (90°)
- Features: Integral Video Capability
Supplier: Terra Universal, Inc.
Description: Oil-less design for low maintenance, clean operation Low cost and extreme reliability make this diaphragm pump ideal for general-purpose laboratory applications Also suitable for wire bonders, die bonders, scribers, breakers, probing stations and many other kinds of microelectronics manufacturing
- Ultimate Operating Vacuum: 150 torr
- Configuration: Individual Vacuum Pump
- Mechanical Pump Type: Diaphragm
- Applications: General Purpose / Industrial
Supplier: H2W Technologies
Description: mounting and there are threaded mounting holes on the bottom of the platen. A cable carrier or some form of cable guidance should be supplied by the customer. This is a replacement for Kulicke and Soffa (K&S) 2920 Work Holder on a K&S 1488 series wire bonder. Baldor Motors P/N LMSS1302-2WW0.
- Linear Motor Type: Linear Stepping Design
- Peak Force: 6 lbs
- Slider or Carriage Width: 2.92 inch
- Slider or Carriage Length: 3.45 inch
Industrial Adhesives - 3M Scotch-Weld Hot Melt Adhesive 3789 Q, 5/8 in x 8 in, 11 lb per case -- 3789Supplier: 3M Industrial Adhesives and Tapes
Description: 3M Scotch-Weld Hot Melt Adhesive 3789 Q is a 100% solids thermoplastic, high performance plastic bonder with good impact resistance. Impact resistant. High performance plastic bonder. 100 percent solids Woodworking, furniture, automotive, transportation, aerospace, general industrial
- Industry: Automotive, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
- Chemical / Polymer System Type: Polyamide
- Cure Type / Technology: Thermoplastic / Hot Melt
- Features: UL Approved
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Featured Products for Wire Bonder Top
Universal Thread Grinding Company
Lead Screw Assemblies
Universal's high quality lead screw assemblies meet your most demanding micro positioning applications. Specify lead accuracies of 10 microinches per turn, and 25 microinches per inch - the best in the industry!. Unmatched lead accuracies minimize thread helix nonlinearity, and eliminate the "once around" banding problems common in high performance graphic imaging equipment, including color scanners, recorders, and printers. Other application examples include wire bonders, disk drive testers... (read more)
Browse Datasheets for Universal Thread Grinding Company
Titan Tool Supply, Inc.
New Low-Cost Micro-Video-Zoom Objective
Titan Tool Supply, Inc., Buffalo, New York, announces the introduction of its new Micro-Video-Zoom Objective that offers a wide range of magnification, fields of view, and working distances for video use in several industrial applications including: Robotics. Machine Vision. Quality Control. Group Viewing. Electronics Fabrication of Printed Circuit Boards. Wire Bonders. Computer Related Production and Testing Techniques. Use on 3-coordinate Measuring Machines. Since the unit has... (read more)
Browse Microscope Lenses and Objectives Datasheets for Titan Tool Supply, Inc.
Linear Stepper Motors
A new series of low cost, high performance linear stepper motors has been introduced by H2W Technologies, Inc. Traveling at speeds up to 80 in/sec. [2 m/sec], with strokes to 144 in. [3.6 m], and acceleration to 1G, these 2 and 4 phase linear steppers are ideal for: Pick-and-place, wire bonder, parts transfer, semiconductor, and other robotic applications. Capable of up to 50 lbs. [222 N] of continuous force and 65 lbs. peak force [289 N] this new series of single axis linear steppers has... (read more)
Browse Linear Motors Datasheets for H2W Technologies
Parts by Number for Wire Bonder Top
|Part #||Distributor||Manufacturer||Product Category||Description|
|ESEC 3006 WIRE BONDER||National Microchip||Not Provided||Not Provided||Not Provided|
|3667/20SV||Digi-Key||3M||Cables, Wires||RND 20 COND FLT CBL RPT 9.5 BOND|
|3667/34SZ||Digi-Key||3M||Cables, Wires||RND 34 COND FLT CBL RPT1.75 BOND|
|3667/50SV||Digi-Key||3M||Cables, Wires||RND 34 COND FLT CBL RPT 9.5 BOND|
|7988R N3UU1000||Allied Electronics, Inc.||BELDEN WIRE AND CABLE||Not Provided||CAT5E 4PR 24AWG BOND GREEN PVC-TEFLON INSLTN-SOLID BARE-RIP CORD-NON PLNM|
Conduct Research Top
Two Solutions to Static Problems in Semiconductor Die Bonder Operation (.pdf)
. Wire Bonder Head. Nuclecel. N. P-2021. 2 or CDA Line. Nuclecel. P-2042. Feed Line. Figure 1. In Use 7 – 7/04
Integrated motion module chops $500 from machine cost
Orthodyne's Model 360C automatic wire bonder without a leadframe feeder has a 24 x 43-in. footprint. Vertical and horizontal actuators in tandem elevate full magazines to working height, push them through the work area, and out the front. Redesigning an ultrasonic wire-bonding machine with a ready
Medical Device Link .
A welding process for catheters begins when an operator lays a wire on the platform and slides the wire into tooling that holds it in place during welding. The operator presses a foot pedal to pneumatically clamp the tooling onto the wire. Once the tooling is clamped, the operator presses dual palm
Medical Device Link .
equipment such as a gold ball wire bonder or a flip-chip system that is capable of attaching bare die. It is essential to qualify any processes used for temperature and vibration variations. Employing these bare die–attachment techniques allows for up to 20 times the amount of circuitry to be placed
Kimco Application Guide for Voice Coil Actuators (.pdf)
in micro-. lithography systems. able performance in wire and ball bonders,. microlithography and micropositioning. systems. Of course there are many other. applications in industries beyond these. The reason is evident: reliability, long service. life and clean, quiet operation. State-of-the-art facility
Medical Device Link .
proper weld alignment, x-y-z torch slides can adjust the position of the plasma welding torch. Furthermore, wire or tube that sticks out from the tooling can be set with micrometer adjustment; tooling is also available to accommodate different tube and wire sizes. Process Welding Systems Inc
More Information on: Wire Bonder Top
Advanced Wirebond Interconnection Technology
2.3.5: 2.3.6: 2.3.7: Hydrostatic Extrusion Annealing Winding and Spooling 22.214.171.124: Spooling for Manual Bonders Application 2.3.8: Spooling for High Speed Automated Wire Bonders 126.96.36.199: Types of Spools 2...
Force Sensors for Microelectronic Packaging Applications
5.1 Wire Bonder Development . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Advanced process characterization for 125 kHz wire bonder ultrasonic transducers
Advanced process characterization for 125 kHz wire bonder ultrasonic transducers .
Integrated Circuit Packaging, Assembly and Interconnections
This includes not just the addition of necessary capitol equipment such as die bonders and wire bonders but putting in place complete die management procedures, covering storage, handling, inspections, and the assembly process.
Unconventional applications of wire bonding create opportunities for microsystem integration
The company initially supplied the US transducers for wire bonding to other vendors, and later built their own wire bonder .
A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder
A fully MEMS-compatible process for 3D high aspect ratio micro coils obtained with an automatic wire bonder .
A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder
A Systematic Framework of Equipment Maintenance and Service with Application to Wire Bonder .
Design of advanced ultrasonic transducers for welding devices
The new transducer is mounted on a wire bonder with a flange whose special geometry was calculated by means of FEM simulations.
Advances in wire bonding technology for high lead count, high-density devices
System accuracy of bond placement will improve at least by a factor of two in the next generation wire bonders .
Automated HMC assembly
Automated Gold Wire Bonder Characterization for GaAs MMICs .......