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  • Using VPD ICP-MS to monitor trace metals on unpatterned wafer surfaces
    techniques, such as atomic absorption spectrometry (VPD-AAS), total reflection x-ray fluorescence (VPD-TXRF), and inductively coupled plasma mass spectrometry (VPD-ICP-MS). Sample preparation has traditionally been performed manually; this article presents results obtained from a semiautomated sampling
  • MICRO:July/August 98:Product Technology News
    . The instrument can be used with a range of patterned wafer inspection tools, including the supplier's WF-73X-series systems. Features such as tilt, rotation, and energy-dispersive x-ray (EDX) spectroscopy are available for operating the system as an engineering tool for rapid defect source
  • MICRO:Archives of 1998 Issues
    unit to sell gas delivery components; Ion Systems, Rhetech sign pact U.S. Army lab signs x-ray litho contract; Emcore hits paydirt Ball Semi is on a roll; Leica, Applied demonstrate against defects. MICRO:Archives of 1998 Issues. MICRO Advertiser and Product Information Buyers Guide. Chip Shots
  • MICRO: Archive: Back Issue TOC
    sells to ASMC; MySem installs Feinfocus x-ray inspection tool. Asia/Europe: DHL to handle FSI goods. Middle East: Tower taps KLA-Tencor tools. SIA Forecast: A Chip Shot. 300-mm Imperative: Axcelis touts resist strip tool; Wacker buys SemiTest metrology system; Mattson client wants more process
  • Transferring technology to industrial partners at LETI's Grenoble Center Tom Cheyney
    microscopy, total reflection x-ray fluorescence, Auger electron spectrometry, minority lifetime scanning, bare and patterned wafer scanning, and surface charge profiling. The ion mobility spectrometer, an increasingly important tool in the analysis of hydrocarbons in fabs, is also available. Adjacent
  • Certifying gas distribution systems in a fab producing advanced-technology devices
    , including gas containers and shipping effects, be controlled to the point of use? Parameter Bulk-Gas Specification Specialty Gas Specification Pressure decay <1% (24 hr full system)<1% (2 hr segment) <1% (2 hr) Helium leak check 3 x 10-9 atm cm3/sec 3 x 10-9 atm cm3/sec Particles (>0.1 um
  • MICRO:Archive:Back Issue TOC
    picosecond x-ray source module; Semico Research helps manage inventories; SEMI publishes updated international standards; CRC Press publishes book on minimizing process variability; EOS/ESD symposium to present 53 technical papers Breakout: Applied, Novellus claim their latest copper process tools
  • MICRO:Semicon West '99 (June '99)
    Technology..........2708 Process Tube Systems..........2959 Progressive System Technologies..........2145 Progressive Technologies..........2529 Proportion Air..........1526X PTI Seminars..........746 Putnam Precision Marking..........3023A Q4D..........2526F Qualiflow..........3027

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