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  • http://dspace.mit.edu/bitstream/handle/1721.1/61925/707344973.pdf?sequence=1
    Alloying lead - tin solders with bismuth and indium lowers the solder's melting temperature and yield strength .
  • The strain-rate sensitivity of high-strength high-toughness steels.
    This is in distinct contrast to recent results on a very different metallic alloy , eutectic lead - tin solder, where the same range in strain-rates causes a 100% increase in yield - strength .
  • ZASMHBA0001831
    nium alloys, nickel-copper alloys, and aluminum alloys are stressed while in contact with low-melting metals, including lead , tin , cadmium, lithium, indium, gallium, and mercury, they may be embrittled and fracture at a stress below the yield strength of the alloy .
  • ZASMHBA0003167
    ...room-temperature mechanical propertiesof copper-base bearing alloys Alloyfamily Commercial bronze Unleaded tin bronzes Low-lead tin bron~s Medium-lead tin bronzes High- lead tin bronzes Copper-lead alloys (a) 0.1% offset... ...Steel backed Compre..~d~ yield strength (a) MPa ksi . . . . . .
  • ZEMEA2008ALL
    ...steels, 367 engineering creep, 266 engineering stress-strain curve, 201­205(F) elastic limit, 204 proportional limit, 204 yield strength ( yield point), 204 environmental effects... ...thermal fatigue, 260 eutectic alloy systems aluminum-silicon eutectic system, 82­84(F) lead - tin eutectic system, 84­85 overview...
  • Thermal stress/strain analysis of ceramic quad flat pack packages and interconnections
    ...the thermal coefficients of linear expan- sion of all these materials are very different (e.g., the thermal expansion mismatch between the al- loy 42 and the solder is 16 ppm). Furthermore. because of the low yield strength and high ductil- ity... According to the true stress-true strain curves for tensile tests on the lead - tin solder alloys reported by Frost, Howard, Lavery and Luten- .
  • ZCACA2001P153
    Table 21 Typical room-temperature mechanical properties of copper-base bearing alloys Compressive yield strength (a) Alloy family Product form MPa ksi Ultimate tensile strength MPa ksi Hardness, HB Commercial bronze Unleaded tin bronzes Low- lead tin bronzes Medium-lead tin bronzes .
  • ZIMR2304P164
    o 38 Change in mechanical properties owing to liquid -metal embrittlement of a pure laboratory heat of 3330 steel wetted with Sn; liquid Sn induces a change in fracture mode from ductile to intergranular near 230°C; yield strength and tensile str ength... Liquid-metal embrittlement has been observed for plain-carbon and low- alloy steels exposed to liquid cadmium, lithium, brass, aluminium bronze, copper, zinc, lead - tin ' solders, mercury, tin, antimony, tellurium, lead, and indium.
  • Analysis of thermomechanical interactions in a miniature solder system under cyclic fatigue loading
    A recent literature review has been conducted to study the rate dependence of yield strength of eutectic and near-eutectic lead - tin solder alloys16 for deter- miningthetemperature-dependentmaterialconstants of D and p in Eq. 2. The experimental stress-strain data for the eutectic Pb37-Sn63 solder alloy pre- sented in Ref. 1...
  • ZEMEA2008P597
    The reader may want to refer to Section 6.3.2 in Chapter 6, "Phase Diagrams," for a discussion of solders in relation to the lead - tin eutectic phase diagram. Silver can be added to lead-tin solders, yielding solders with good tensile, creep, and shear strengths . Lead is very soft and is often alloyed with antimony, tin, calcium, and arsenic to give it...
  • ZCU743
    Chemical Composition, wt.%: Aluminum Iron Magnesium Manganese Nickel Lead Silicon Tin Zinc Copper 2.00­4.00 0.50­2.50 0.10 max 0.10­0.50 13.00­16.00 0.05 max 0.25 max 0.20 max 0.50 max bal Mechanical Properties: Young's modulus, GPa (106 psi) 141.3 (20.5) 53.1 (7.7) Shear modulus, GPa (106 psi) Poisson's ratio 0.33 Yield stress, 0.1%, in torsion, typical... ...60­65 diam bar, % of tensile strength Impact toughness, Izod, typical... This alloy does not embrittle at subzero temperatures and has no significant loss of impact strength at...