Chip Capacitors Information

Chip capacitors or surface mount capacitors do not have leads. They are used in aerospace, automotive, general-purpose, high voltage, high frequency, microwave, and telecommunication applications. Most chip capacitors are packed in tape reel assemblies, carbon-powder trays or rails, and shipping tubes or stick magazines. Bulk pack parts are distributed as individual products. Some chip capacitors or surface mount capacitors are polarized or self-healing. Others meet military standards or do not exhibit capacitance variation with voltage or pressure. Capacitance measures the ability to store energy, given as C = K A/D, where A is the area of the electrodes, D is their separation, and K is a function of the dielectric between the electrodes. Chip capacitors that comply with Restriction of Hazardous Substances (RoHS) are also available. 

Electrostatic chip capacitors or electrolytic surface mount capacitors and electrolytic chip capacitors or electrolytic surface mount capacitors use different types of materials between the capacitor plates. Insulating materials for electrostatic chip capacitors include air, ceramic COG (NPO), ceramic X7R, ceramic Z5U, glass, mica, oil, paraffin paper, polyester, polycarbonate, polypropylene, polystyrene, and proprietary materials such as Teflon (DuPont). Electrolytic chip capacitors can be either wet or dry. Wet electrolytic capacitors have a moist electrolyte. Dry or solid electrolytic capacitors do not. Material choices include aluminum oxide, tantalum oxide, and niobium or niobium oxide. Other, unlisted electrolytic chip capacitors and electrolytic surface mount capacitors are also available. 

Performance specifications for chip capacitors and surface mount capacitors include capacitance range, capacitance tolerance, DC rated voltage range (WVDC), insulation resistance, dissipation factor, pulse rise time, and operating temperature. Capacitance tolerance is usually measured as a percent of the capacitance. DC rated voltage range (WVDC) is the maximum continuous DC voltage that may be continuously applied to a chip capacitor at any temperature between the lower category temperature and the rated temperature. Insulation resistance is defined as the ratio between an applied DC voltage and the resulting leakage current after a minute of charge. Dissipation factor (DF) is the ratio between the resistive and the reactive part of the impedance of the capacitor submitted to a sinusoidal voltage of specified frequency. Pulse rise time defines the ability of chip capacitors or surface mount capacitors to withstand high current peaks due to fast changes in voltage.

• AN0028 Soldering / Mounting Chip Capacitors, Radial Leaded Capacitors and EMI Filters
  This gives guidance to engineers and board designers on mounting and soldering Syfer products....
• AN0007 Stack Chip Components Handling and Usage
  A selected number of components are available 'Tape and Reel' packed. The storage and handling of these components is as for normal chip capacitors. Unless supplied 'Tape and Reel' packed, all stack chip components will be supplied packed in a protective foam environment in individual cells...
• Filter Capacitor Comparison
  capacitors surface mounted would face. Lastly, the planar array ensures a 360 degree attachment to ground to maximize insertion loss up to 1 GHz. The chip capacitor will not have as circumferential a ground and some radiated emissions may not be caught by this solution. The difference and feature of our...