Electronic and IC Packaging Services Information

Electronic packaging and IC packaging services perform the final stage of semiconductor device fabrication, places dies or boards inside of a protective package that provides connectors or pins for connecting to other devices. Protective IC packaging is produced via integrated circuit encapsulation, the last stage of the semiconductor device fabrication process. Today, electronic packaging and IC packaging services provide many different types of IC packages. Examples include single in-line package or system in package (SIP), dual in-line package, (DIP), mini small-outline package (MSOP), micro leadframe package (MLP), shrink small outline package (SSOP), thin shrink small outline package (TSSOP), and very small outline package (VSOP). Electronic component packaging includes tinning, tape and reel packaging, lead forming, baking, lead straightening, and programming.

Electronic packaging and IC packaging services are used by many electronics companies. Integrated circuit packaging is specified according to the number of pins in the chip. For example, an SOP may have 8 to 44 pins while a DIP may have 8 to 48 pins. IC packaging tape is used to stock ICs so that they can be handled. Electronic packaging materials include wafer and substrate bumping pastes, sphere attach fluxes, ultra-spheres (solder spheres), reflow encapsulants (no flow underfills), capillary underfills, thermal interface material, and flip-chip attach fluxes. These electronic packaging materials provide greater versatility and durability than traditional materials such as ceramics and silicon. Electronic and IC packaging services that specialize in custom packaging can meet a customer’s specialized requirements. Many types of IC packaging equipment are used in the designing and manufacturing of integrated circuits. For example, IC packaging equipment is used to perform die attaching, IC bonding, and IC encapsulation.

Electronic packaging and IC packaging services are used in many applications and adhere to demanding quality standards. Application examples include signal and power transmission, heat dissipation, electromagnetic interference (EMI) shielding, and protection from environmental factors such as moisture, contamination, hostile chemicals and radiation. Many electronic and IC packaging services adhere to the Institute for Interconnecting and Packaging Electronic Circuits (IPC) 610 and IPC 7711/7721 standards.

• Ceramic Electronic and IC Packaging Design Guide
  ) 755-5400. (423) 755-5438 Fax. Internet: www.AdTechCeramics.com. Email: sales@AdTechCeramics.com. Design. ISO 9001:2000. Certified. Guide. Ceramic Packages. Product Capabilities. Company Overview. Process Overview. AdTech Ceramics. Products available include: Advanced Technical Ceramics Company. Electronic...
• Semiconductor and IC Package Testing
  Semiconductor, microelectronic, and IC package testing includes testing at the wafer, die, or packaged IC level. Semiconductor and IC package testing services may provide wafer sort and packaging services in addition to component evaluation. In the packaging process, fabricated wafers are cut...
• Surface Enhancements Eliminate ESD Damage During Operation of State-of-the-Art I.C. Handlers
  When San Jose California's Exatron engineered their latest generation of integrated circuit (I.C.) handling equipment, protection from damage due to electro-static discharge (ESD) was a top priority. So they turned to a company known for pioneering high-tech protective coatings for NASA - General...