Semiconductor Fabrication News

From GlobalSpec - a leader in industrial and engineering product news and information

About this eNewsletter

Frequency: 12 issues/year
If this HTML e-newsletter is not displaying properly, go to:
http://www.globalspec.com/newsletter/ViewIssue?Vol=Vol1Issue1_SemiconductorMfg&Pub=48
GlobalSpec: Semiconductor Manufacturing e-Newsletter
Search For:    
Forward to a Friend
 

March 8th, 2006 - Volume 1 Issue 1

In this issue...

Industry Trends & Events  Shrinking the Lines...  MORE

Spotlight On  
  • Simplify Shipping Heavy Freight; Ultrasonic Machining Services...  MORE
  • Automated Semiconductor Equipment; Semiconductor Reliability Test System...  MORE
  • Semiconductor Development; Die Attach Adhesive...  MORE

Wafer Processing Equipment  Immersion Lithography; Detect Process Problems...  MORE

Semiconductor Metrology Instrumentation  Agilent Tehcnologies' Spin-Off Company, Verigy; Testing High-Power Wafers...  MORE

Packaging & Assembly Equipment  Printing the Package; The Third Dimension...   MORE

Semiconductor Materials  Characteristics of Semiconductor Materials; Do Your Device Materials Meet Customer Requirements?...  MORE

Careers  Grass-Roots Standards; Japan Seeks Workplace Equality ...  MORE

Diversions  A “Eureka” Solution to Global Warming; Geeks for the Masses...  MORE

Industry Trends & Events . . .
Shrinking the Lines

In a move to further extend the life of current semiconductor manufacturing methods, IBM has announced a new optical-lithography technique that can deposit 29.9 nm traces on silicon wafers. At one third the size of features currently in production, and less than the 32 nm limit long assumed for optical techniques, the approach promises 64 gigabit memory devices by 2013. With this technology, the company aims to avoid migrating too much more expensive production alternatives until absolutely necessary.

Read more

Spotlight On . . .
Back to the Topback to top

Freightquote.com
Complimentary Service That Simplifies Shipping Heavy Freight

Complimentary Service That Simplifies Shipping Heavy Freight Freightquote.com provides online transportation management solutions for large shipments. The system compares rates and services from thousands of carriers in seconds, and lets the user book and manage all their shipments with one simple online solution. Freightquote.com saves time and money.

Go here for an instant quote or price comparison.

Bullen Ultrasonics, Inc.
Ultrasonic Machining Services


Ultrasonic Machining Services Bullen Ultrasonics machines hard, brittle material like silicon, quartz, silicon carbide, glass, and ceramics using its non-thermal, non-chemical, non-electrical, and low-stress ultrasonic technology. When combined with abrasive slurry, ultrasonic machining allows the tool to create accurate cavities of virtually any shape in hard, brittle materials.

Learn more about Bullen Ultrasonics, Inc.

Wafer Processing Equipment . . .
Back to Topback to top
Immersion Lithography

Nikon has shipped the first immersion lithography system, reportedly to Toshiba’s 300 mm fab joint venture in Japan. The technology, once considered nothing more than a conference-paper curiosity, now represents the transition for device production at 65 nm and below. Other companies plan to adopt the approach as well, although Intel Corporation plans to remain with the more conventional “dry” scanner process.

Detect and Prevent Process Problems

Fab managers must focus on different priorities from those of wafer-processing equipment vendors and manufacturing engineers. Managers must identify process trouble spots, find ways to deal with marginal or defective wafers, and modify specific process parameters so that the problems will not recur. Engineers require machine-level process data to make appropriate equipment adjustments or modifications. Lam Research has presented techniques for maximizing the likelihood of collecting such data and taking advantage of it. Review the report here.

Back to Topback to top
Verigy Takes the Helm for Semiconductor Test

Verigy Takes the Helm for Semiconductor Test The portion of Agilent Technologies devoted to semiconductor test will spin off from the company sometime around mid-year. The new company — to be called Verigy — will include system-on-chip, system-in-package, and memory-test product lines. According to Jack Trautman, president of Agilent’s Semiconductor Test Solutions business, “Verigy is emerging from a powerful historical lineage, a direct line from both Hewlett-Packard’s standards of integrity and innovation and Agilent’s premier measurement business.” Follow the link for the full story.

Testing High-Power Wafers

Testing High-Power Wafers As wafer features continue to shrink and power consumption rises, verifying their performance will require ever-more precise mechanical probing. Even minor probe-card imperfections can compromise test results. High pin counts and high power consumption present considerable challenges. This article in Evaluation Engineering explores the issues and suggests both hypothetical and practical solutions, including greater flexibility in cantilever probes and more reliable probe-to-device contact.

Spotlight On . . .
Back to the Topback to top
U.S. Dynamics Corporation
Automated Semiconductor Equipment Manufacturing

Automated Semiconductor Equipment Manufacturing U.S. Dynamics Corporation produced this automated semiconductor wafer alignment tool to customer specifications as well as manufactured the precision mask alignment rings that hold the wafers in place.
U.S. Dynamics has the ability to combine creative ideas and engineering innovation with every project.

Keithley Instruments, Inc.
S510 Semiconductor Reliability Test System

S510 Semiconductor Reliability Test System Keithley Instruments, Inc. (NYSE:KEI), a leader in solutions for emerging measurement needs, has developed the S510 Semiconductor Reliability Test System, a high channel count, turnkey solution for use in reliability testing and lifetime modeling of the world’s most advanced ULSI CMOS processes, at the 65 nm node and beyond.

Packaging & Assembly Equipment . . .
Back to Topback to top
Printing the Package

Printing the Package Manufacturers are increasingly turning to piezoelectric inkjet technology to improve flexibility and lower costs of packaging operations. The approach permits greater control over the order and amount of fluid application, minimizing waste and fluid costs, permitting higher manufacturing precision, and shortening the time from design to production. Read in this issue of Advanced Packaging about how new conductive, semiconductive, and adhesive fluids will provide additional advantages over traditional packaging methods.

The Third Dimension

In a move that will revolutionize the way that devices are assembled and manufactured, and dramatically increase the amount of circuitry on a single device, the industry is beginning to migrate toward three-dimensional designs. Manufacturers are stacking several silicon dice and packaging them in a single device, thereby reducing the amount of real estate necessary to perform many common tasks. The technology is already showing up on cell phones and other hand-held products. The challenge will be to integrate the device geometry by connecting the dice directly.

Semiconductor Materials . . .
Back to Topback to top
Characteristics of Semiconductor Materials

Characteristics of Semiconductor Materials Every exploration of semiconductor materials has to begin with basic information about their chemistry, their response to temperature changes, voltage and current changes, and so on. This Web site from Ioffe Physico-Technical Institute contains a wealth of such information to facilitate the work of designers, manufacturers, and others. The institute requests only that researchers acknowledge use of information from this site.

Do Your Device Materials Meet Customer Requirements?

New government regulations, such as European Union RoHS laws, require eliminating lead and other hazardous materials from wafers and packaged devices. Consumers of those devices — board and system manufacturers — need assurance of vendor compliance. Yet, providing that assurance may prove more difficult than it first appears. This article from Circuits Assembly magazine explores these issues from the customer’s point of view. The author calls for better communication to assure compliance and avoid misunderstandings.

Spotlight On . . .
Back to the Topback to top
Universal Semiconductor, Inc.
Foundry Services - Semiconductor Development

Foundry Services - Semiconductor Development Foundry Services and design services from Universal Semiconductor, Inc. are ideal for prototyping, product development, initial product runs, and market and concept testing services. Universal Semiconductor, Inc. is one of the early pioneering semiconductor companies in the world that extended and developed innovative technologies for diverse applications.

Ablestik Laboratories
Die Attach Adhesive for Pb-Free Initiatives

Die Attach Adhesive for Pb-free Initiatives A new generation of semiconductor packaging adhesives for Pb-free packaging, ABLEBOND 2000-series electrically conductive die attach adhesives, are designed for Plastic Ball Grid Array (PBGA) packaging and matrix style BGA designs.

Learn more about Ablestik Laboratories.

Careers . . .
Back to the TopBack to top
Grass-Roots Standards

The length of time necessary to get a proposed standard accepted by the IEEE has always spawned more than its share of frustration from vendors and users alike. The battle over wireless standard 802.11n provides an excellent example. In response, a group of semiconductor vendors has banded together as the Enhanced Wireless Consortium (EWC) to propose their own version of the standard. Some consortium members see the group as an alternative to the IEEE, while others see it simply as a way to expedite the standards process.

Japan Seeks Gender Equality

Long regarded in the West as at a disadvantage on the job, Japanese women scientists and engineers are beginning to catch up. For example, the Japanese Association of National Universities has announced a goal of 20% women instructors by 2010. This short article from ASEE Prism discusses strides being made in universities and research laboratories to provide appropriate services to close the gap.

Diversions . . .
Back to the TopBack to top
A “Eureka” Solution to Global Warming

A “Eureka” Solution to Global Warming You thought you had seen all of the original ideas on how to overcome global warming? You may not have seen this one. An article on androidworld.com proposes constructing an enormous shield between the sun and the earth. The shield would cover about three million square miles and cost around $10 billion. The article includes specifications, graphs, and a discussion of the myriad difficulties of implementation.

Geeks for the Masses

Monthly events throughout the country are introducing scientists to people you’d never think would want to meet them. Café Scientifique meetings aim to make science fun. For the price of a cup of coffee or a glass of wine, people can discuss scientific and technical issues that are transforming their lives in an informal setting. Topics range far and wide, and the often standing-room-only crowds attest to the popularity of the idea. Read more of this phenomenon in this New York Times story.

[The site requires a quick registration to access its article archive.]

Change your e-mail or edit your GlobalSpec profile here.

To continue receiving GlobalSpec's Semiconductor Manufacturing e-Newsletter in your e-mail inbox, please add announce@news.globalspec.com to your address book.

If a friend forwarded this e-newsletter and you'd like to receive it directly, register here.

To be removed from our e-newsletter mailing list, follow this link.

© 2006 GlobalSpec, Inc. All rights reserved. GlobalSpec, the GlobalSpec logo, SpecSearch, The Engineering Web and The Engineering Search Engine are registered trademarks of GlobalSpec, Inc., 350 Jordan Road, Troy, NY 12180 - 800.261.2052.
About Our eNewsletters
GlobalSpec offers over 60 eNewsletters designed to keep you abreast of news and information in your industry.

See All Titles
Related eNewsletters
See More

Also on GlobalSpec...
  • Receive email updates on new products and suppliers of interest to you
  • Online, interactive conferences / trade shows featuring latest news and industry trends
  • CR4
    Q&A and discussion for the engineering, scientific, and technical community
  • Engineering and scientific news from hundreds of sources
  • Industrial manufacturers and distributors
Archives
Past Issues of this eNewsletter
Volume 4 - Issue 8 - 08/12/2009
Precision Quality Cylindrical Lenses; Wafer-Process-Solutions; Affordable Wafer Shape and Thickness Tools; Wafer Carriers in Sapphire; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Heater and Thermal Sensors-Heaters with Sensors
Volume 4 - Issue 7 - 07/08/2009
NEW Three-axis Micromanipulator Module; Optical Lens Material: Low Birefringence COC; HVA Series High Voltage Amplifier Line; Over a Century of Thermal Processing Technology Experience; LM Guide Type SSR; Semiconductor Testing; Semi-ceramics Are Us!; Sanitary 3A Transmitter with Integrated Junction Box
Volume 4 - Issue 6 - 06/10/2009
Precision Systems for the Semiconductor Industry!; Energy Savings Dry Vacuum Pumps; CebaRIP Cores; Your AutoFocus Solution; Wafer Inspection Machine; GIG Karasek Develops POWERFILM Rotor Technology; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Fuel Tanks
Volume 4 - Issue 5 - 05/13/2009
Your Partner in Semiconductor Testing, Hexoloy SG Silicon Carbide; Nano Indenter G300; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor Crystals - Silicon Carbide (SiC); Printed and Thin Film Photovoltaics and Batteries
Volume 4 - Issue 4 - 04/08/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; Vacuum Oven Rapid Drying without Residue; Ultra Pure Rubber Seals; Affordable Wafer Shape and Thickness Tools; Class 100 Thin Film Foundry and Silicon Wafer Supplier; NORTON Coated Films
Volume 4 - Issue 3 - 03/11/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; High Throughput, Low-cost, Wet Processing Sytems; 10% off NESLAB ThermoFlex Recirculating Chillers; Plastics and SonicGolf's MEMS Technology Help Vijay Win Cup; EnerChip CC with Integrated Battery Management; Integrated Circuits; Semiconductor Thickness - CHRocodile IT; GIG Karasek Develops POWERFILM Rotor Technology
Volume 4 - Issue 2 - 02/11/2009
Heater and Thermal Sensors-Heaters with Sensors; Etched Foil Heaters - Semiconductor and Wafers; Exceeding Ultimate Flexibility Limits for 30% Less!; Sanitary 3A Transmitter w/ Integrated Junction Box; APTIV PEEK Films for RFID Tags; Film Laminations with Optical Films
Volume 4 - Issue 1 - 01/14/2009
Silicon Microphone; Semiconductor Crystals - Silicon Carbide (SiC); Affordable Wafer Shape and Thickness Tools; Automated Wafer-Die Inspection Services; Semiconductor Testing; Wafer Inspection Machine
Volume 3 - Issue 12 - 12/10/2008
Ultrapure Quartz Trebor Chemical Heater; ONYX-Flux Control; Thermocouples for ASM Epsilon Reactors; Plascore Cleanroom Wall Systems; Design Services; 7 CFM Two Stage Rotary Vane Vacuum Pump; Infrared Heaters for Industrial Applications; Diamond-Like Thermal Conduction Without the Diamond-Like Price
Volume 3 - Issue 11 - 11/12/2008
Thermocouples for Semi Tools; Rotary Magnetrons Reduce Thin Film Costs; #1 in Lead Screw Positioning; The Ultimate in Microwave Integrated Circuits; Wafer Carriers in Sapphire; Etched Foil Heaters - Semiconductor and Wafers; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness - CHRocodile IT
Volume 3 - Issue 10 - 10/08/2008
PPL(VUE) Safety Shields for HF Service; Fall Embedded Systems Conferences; Wire and Electrode Feedthroughs for Photovoltaic Industry; Motion Control In Semiconductor Industry; Thin Film Technology for Ceramic Substrates; UHP/UHV and Semiconductor Seals; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness
Volume 3 - Issue 9 - 09/10/2008
Fast Delivery for ASM Epsilon Thermocouples; Motion Control in Semiconductor Industry; Semiconductor Wafer Processing Nesting; Simriz 508 for Semiconductor Applications; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Iris P700 Wafer Reader
Volume 3 - Issue 8 - 08/13/2008
Fall Embedded Systems Conferences; For Your Most Demanding UV-IR Applications; Shaping the Future of Integrated MEMS; Semiconductor Thickness -- CHRocodile IT; IC Packaging and Prototyping Services; Thin Film -- RC/RCD; Semitron CMP XL20; Semiconductor Tutorials
Volume 3 - Issue 7 - 07/09/2008
Air Bearing Performance without Air Bearings!; Thermocouples for ASM Epsilon Reactors; Attending Semicon West 2008?; Custom Ceramic Fiber and Flat Ceramic Heaters; Compact Wafer and Glass Sensors, Semicon Booth 6760; Fluoride and pH Sensors for Acid Fluoride Etching; CF and CDF Series Infrared Furnaces; Precision Machined Molybdenum and Tungsten Parts
Volume 3 - Issue 6 - 06/11/2008
Fully Integrated, High Speed Wafer Thickness Measurement; Hermetic Electrical and Optical Components; Your Partner in Semiconductor Testing; Who's Checking Your Bath Water?; Wafer Sensors for the Semiconductor and Flat Panel OEM; HP EDA Solutions; Diamond-Like Thermal Conduction Without the Diamond-Like Price; Infrared Heaters for Industrial Applications
Volume 3 - Issue 5 - 05/14/2008
New TY Series High Speed Linear Actuator; Multi-Tasking Liquid Distribution Manifolds; ; Tubing for Miniature Fluid Power Components; TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM; PPL(VUE) Safety Shields for HF Service ;Revolutionaly Vaisala Dewpoint Technology (-112�° F); Revetest - Advanced Mechanical Surface Testing; Moisture-free Wafer Probing to -55�° C at Your Prober!; HP EDA Solutions; Thermocouples for ASM Epsilon Reactors; CX Series High Frequency RF Power Supplies
Volume 3 - Issue 4 - 04/09/2008
Precision Machined Molybdenum and Tungsten Parts; MEMS at Nanotech 2008 and Clean Technology & Sustainable Industries 2008; Nano-Indentation Tester with IBIS Technology; Semiconductor Products â?? Slurries; Wafer Inspection Machine; Thin Film Coating Instrumentation
Volume 3 - Issue 3 - 03/12/2008
ESC Silicon Valley 2008; Trebor PureBlend® Chemical Drum Mixer; Learn About Newark's Live Edge Design Challenge Today!; Silicon Photodiodes; 150 Amp 25 kV High Voltage Relay — GIGAVAC G52; CF and CDF Series Infrared Furnaces
Volume 3 - Issue 2 - 02/13/2008
Caged Ball LM Guide; ESC Silicon Valley 2008; Isolated Sigma-Delta Modulator Evaluation Board; Heater and Thermal Sensors-Heaters with Sensors; SurePower™ RF Generators; Scroll Vacuum Pumps
Volume 3 - Issue 1 - 01/09/2008
O3MEGA Integrated Ozone Delivery System, ScrewLine SP250, Miniature Vacuum Gauge, Fluoride and pH Sensors for Acid Fluoride Etching, Thin Film — RC/RCD, RF/Microwave GaAs Foundry Services
Volume 2 - Issue 12 - 12/12/2007
Liquid Manifold System with Endless Flexibility, Custom Radiant Heaters Elements Etched Foil, ECG Semiconductors, ScrewLine SP630, New Ultra-Miniature Check Valve, Linear Stepper Motor Stage
Volume 2 - Issue 11 - 11/14/2007
Advanced Nanoscale Surface Technology, Miniature Single-Stage Diaphragm Vacuum Regulators, Helium Leak Detector Custom RF Microwave and Optical Ceramic Packages, Micro EDM Machining Services, Series 999 Quattro 4-in-1 Vacuum Transducer
Volume 2 - Issue 10 - 10/10/2007
Metrology Solutions for Nanotechnology, DigiFlex Performance Servo Drives, Nine of the Top 10 High-tech and Electronics Manufacturers, Unmanaged Industrial Ethernet Switches, piMFC Pressure Insensitive Mass Flow Controller, CF and CDF Series Infrared Furnaces, RF/Microwave GaAs Foundry Services, A Better Job Search by Design
Volume 2 - Issue 9 - 09/12/2007
Semiconductor Technology at Its Best, Liquid Flow Controllers, Avago Technologies Advances Its Gate Drive Optocoupler Portfolio, Wafer Inspection Machine, Silicon Diodes, Fast Recovery 1N5811 Silicon Diode, Custom Thin Film Materials, Silicon Photodiodes, A Better Job Search by Design
Volume 2 - Issue 8 - 08/08/2007
Innovative Solutions for High- and Low-Temperature Process Monitoring; High Purity Fluoromaterials; Chemical Drum Mixer; Hermetic Electrical and Optical Components; Hermetic Electrical and Optical Components; Live Edge Design Challenge Today; New Led Hexadecimal Display; Thin Film - RC / RCD
Volume 2 - Issue 7 - 07/11/2007
Monitor and Control Flow of Pure Liquids, Precision Vacuum Sensors, Trebor PureBlend Chemical Drum Mixer, Etched Foil Heaters - Semiconductor and Wafers, Ceramaseal Products - Hermetic Electrical and Optical Components, Baratron Compact, Low Current, Heated Manometer, 150 Amp 25 kV High Voltage Relay GIGAVAC G52, Scroll Vacuum Pumps, A Better Job Search by Design,
Volume 2 - Issue 6 - 06/13/2007
Power Supplies Featuring SEMI F47 Sag Immunity, Innovative Solutions to Improve Process Capabilities, TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM, Buy Wafer Probes Online, Semicon West is Only a Few Weeks Away, Gas Mass Flow Instruments, #1 in Lead Screw Positioning, Appearing at Semicon West, A Better Job Search by Design, Legal Border Crossings
Volume 2 - Issue 5 - 05/09/2007
Higher Ratings for REALI-SLIM Bearings; Cassette/Wafer Carrier; 250K, 16-bit, 64-channel Analog Input Card; Fabrication and Assembly for Amicon Plastics; Fabrication and Assembly for Amicon Plastics; Accurate Die-Cut
Volume 2 - Issue 4 - 04/11/2007
Increase Production Levels with Integrated Distance Measuring; Semiconductor Probes; Compact-High Precision Piezo Driven Stage; Radiography Digital Systems; Products Machined; MicroSystems Solutions
Volume 2 - Issue 3 - 03/14/2007
Temperature Labels Monitor Overheat Conditions, Multi-Chip SDRAM-DDR, 128-Channel Isolated Digital I/O Card, Procurement and Backend Services, Customer Care, Electroforming
Volume 2 - Issue 2 - 02/14/2007
Precise Humidity and Temperature Control, Extreme Environment Field Power Supply, Safety Shields, Polyimide Cure Tool, Hermetically Sealed Electrical Feedthrough Subassemblies, High Purity Components and Supplies, Capacitance Manometers, Reaction Engineering Lab
Volume 2 - Issue 1 - 01/10/2007
M3 Threaded Needle Valve, Metal Stamping Company, Twin Wire Arc Spray Coating, Custom Radiant Flat Panel Heaters, Advanced Mechanical Surface Testing, Clean Room Storage Equipment
Volume 1 - Issue 10 - 12/13/2006
Pulsed UV Curing System, Vertical Integration to Semiconductor OEMs, Hybrid Turbomolecular Pump, Atmospheric Plasma System, Supercritical Fluid Extraction Systems, Leak Detectors
Volume 1 - Issue 9 - 11/08/2006
Wafers in Stock, UV Curing System, Coating Systems, Ceramic Machining, MicroSystems Solutions, Metal Fabrication
Volume 1 - Issue 8 - 10/11/2006
Cold Ablation Industrial Laser, Wafers, CFD Simulation Products, Wafer Grinding Spindles, DI Water Heater, All-Digital Pressure Transducers, Infrared Heaters, Opto-Mechanical Hardware Available Online
Volume 1 - Issue 7 - 09/13/2006
CFD Simulator for Semiconductor Applications, Flow Measurement Solutions, Ultra-Miniature Compression Fittings, Scratch Testers, Cleanroom Cables, High Frequency RF Power Supplies
Volume 1 - Issue 6 - 08/09/2006
Resist Strip System, Automated Photoresist Bake Tool, High Performance Laser Optics, Precision Vertical Stage, Auger Electron Spectroscopy;, Turnkey Logistics Solutions
Volume 1 - Issue 5 - 07/12/2006
World's First Inline Security IP, Dual Xeon RAID 5 Server, Etched Foil Heaters, Highly Sensitive Photo Transistors, Portable, Compact Dry Pumping System, Rotational Transfer Wet Benches
Volume 1 - Issue 4 - 06/14/2006
High Reliability Connectors, Understanding GaAs Substrates, Ultrasonic Machining Services, Modular Cleanrooms, Printable Paste Adhesive, Accurate and Repeatable Pulse Measurement, Automated Wafer Instrumentation, Revolutionary Sub-Micron Particle Removal
Volume 1 - Issue 3 - 05/10/2006
Wafer Dicing Spindles, Chemical Pumps/DI Water Heater, Accupol Lapping and Polishing Wafer Thinning Jig, Optical Profiler,High Performance Perfluoroelastomer, Surface Engineering and Modification Solutions, Biology and Your Engineering Product Design Problem, Laser Marking System
Volume 1 - Issue 2 - 04/12/2006
Wafer Metrology Measurement Tool, Silicon Components, UV Curing System, Vision Measuring System, High-Temperature Semiconductor Molding Compound, Projection Welding
Volume 1 - Issue 1 - 03/08/2006
Simplify Shipping Heavy Freight, Ultrasonic Machining Services, Automated Semiconductor Equipment, Semiconductor Reliability Test System, Semiconductor Development; Die Attach Adhesive