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GlobalSpec: Semiconductor Manufacturing e-Newsletter
September 13th, 2006 - Volume 1 Issue 7
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In this issue...
Industry Trends & Events  Bring the Power Down;
Win an Ipod® nano — Participate in Our Survey...  more >>
Spotlight On  
  • CFD Simulator for Semiconductor Applications; Flow Measurement Solutions...  more >>
  • Ultra-Miniature Compression Fittings; Scratch Testers...  more >>
  • Cleanroom Cables; High Frequency RF Power Supplies...  more >>

Wafer Processing Equipment  A Candidate for Shrinking Circuits; Probing GaAs Wafers...  more >>

Semiconductor Metrology Instrumentation  Test Strategy the Key; Common Bonds of Test...  more >>

Packaging & Assembly Equipment  Ball Composition on BGAs; Packaging Equipment Challenges...   more >>

Semiconductor Materials  Green Pigment Pushes Performance; ABCs of Polyimide Coatings...  more >>

Careers  A Better Job Search; Cover Your Career Chances; The Future of Business Travel...  more >>

Diversions  Lenovo Adds AMD; Learning by Laptop...  more >>

Links of Interest  Additional Product-Centric e-Newsletters Coming Soon ...   more >>

Industry Trends & Events . . .
Questions and Discussions
Bring the Power Down

Bring the Power Down At the recent Design Automation Conference in San Francisco, the Power Forward Initiative — an industry trade group formed earlier this year to address obstacles to low-power design — presented a roadmap to acceptance of a Common Power-Format specification linking design, verification, and implementation. The group, which includes companies such as Freescale, AMD, NEC, Philips, and Cadence Design Systems, plans to attract more Electronic Design Association (EDA) members and also expects to present the first version of the specification by January, 2007. EE Times reports that the group's goal is to reduce the risk and increase predictability in chip power reduction.

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Spotlight On . . .
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ESI Group
Reactor Scale and Feature Scale CFD Simulator for Semiconductor Applications

Reactor Scale and Feature Scale CFD Simulator for Semiconductor ApplicationsESI Group's CFD simulation products are specially tailored to the needs of semiconductor industry. CFD-ACE+, the reactor scale simulator, predicts the design performance of CVD, plasma, electroplating, electro magnetic applications, ALD, etching, and radiation. CFD-TOPO, the feature scale simulator, predicts the small topographical features in PVD, CVD, plasma enhanced deposition and etching, ALD, and sputtering.

Proteus Industries Inc.
Innovative Flow Measurement Solutions

Innovative Flow Measurement SolutionsSee what's really happening in your heat transfer circuit!

FluidVision® instruments measure and display flow rate, temperature, and pressure in liquids flowing from 0.3 to 230 LPM, at temperatures from -60°C to >170°C. Compatible with all heat transfer fluids. Analog outputs and control limits for each parameter are user-selectable.

Wafer Processing Equipment . . .
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Questions and Discussions Learn more Search by Spec The Engineering Web®
A Candidate for Shrinking Circuits

A Candidate for Shrinking Circuits As circuit features approach the 32 nm range, manufacturers are looking for new production methods to produce high-quality wafers economically. This piece from Semiconductor International describes "nanoimprint lithography", a technique that has been in volume production for years in many applications that require fine line patterning. Researchers report success with features below 2 nm.

Probing GaAs Wafers

Probing GaAs Wafers For applications requiring high-enough performance to justify using GaAs instead of silicon, manufacturers must face unique challenges for probing and testing. This Accuprobe monograph describes the differences between GaAs and silicon, and presents guidelines and recommendations to help reduce wafer damage and improve yields. It discusses probes, custom probe cards, and effective probing techniques.

Semiconductor Metrology Instrumentation . . .
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Questions and Discussions Learn more Search by Spec The Engineering Web®
Test Strategy the Key

Test Strategy the Key The technology of electronic devices advances by leaps and bounds, but the ingredients for success stay much more down-to-earth.

Bill Bottoms of Millennium Test Solutions describes migration from proprietary to generic test strategies. He suggests the business climate has loosened the test constraints, giving manufacturers a chance to incorporate innovative alternatives.

Common Bonds of Test

Common Bonds of Test Like many trade organizations, the Semiconductor Test Consortium looks to link companies with disparate goals to a level of standardization. The Group's Web site outlines its mission and the advantages of the common approach. This presentation provides an overview, including group members, and makes clear that protecting members' intellectual property remains a prime consideration.

Spotlight On . . .
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Beswick Engineering Co., Inc.
Ultra-Miniature Compression Fittings

Ultra-miniature Compression Fittings Beswick Engineering Co., Inc. announces the release of new ultra-miniature M3 threaded compression fittings: M3CB-1016-303 and M3CB-1018-2-303.

The new M3 threaded compression fittings set the industry standard for miniaturization and high performance. They are designed and manufactured for applications where space, leak-tightness, and light weight are required.

CSM Instruments
Scratch Testers: Nano, Micro, and Micro range

Scratch Testers: Nano, Micro, and Micro range The CSM scratch testers are the only commercially available instruments which have an active feedback control loop for continuously adjusting the normal force. Features of the scratch testers include: proven method to quantify adhesion of coatings, acoustic emission, frictional force, penetration depth, optical observation, and very high throughput and reproducibility.
More about CSM Instruments.

Packaging & Assembly Equipment . . .
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Questions and Discussions Learn more Search by Spec The Engineering Web®
Ball Composition on BGAs

Ball Composition on BGAs Producing a reliable BGA package requires paying close attention to the size, position, flow, and other physical characteristics of the balls themselves. This item describes ball composition and structure in considerable detail, providing diagrams and photographs, as well as descriptions of the issues a manufacturer must address to make them successfully.

Packaging Equipment Challenges

Packaging Equipment Challenges Manufacturers often lump all capital equipment into the same bag. That is, they evaluate the equipment based on the same or similar criteria.

In this article from Advanced Packaging, Bruce Hueners of Palomar Technologies describes how packaging equipment differs from wafer-fabrication equipment and other parts of the process.

Semiconductor Materials . . .
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Questions and Discussions Learn more Search by Spec The Engineering Web®
Green Pigment Pushes Performance

Green Pigment Pushes Performance Innovations come from unlikely sources. U.S. researchers are proposing a chip design that processes data by a technique called "spintronics". The heart of their process revolves around a long-discredited centuries-old pigment called "cobalt green". Eighteenth century artists rejected it because it was expensive and produced weak colors. This BBC News item celebrates its resurrection.

ABCs of Polyimide Coatings

ABCs of Polyimide Coatings Sometimes even the most knowledgeable engineer overlooks the basics of a critical technology in the complexities of day-to-day firefighting. A classic "forest and trees" issue. This article from HD Microsystems lays the groundwork for applying polyimide coatings to microelectronic device substrates. The site includes other esoteric aspects of the production process.

Spotlight On . . .
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SAB North America
Cleanroom Cables

Cleanroom Cables These cleanroom cables are available in control and data sizes and are well suited for industries such as semiconductor, pharmaceutical, food processing, and other areas requiring strict adherence to cleanroom certified applications. SAB North America has always been noted for their high quality, oil resistant, coolant resistant, and chemical resistant control and continuous flex cables.

Comdel, Inc.
CX Series High Frequency RF Power Supplies

CX Series High Frequency RF Power Supplies The CX series power supplies are designed to meet the performance demand in RF-driven plasma systems for semiconductor processing. They start at power ranges from 600 to 3500 W, with fixed frequencies from 2 to 30 MHz, and frequency agile capability up to 10% bandwidth.

Learn more about Comdel, Inc.

Careers . . .
Engineering Jobs Click Here
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A Better Job Search by Design

A Better Job Search by Design offers thousands of quality engineering jobs at top technology and engineering companies. Find jobs in your area of expertise. Search now. Click Here

Cover Your Career Chances

Cover Your Career Chances Dressing right or knowing how to conduct yourself at an interview won't do you any good if you don't get that far.

In her column on, Alison Doyle describes how to create effective cover letters and also offers practical tips and examples of cover letters that will get the right kind of attention.

The Future of Business Travel

The Future of Business Travel Traveling on business has changed dramatically in the past few years. Cell phones, laptops, enhanced security measures, and other recent developments have increased stress levels as well as productivity. This Information Week column presents biometrics 3D, RFID, and other developments that you might experience in the next decade. Will they solve the stress?

Diversions . . .
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Lenovo Adds AMD

Lenovo Adds AMD In another coup for runner-up microprocessor maker AMD, number three PC manufacturer Lenovo has announced that it will begin offering more models containing AMD's devices in the U.S. and Western Europe. Although long available in PCs in China, this will represent a major expansion for the former IBM PC product line.

[Access to originating story may require a quick registration.]

Learning by Laptop

Learning by Laptop In a move to improve the educational system and ensure that the country won't be left behind technologically, Thailand's prime minister has announced a program to provide a laptop computer to every child in school. The government will fund the computers as an alternative to conventional textbooks, which the students can find online.

Links of Interest . . .
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Past Issues of this eNewsletter
Volume 4 - Issue 8 - 08/12/2009
Precision Quality Cylindrical Lenses; Wafer-Process-Solutions; Affordable Wafer Shape and Thickness Tools; Wafer Carriers in Sapphire; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Heater and Thermal Sensors-Heaters with Sensors
Volume 4 - Issue 7 - 07/08/2009
NEW Three-axis Micromanipulator Module; Optical Lens Material: Low Birefringence COC; HVA Series High Voltage Amplifier Line; Over a Century of Thermal Processing Technology Experience; LM Guide Type SSR; Semiconductor Testing; Semi-ceramics Are Us!; Sanitary 3A Transmitter with Integrated Junction Box
Volume 4 - Issue 6 - 06/10/2009
Precision Systems for the Semiconductor Industry!; Energy Savings Dry Vacuum Pumps; CebaRIP Cores; Your AutoFocus Solution; Wafer Inspection Machine; GIG Karasek Develops POWERFILM Rotor Technology; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Fuel Tanks
Volume 4 - Issue 5 - 05/13/2009
Your Partner in Semiconductor Testing, Hexoloy SG Silicon Carbide; Nano Indenter G300; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor Crystals - Silicon Carbide (SiC); Printed and Thin Film Photovoltaics and Batteries
Volume 4 - Issue 4 - 04/08/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; Vacuum Oven Rapid Drying without Residue; Ultra Pure Rubber Seals; Affordable Wafer Shape and Thickness Tools; Class 100 Thin Film Foundry and Silicon Wafer Supplier; NORTON Coated Films
Volume 4 - Issue 3 - 03/11/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; High Throughput, Low-cost, Wet Processing Sytems; 10% off NESLAB ThermoFlex Recirculating Chillers; Plastics and SonicGolf's MEMS Technology Help Vijay Win Cup; EnerChip CC with Integrated Battery Management; Integrated Circuits; Semiconductor Thickness - CHRocodile IT; GIG Karasek Develops POWERFILM Rotor Technology
Volume 4 - Issue 2 - 02/11/2009
Heater and Thermal Sensors-Heaters with Sensors; Etched Foil Heaters - Semiconductor and Wafers; Exceeding Ultimate Flexibility Limits for 30% Less!; Sanitary 3A Transmitter w/ Integrated Junction Box; APTIV PEEK Films for RFID Tags; Film Laminations with Optical Films
Volume 4 - Issue 1 - 01/14/2009
Silicon Microphone; Semiconductor Crystals - Silicon Carbide (SiC); Affordable Wafer Shape and Thickness Tools; Automated Wafer-Die Inspection Services; Semiconductor Testing; Wafer Inspection Machine
Volume 3 - Issue 12 - 12/10/2008
Ultrapure Quartz Trebor Chemical Heater; ONYX-Flux Control; Thermocouples for ASM Epsilon Reactors; Plascore Cleanroom Wall Systems; Design Services; 7 CFM Two Stage Rotary Vane Vacuum Pump; Infrared Heaters for Industrial Applications; Diamond-Like Thermal Conduction Without the Diamond-Like Price
Volume 3 - Issue 11 - 11/12/2008
Thermocouples for Semi Tools; Rotary Magnetrons Reduce Thin Film Costs; #1 in Lead Screw Positioning; The Ultimate in Microwave Integrated Circuits; Wafer Carriers in Sapphire; Etched Foil Heaters - Semiconductor and Wafers; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness - CHRocodile IT
Volume 3 - Issue 10 - 10/08/2008
PPL(VUE) Safety Shields for HF Service; Fall Embedded Systems Conferences; Wire and Electrode Feedthroughs for Photovoltaic Industry; Motion Control In Semiconductor Industry; Thin Film Technology for Ceramic Substrates; UHP/UHV and Semiconductor Seals; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness
Volume 3 - Issue 9 - 09/10/2008
Fast Delivery for ASM Epsilon Thermocouples; Motion Control in Semiconductor Industry; Semiconductor Wafer Processing Nesting; Simriz 508 for Semiconductor Applications; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Iris P700 Wafer Reader
Volume 3 - Issue 8 - 08/13/2008
Fall Embedded Systems Conferences; For Your Most Demanding UV-IR Applications; Shaping the Future of Integrated MEMS; Semiconductor Thickness -- CHRocodile IT; IC Packaging and Prototyping Services; Thin Film -- RC/RCD; Semitron CMP XL20; Semiconductor Tutorials
Volume 3 - Issue 7 - 07/09/2008
Air Bearing Performance without Air Bearings!; Thermocouples for ASM Epsilon Reactors; Attending Semicon West 2008?; Custom Ceramic Fiber and Flat Ceramic Heaters; Compact Wafer and Glass Sensors, Semicon Booth 6760; Fluoride and pH Sensors for Acid Fluoride Etching; CF and CDF Series Infrared Furnaces; Precision Machined Molybdenum and Tungsten Parts
Volume 3 - Issue 6 - 06/11/2008
Fully Integrated, High Speed Wafer Thickness Measurement; Hermetic Electrical and Optical Components; Your Partner in Semiconductor Testing; Who's Checking Your Bath Water?; Wafer Sensors for the Semiconductor and Flat Panel OEM; HP EDA Solutions; Diamond-Like Thermal Conduction Without the Diamond-Like Price; Infrared Heaters for Industrial Applications
Volume 3 - Issue 5 - 05/14/2008
New TY Series High Speed Linear Actuator; Multi-Tasking Liquid Distribution Manifolds; ; Tubing for Miniature Fluid Power Components; TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM; PPL(VUE) Safety Shields for HF Service ;Revolutionaly Vaisala Dewpoint Technology (-112�° F); Revetest - Advanced Mechanical Surface Testing; Moisture-free Wafer Probing to -55�° C at Your Prober!; HP EDA Solutions; Thermocouples for ASM Epsilon Reactors; CX Series High Frequency RF Power Supplies
Volume 3 - Issue 4 - 04/09/2008
Precision Machined Molybdenum and Tungsten Parts; MEMS at Nanotech 2008 and Clean Technology & Sustainable Industries 2008; Nano-Indentation Tester with IBIS Technology; Semiconductor Products â?? Slurries; Wafer Inspection Machine; Thin Film Coating Instrumentation
Volume 3 - Issue 3 - 03/12/2008
ESC Silicon Valley 2008; Trebor PureBlend® Chemical Drum Mixer; Learn About Newark's Live Edge Design Challenge Today!; Silicon Photodiodes; 150 Amp 25 kV High Voltage Relay — GIGAVAC G52; CF and CDF Series Infrared Furnaces
Volume 3 - Issue 2 - 02/13/2008
Caged Ball LM Guide; ESC Silicon Valley 2008; Isolated Sigma-Delta Modulator Evaluation Board; Heater and Thermal Sensors-Heaters with Sensors; SurePower™ RF Generators; Scroll Vacuum Pumps
Volume 3 - Issue 1 - 01/09/2008
O3MEGA Integrated Ozone Delivery System, ScrewLine SP250, Miniature Vacuum Gauge, Fluoride and pH Sensors for Acid Fluoride Etching, Thin Film — RC/RCD, RF/Microwave GaAs Foundry Services
Volume 2 - Issue 12 - 12/12/2007
Liquid Manifold System with Endless Flexibility, Custom Radiant Heaters Elements Etched Foil, ECG Semiconductors, ScrewLine SP630, New Ultra-Miniature Check Valve, Linear Stepper Motor Stage
Volume 2 - Issue 11 - 11/14/2007
Advanced Nanoscale Surface Technology, Miniature Single-Stage Diaphragm Vacuum Regulators, Helium Leak Detector Custom RF Microwave and Optical Ceramic Packages, Micro EDM Machining Services, Series 999 Quattro 4-in-1 Vacuum Transducer
Volume 2 - Issue 10 - 10/10/2007
Metrology Solutions for Nanotechnology, DigiFlex Performance Servo Drives, Nine of the Top 10 High-tech and Electronics Manufacturers, Unmanaged Industrial Ethernet Switches, piMFC Pressure Insensitive Mass Flow Controller, CF and CDF Series Infrared Furnaces, RF/Microwave GaAs Foundry Services, A Better Job Search by Design
Volume 2 - Issue 9 - 09/12/2007
Semiconductor Technology at Its Best, Liquid Flow Controllers, Avago Technologies Advances Its Gate Drive Optocoupler Portfolio, Wafer Inspection Machine, Silicon Diodes, Fast Recovery 1N5811 Silicon Diode, Custom Thin Film Materials, Silicon Photodiodes, A Better Job Search by Design
Volume 2 - Issue 8 - 08/08/2007
Innovative Solutions for High- and Low-Temperature Process Monitoring; High Purity Fluoromaterials; Chemical Drum Mixer; Hermetic Electrical and Optical Components; Hermetic Electrical and Optical Components; Live Edge Design Challenge Today; New Led Hexadecimal Display; Thin Film - RC / RCD
Volume 2 - Issue 7 - 07/11/2007
Monitor and Control Flow of Pure Liquids, Precision Vacuum Sensors, Trebor PureBlend Chemical Drum Mixer, Etched Foil Heaters - Semiconductor and Wafers, Ceramaseal Products - Hermetic Electrical and Optical Components, Baratron Compact, Low Current, Heated Manometer, 150 Amp 25 kV High Voltage Relay GIGAVAC G52, Scroll Vacuum Pumps, A Better Job Search by Design,
Volume 2 - Issue 6 - 06/13/2007
Power Supplies Featuring SEMI F47 Sag Immunity, Innovative Solutions to Improve Process Capabilities, TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM, Buy Wafer Probes Online, Semicon West is Only a Few Weeks Away, Gas Mass Flow Instruments, #1 in Lead Screw Positioning, Appearing at Semicon West, A Better Job Search by Design, Legal Border Crossings
Volume 2 - Issue 5 - 05/09/2007
Higher Ratings for REALI-SLIM Bearings; Cassette/Wafer Carrier; 250K, 16-bit, 64-channel Analog Input Card; Fabrication and Assembly for Amicon Plastics; Fabrication and Assembly for Amicon Plastics; Accurate Die-Cut
Volume 2 - Issue 4 - 04/11/2007
Increase Production Levels with Integrated Distance Measuring; Semiconductor Probes; Compact-High Precision Piezo Driven Stage; Radiography Digital Systems; Products Machined; MicroSystems Solutions
Volume 2 - Issue 3 - 03/14/2007
Temperature Labels Monitor Overheat Conditions, Multi-Chip SDRAM-DDR, 128-Channel Isolated Digital I/O Card, Procurement and Backend Services, Customer Care, Electroforming
Volume 2 - Issue 2 - 02/14/2007
Precise Humidity and Temperature Control, Extreme Environment Field Power Supply, Safety Shields, Polyimide Cure Tool, Hermetically Sealed Electrical Feedthrough Subassemblies, High Purity Components and Supplies, Capacitance Manometers, Reaction Engineering Lab
Volume 2 - Issue 1 - 01/10/2007
M3 Threaded Needle Valve, Metal Stamping Company, Twin Wire Arc Spray Coating, Custom Radiant Flat Panel Heaters, Advanced Mechanical Surface Testing, Clean Room Storage Equipment
Volume 1 - Issue 10 - 12/13/2006
Pulsed UV Curing System, Vertical Integration to Semiconductor OEMs, Hybrid Turbomolecular Pump, Atmospheric Plasma System, Supercritical Fluid Extraction Systems, Leak Detectors
Volume 1 - Issue 9 - 11/08/2006
Wafers in Stock, UV Curing System, Coating Systems, Ceramic Machining, MicroSystems Solutions, Metal Fabrication
Volume 1 - Issue 8 - 10/11/2006
Cold Ablation Industrial Laser, Wafers, CFD Simulation Products, Wafer Grinding Spindles, DI Water Heater, All-Digital Pressure Transducers, Infrared Heaters, Opto-Mechanical Hardware Available Online
Volume 1 - Issue 7 - 09/13/2006
CFD Simulator for Semiconductor Applications, Flow Measurement Solutions, Ultra-Miniature Compression Fittings, Scratch Testers, Cleanroom Cables, High Frequency RF Power Supplies
Volume 1 - Issue 6 - 08/09/2006
Resist Strip System, Automated Photoresist Bake Tool, High Performance Laser Optics, Precision Vertical Stage, Auger Electron Spectroscopy;, Turnkey Logistics Solutions
Volume 1 - Issue 5 - 07/12/2006
World's First Inline Security IP, Dual Xeon RAID 5 Server, Etched Foil Heaters, Highly Sensitive Photo Transistors, Portable, Compact Dry Pumping System, Rotational Transfer Wet Benches
Volume 1 - Issue 4 - 06/14/2006
High Reliability Connectors, Understanding GaAs Substrates, Ultrasonic Machining Services, Modular Cleanrooms, Printable Paste Adhesive, Accurate and Repeatable Pulse Measurement, Automated Wafer Instrumentation, Revolutionary Sub-Micron Particle Removal
Volume 1 - Issue 3 - 05/10/2006
Wafer Dicing Spindles, Chemical Pumps/DI Water Heater, Accupol Lapping and Polishing Wafer Thinning Jig, Optical Profiler,High Performance Perfluoroelastomer, Surface Engineering and Modification Solutions, Biology and Your Engineering Product Design Problem, Laser Marking System
Volume 1 - Issue 2 - 04/12/2006
Wafer Metrology Measurement Tool, Silicon Components, UV Curing System, Vision Measuring System, High-Temperature Semiconductor Molding Compound, Projection Welding
Volume 1 - Issue 1 - 03/08/2006
Simplify Shipping Heavy Freight, Ultrasonic Machining Services, Automated Semiconductor Equipment, Semiconductor Reliability Test System, Semiconductor Development; Die Attach Adhesive