Semiconductor Fabrication News

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GlobalSpec: DirectU2 Semiconductor Fabrication
April 9, 2008 - Volume 3 Issue 4
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A Look Back, a Leap Forward

A Look Back, a Leap Forward Sometimes we take the developments in our industry for granted and fail to see the bigger picture. To guess where the industry is going, it is instructive to examine where it has been. Here, PC World celebrates its 25th anniversary with articles that gaze in both directions, looking at the personal computers and developments of 20 years ago and where the editors expect things to be 20 years from now. Technology seems expensive, but two decades of development has kept the cost quite low. If you could find one in 1988, a 150MB hard drive would have cost $8755 based on today's dollars.

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Spotlight On . . .
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Precision Machined Molybdenum and
Tungsten Parts

Elmet Technologies, Inc.

Precision Machined Molybdenum and Tungsten Parts Since 1929, a specialist in supplying world-class custom machined parts, fabrications, and materials for new and emerging technologies.

An ISO 9000 vertically integrated refractory metals company which thrives on developing real world solutions to high-tech customer problems. Contact us today with your precision molybdenum and tungsten machining needs.

MEMS at Nanotech 2008 and Clean Technology & Sustainable Industries 2008
Nano Science and Technology Institute

MEMS at Nanotech 2008 and Clean Technology & Sustainable Industries 2008 Join your colleagues at the largest MEMS and nanotechnology event June 1-5 at the Hynes Convention Center in Boston. Over 1,000 technical, manufacturing, and business sessions covering all applications of nanotechnology and MEMS. Or attend Clean Technology & Sustainable Industries Conference and learn to improve efficiency and lower use of resources.

Semiconductor Materials . . .
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Stretching the Imagination

Stretching the Imagination One drawback of conventional circuits is brittleness. They can break in response to small deformations. Now, researchers have an alternative — a circuit material that can stretch up to twice its rest length without breaking. In addition to making traditional electronics more robust, the innovation opens a host of practical applications.

Resistance is Futile

Resistance is Futile As semiconductor features shrink, the fractional signal lost to resistive heat increases. The ultimate solution would exploit superconductors. But materials could only superconduct at cryogenic temperatures. Apparently, a Canadian-German team has found the Holy Grail — a super-compressed silicon-hydrogen compound whose resistance goes to zero at room temperature.

Packaging & Assembly Equipment . . .
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Putting More Cores on the Chip

Putting More Cores on the Chip Only a couple of years ago, Intel introduced its first chip containing two cores. Today, high-end devices can contain four cores. At the recent Intel Developer's Forum in Shanghai, China, the company announced a six-core entry available later this year. Shrinking geometries and increasing density will continue to challenge packaging technology.

Chat Between the Cores

Chat Between the Cores How can you avoid the inevitable bottleneck of sending signals between cores on a single chip? IBM scientists in Yorktown Heights, NY have created a Nanophotonic switch — a way to communicate using pulses of light instead of copper wires. The resulting technology paves the way for ever faster, ever denser information transfer.

Accent On . . .
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Nano-Indentation Tester with IBIS Technology
 
Micro Photonics Inc.

Nano-Indentation Tester with IBIS Technology The Nanovea Nano-Indentation Tester with IBIS technology is a high-precision instrument for the determination of the nano mechanical properties of thin films, coatings, and substrates. Micro Photonics collaborated with renown nano-mechanical expert Dr. A.C. Fischer-Cripps to offer this advanced technology.

Semiconductor Products — Slurries
Engineered Surface Finishes — A group of Cabot Microelectronics Corp.

Semiconductor Products — Slurries The chemical mechanical planarization (CMP) process plays a critical role in the manufacture of today's advanced semiconductor "chips." It's a highly accurate polishing process that flattens and smoothes the surface of a silicon wafer, creating a highly uniform surface upon which multiple layers of intricate chip circuitry are built.

Learn more about Engineered Surface Finishes.

Semiconductor Test & Measurement . . .
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Wafers Get Bigger, Circuits Get Smaller

Wafers Get Bigger, Circuits Get Smaller As the size of electronic device geometries continues to shrink, pressure is mounting to shift more of the test burden to the wafer stage. After all, screening out bad dice before carving up the wafer saves the packaging costs. This item from Evaluation Engineering explores some of the tools that support this paradigm shift.

Getting Devices to Work Together

Getting Devices to Work Together Testing device function is no longer the ultimate goal in semiconductor manufacturing. Systems makers want to ensure that devices bought from different vendors will interact correctly. This white paper examines the RapidIO interoperability standard — what it is, where it comes from, and how it works. How do you control interoperability?

What do other engineers think of this?
See for yourself at
CR4 — GlobalSpec's Engineering Community.

Manufacturing Process Equipment . . .
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Take Off Your Mask

Take Off Your Mask One of the largest costs of photolithography manufacturing is the cost of making the mask. But what if you could eliminate the mask? When would the savings exceed the additional process cost? This article from Microlithography World explores the economics of maskless techniques, including issues from startup headaches to break-even points.

Keeping Cool — in Miniature

Keeping Cool — in Miniature Devices get smaller, but not all components participate in that progress. This item from Red Orbit describes another victory — a microprocessor-sized fan with no moving parts. It can control temperatures in the increasingly temperature-challenged world of notebook computers and similar environments. The result is elegant and inexpensive.

Focus On . . .
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Wafer Inspection Machine
DWFritz Automation, Inc.

Wafer Inspection Machine This machine uses high-performance machine vision to inspect the precision alignment of small components attached to a silicon wafer. Wafers are loaded by robot then tracked by wafer ID using optical character recognition. Results of the inspection are mapped to the customer's wafer database for use by downstream processes.

Learn about DWFritz Automation, Inc.

Thin Film Coating Instrumentation
Nor-Cal Products, Inc.

Thin Film Coating Instrumentation Nor-Cal offers an extensive selection of commonly used quartz crystal feedthroughs, sensors and multi-channel monitors, cables, quartz crystals, accessories, and replacement parts for use in semiconductor, optical, and industrial thermal deposition processes. Custom feedthroughs are available with a variety of flanges in all sizes.

Careers . . .
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A Better Job Search by Design
Dice

A Better Job Search by Design DiceEngineering.com offers thousands of quality engineering jobs at top technology and engineering companies. Find jobs in your area of expertise. Search now.

Go Here
Hedging Your Entrepreneurial Bets
 

Hedging Your Entrepreneurial Bets Looking to start your own business? There are lots of cautions, including how to buy groceries and pay the mortgage while starting your business. This Business Week column recommends the same solution given to comedians in the Catskills half a century ago — "Don't give up your day job!" Working your entrepreneurial schedule around your existing employment can give you valuable breathing room before your new venture takes off.

Diversions . . .

Swimsuit Design Can Develop Your Career

Swimsuit Design Can Develop Your Career For anyone who assumes engineering is a dull career choice, consider the engineering version of a swimsuit competition — semiconductors are optional. In particular, a Science Daily article profiles the task practiced by those lucky souls who pour their expertise into creating the World's Best Swimsuit. No, not the one that will win the Miss America contest, but the one that minimizes drag. Engineers use simulation, mathematical modeling, and fluid flow to help swimmers and divers achieve their best possible performance.

Share Your Thoughts . . .

Join a Conversation About This Month's Topic...

Join a Conversation About This Month's Topic... Back to the Semi-Future

Innovations come piecemeal in advancing semiconductor technology. Which ones will you adopt? What challenges do/will you face that create bottlenecks that you haven't yet solved?


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Archives
Past Issues of this eNewsletter
Volume 4 - Issue 8 - 08/12/2009
Precision Quality Cylindrical Lenses; Wafer-Process-Solutions; Affordable Wafer Shape and Thickness Tools; Wafer Carriers in Sapphire; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Heater and Thermal Sensors-Heaters with Sensors
Volume 4 - Issue 7 - 07/08/2009
NEW Three-axis Micromanipulator Module; Optical Lens Material: Low Birefringence COC; HVA Series High Voltage Amplifier Line; Over a Century of Thermal Processing Technology Experience; LM Guide Type SSR; Semiconductor Testing; Semi-ceramics Are Us!; Sanitary 3A Transmitter with Integrated Junction Box
Volume 4 - Issue 6 - 06/10/2009
Precision Systems for the Semiconductor Industry!; Energy Savings Dry Vacuum Pumps; CebaRIP Cores; Your AutoFocus Solution; Wafer Inspection Machine; GIG Karasek Develops POWERFILM Rotor Technology; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Fuel Tanks
Volume 4 - Issue 5 - 05/13/2009
Your Partner in Semiconductor Testing, Hexoloy SG Silicon Carbide; Nano Indenter G300; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor Crystals - Silicon Carbide (SiC); Printed and Thin Film Photovoltaics and Batteries
Volume 4 - Issue 4 - 04/08/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; Vacuum Oven Rapid Drying without Residue; Ultra Pure Rubber Seals; Affordable Wafer Shape and Thickness Tools; Class 100 Thin Film Foundry and Silicon Wafer Supplier; NORTON Coated Films
Volume 4 - Issue 3 - 03/11/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; High Throughput, Low-cost, Wet Processing Sytems; 10% off NESLAB ThermoFlex Recirculating Chillers; Plastics and SonicGolf's MEMS Technology Help Vijay Win Cup; EnerChip CC with Integrated Battery Management; Integrated Circuits; Semiconductor Thickness - CHRocodile IT; GIG Karasek Develops POWERFILM Rotor Technology
Volume 4 - Issue 2 - 02/11/2009
Heater and Thermal Sensors-Heaters with Sensors; Etched Foil Heaters - Semiconductor and Wafers; Exceeding Ultimate Flexibility Limits for 30% Less!; Sanitary 3A Transmitter w/ Integrated Junction Box; APTIV PEEK Films for RFID Tags; Film Laminations with Optical Films
Volume 4 - Issue 1 - 01/14/2009
Silicon Microphone; Semiconductor Crystals - Silicon Carbide (SiC); Affordable Wafer Shape and Thickness Tools; Automated Wafer-Die Inspection Services; Semiconductor Testing; Wafer Inspection Machine
Volume 3 - Issue 12 - 12/10/2008
Ultrapure Quartz Trebor Chemical Heater; ONYX-Flux Control; Thermocouples for ASM Epsilon Reactors; Plascore Cleanroom Wall Systems; Design Services; 7 CFM Two Stage Rotary Vane Vacuum Pump; Infrared Heaters for Industrial Applications; Diamond-Like Thermal Conduction Without the Diamond-Like Price
Volume 3 - Issue 11 - 11/12/2008
Thermocouples for Semi Tools; Rotary Magnetrons Reduce Thin Film Costs; #1 in Lead Screw Positioning; The Ultimate in Microwave Integrated Circuits; Wafer Carriers in Sapphire; Etched Foil Heaters - Semiconductor and Wafers; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness - CHRocodile IT
Volume 3 - Issue 10 - 10/08/2008
PPL(VUE) Safety Shields for HF Service; Fall Embedded Systems Conferences; Wire and Electrode Feedthroughs for Photovoltaic Industry; Motion Control In Semiconductor Industry; Thin Film Technology for Ceramic Substrates; UHP/UHV and Semiconductor Seals; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness
Volume 3 - Issue 9 - 09/10/2008
Fast Delivery for ASM Epsilon Thermocouples; Motion Control in Semiconductor Industry; Semiconductor Wafer Processing Nesting; Simriz 508 for Semiconductor Applications; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Iris P700 Wafer Reader
Volume 3 - Issue 8 - 08/13/2008
Fall Embedded Systems Conferences; For Your Most Demanding UV-IR Applications; Shaping the Future of Integrated MEMS; Semiconductor Thickness -- CHRocodile IT; IC Packaging and Prototyping Services; Thin Film -- RC/RCD; Semitron CMP XL20; Semiconductor Tutorials
Volume 3 - Issue 7 - 07/09/2008
Air Bearing Performance without Air Bearings!; Thermocouples for ASM Epsilon Reactors; Attending Semicon West 2008?; Custom Ceramic Fiber and Flat Ceramic Heaters; Compact Wafer and Glass Sensors, Semicon Booth 6760; Fluoride and pH Sensors for Acid Fluoride Etching; CF and CDF Series Infrared Furnaces; Precision Machined Molybdenum and Tungsten Parts
Volume 3 - Issue 6 - 06/11/2008
Fully Integrated, High Speed Wafer Thickness Measurement; Hermetic Electrical and Optical Components; Your Partner in Semiconductor Testing; Who's Checking Your Bath Water?; Wafer Sensors for the Semiconductor and Flat Panel OEM; HP EDA Solutions; Diamond-Like Thermal Conduction Without the Diamond-Like Price; Infrared Heaters for Industrial Applications
Volume 3 - Issue 5 - 05/14/2008
New TY Series High Speed Linear Actuator; Multi-Tasking Liquid Distribution Manifolds; ; Tubing for Miniature Fluid Power Components; TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM; PPL(VUE) Safety Shields for HF Service ;Revolutionaly Vaisala Dewpoint Technology (-112�° F); Revetest - Advanced Mechanical Surface Testing; Moisture-free Wafer Probing to -55�° C at Your Prober!; HP EDA Solutions; Thermocouples for ASM Epsilon Reactors; CX Series High Frequency RF Power Supplies
Volume 3 - Issue 4 - 04/09/2008
Precision Machined Molybdenum and Tungsten Parts; MEMS at Nanotech 2008 and Clean Technology & Sustainable Industries 2008; Nano-Indentation Tester with IBIS Technology; Semiconductor Products â?? Slurries; Wafer Inspection Machine; Thin Film Coating Instrumentation
Volume 3 - Issue 3 - 03/12/2008
ESC Silicon Valley 2008; Trebor PureBlend® Chemical Drum Mixer; Learn About Newark's Live Edge Design Challenge Today!; Silicon Photodiodes; 150 Amp 25 kV High Voltage Relay — GIGAVAC G52; CF and CDF Series Infrared Furnaces
Volume 3 - Issue 2 - 02/13/2008
Caged Ball LM Guide; ESC Silicon Valley 2008; Isolated Sigma-Delta Modulator Evaluation Board; Heater and Thermal Sensors-Heaters with Sensors; SurePower™ RF Generators; Scroll Vacuum Pumps
Volume 3 - Issue 1 - 01/09/2008
O3MEGA Integrated Ozone Delivery System, ScrewLine SP250, Miniature Vacuum Gauge, Fluoride and pH Sensors for Acid Fluoride Etching, Thin Film — RC/RCD, RF/Microwave GaAs Foundry Services
Volume 2 - Issue 12 - 12/12/2007
Liquid Manifold System with Endless Flexibility, Custom Radiant Heaters Elements Etched Foil, ECG Semiconductors, ScrewLine SP630, New Ultra-Miniature Check Valve, Linear Stepper Motor Stage
Volume 2 - Issue 11 - 11/14/2007
Advanced Nanoscale Surface Technology, Miniature Single-Stage Diaphragm Vacuum Regulators, Helium Leak Detector Custom RF Microwave and Optical Ceramic Packages, Micro EDM Machining Services, Series 999 Quattro 4-in-1 Vacuum Transducer
Volume 2 - Issue 10 - 10/10/2007
Metrology Solutions for Nanotechnology, DigiFlex Performance Servo Drives, Nine of the Top 10 High-tech and Electronics Manufacturers, Unmanaged Industrial Ethernet Switches, piMFC Pressure Insensitive Mass Flow Controller, CF and CDF Series Infrared Furnaces, RF/Microwave GaAs Foundry Services, A Better Job Search by Design
Volume 2 - Issue 9 - 09/12/2007
Semiconductor Technology at Its Best, Liquid Flow Controllers, Avago Technologies Advances Its Gate Drive Optocoupler Portfolio, Wafer Inspection Machine, Silicon Diodes, Fast Recovery 1N5811 Silicon Diode, Custom Thin Film Materials, Silicon Photodiodes, A Better Job Search by Design
Volume 2 - Issue 8 - 08/08/2007
Innovative Solutions for High- and Low-Temperature Process Monitoring; High Purity Fluoromaterials; Chemical Drum Mixer; Hermetic Electrical and Optical Components; Hermetic Electrical and Optical Components; Live Edge Design Challenge Today; New Led Hexadecimal Display; Thin Film - RC / RCD
Volume 2 - Issue 7 - 07/11/2007
Monitor and Control Flow of Pure Liquids, Precision Vacuum Sensors, Trebor PureBlend Chemical Drum Mixer, Etched Foil Heaters - Semiconductor and Wafers, Ceramaseal Products - Hermetic Electrical and Optical Components, Baratron Compact, Low Current, Heated Manometer, 150 Amp 25 kV High Voltage Relay GIGAVAC G52, Scroll Vacuum Pumps, A Better Job Search by Design,
Volume 2 - Issue 6 - 06/13/2007
Power Supplies Featuring SEMI F47 Sag Immunity, Innovative Solutions to Improve Process Capabilities, TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM, Buy Wafer Probes Online, Semicon West is Only a Few Weeks Away, Gas Mass Flow Instruments, #1 in Lead Screw Positioning, Appearing at Semicon West, A Better Job Search by Design, Legal Border Crossings
Volume 2 - Issue 5 - 05/09/2007
Higher Ratings for REALI-SLIM Bearings; Cassette/Wafer Carrier; 250K, 16-bit, 64-channel Analog Input Card; Fabrication and Assembly for Amicon Plastics; Fabrication and Assembly for Amicon Plastics; Accurate Die-Cut
Volume 2 - Issue 4 - 04/11/2007
Increase Production Levels with Integrated Distance Measuring; Semiconductor Probes; Compact-High Precision Piezo Driven Stage; Radiography Digital Systems; Products Machined; MicroSystems Solutions
Volume 2 - Issue 3 - 03/14/2007
Temperature Labels Monitor Overheat Conditions, Multi-Chip SDRAM-DDR, 128-Channel Isolated Digital I/O Card, Procurement and Backend Services, Customer Care, Electroforming
Volume 2 - Issue 2 - 02/14/2007
Precise Humidity and Temperature Control, Extreme Environment Field Power Supply, Safety Shields, Polyimide Cure Tool, Hermetically Sealed Electrical Feedthrough Subassemblies, High Purity Components and Supplies, Capacitance Manometers, Reaction Engineering Lab
Volume 2 - Issue 1 - 01/10/2007
M3 Threaded Needle Valve, Metal Stamping Company, Twin Wire Arc Spray Coating, Custom Radiant Flat Panel Heaters, Advanced Mechanical Surface Testing, Clean Room Storage Equipment
Volume 1 - Issue 10 - 12/13/2006
Pulsed UV Curing System, Vertical Integration to Semiconductor OEMs, Hybrid Turbomolecular Pump, Atmospheric Plasma System, Supercritical Fluid Extraction Systems, Leak Detectors
Volume 1 - Issue 9 - 11/08/2006
Wafers in Stock, UV Curing System, Coating Systems, Ceramic Machining, MicroSystems Solutions, Metal Fabrication
Volume 1 - Issue 8 - 10/11/2006
Cold Ablation Industrial Laser, Wafers, CFD Simulation Products, Wafer Grinding Spindles, DI Water Heater, All-Digital Pressure Transducers, Infrared Heaters, Opto-Mechanical Hardware Available Online
Volume 1 - Issue 7 - 09/13/2006
CFD Simulator for Semiconductor Applications, Flow Measurement Solutions, Ultra-Miniature Compression Fittings, Scratch Testers, Cleanroom Cables, High Frequency RF Power Supplies
Volume 1 - Issue 6 - 08/09/2006
Resist Strip System, Automated Photoresist Bake Tool, High Performance Laser Optics, Precision Vertical Stage, Auger Electron Spectroscopy;, Turnkey Logistics Solutions
Volume 1 - Issue 5 - 07/12/2006
World's First Inline Security IP, Dual Xeon RAID 5 Server, Etched Foil Heaters, Highly Sensitive Photo Transistors, Portable, Compact Dry Pumping System, Rotational Transfer Wet Benches
Volume 1 - Issue 4 - 06/14/2006
High Reliability Connectors, Understanding GaAs Substrates, Ultrasonic Machining Services, Modular Cleanrooms, Printable Paste Adhesive, Accurate and Repeatable Pulse Measurement, Automated Wafer Instrumentation, Revolutionary Sub-Micron Particle Removal
Volume 1 - Issue 3 - 05/10/2006
Wafer Dicing Spindles, Chemical Pumps/DI Water Heater, Accupol Lapping and Polishing Wafer Thinning Jig, Optical Profiler,High Performance Perfluoroelastomer, Surface Engineering and Modification Solutions, Biology and Your Engineering Product Design Problem, Laser Marking System
Volume 1 - Issue 2 - 04/12/2006
Wafer Metrology Measurement Tool, Silicon Components, UV Curing System, Vision Measuring System, High-Temperature Semiconductor Molding Compound, Projection Welding
Volume 1 - Issue 1 - 03/08/2006
Simplify Shipping Heavy Freight, Ultrasonic Machining Services, Automated Semiconductor Equipment, Semiconductor Reliability Test System, Semiconductor Development; Die Attach Adhesive