Semiconductor Fabrication News

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GlobalSpec: DirectU2 Semiconductor Fabrication
August 13, 2008 - Volume 3 Issue 8
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Compete with the Big Fish

Compete with the Big Fish How do you grow a semiconductor business when, relatively speaking, you are only a goldfish and your competition is a shark? AMD has been struggling with that very question for several years. Once the recognized technology leader in microprocessors, AMD has been caught and, by at least some measures, surpassed by giant rival Intel. After six consecutive losing quarters, how can they turn it around? There has even been talk around the industry that someone might acquire the troubled chipmaker. In this Blog entry from Information Week, Alexander Wolfe offers five insightful ideas on ways to save the company.

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Fall Embedded Systems Conferences
TechInsights Events

Fall Embedded Systems Conferences ESC Boston and ESC India

Imagine TWO conferences where engineers can address the problems, issues, and dilemmas that are bogging down their designs. That's the power of ESC Boston and ESC India. Learn how to solve the design issues of tomorrow, today.

Visit ESC India at www.embedded.com/esc/India

Visit ESC Boston at www.embedded.com/esc/boston

For Your Most Demanding UV-IR Applications
ARW Optical Corporation

For Your Most Demanding UV-IR Applications Do you need custom cylindrical lenses for your most demanding UV-IR applications? Whether prototyping or volume-production, ARW Optical has the manufacturing expertise to deliver lenses with consistent part-to-part quality and short lead-times.

Shaping the Future of Integrated MEMS
DALSA

Shaping the Future of Integrated MEMS DALSA's fabrication strengths include integration of sense and actuation circuitry alongside MEMS structures, flexible wafer-scale packaging, and a range of materials, equipment, and processes that enable advanced MEMS and image sensor performance. Customers are able to optimize architecture, performance, and reliability to meet the needs of high-volume, mission-critical microsystems in telecom, automotive, and industrial applications.

Semiconductor Thickness — CHRocodile IT
Precitech, Inc.

Semiconductor Thickness — CHRocodile IT The new CHRocodile IT from Precitec Optronik offers simple and highly accurate layer thickness measurement for semiconductor wafers and multi-layered thin film. It provides non-contact silicon scanning with just one measuring point and can measure a wafer precisely to a thickness of 1 mm.

Semiconductor Materials . . .
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SemiCon West: Present and Future

SemiCon West: Present and Future This year's SemiCon West left a lasting impression on those who attended. The technical editors from Semiconductor International offer their comments on the show, its high points, and the industry buzz about what might be the industry's next big thing. Carbon Nanotubes, graphene, and solar technology top the list.

Old Solutions for Today's Questions

Old Solutions for Today's Questions Some discoveries are simply ahead of their time. As engineers try to understand how materials like graphene and carbon nanotubes will behave when applied to electronics, they face inconsistencies with conventional theory. But nonadiabatic effects — proposed 40 years ago — provide a path to understanding at a microscopic level.

Packaging & Assembly Equipment . . .
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Achieving Adequate Compensation

Achieving Adequate Compensation As device features shrink, lithography techniques that worked well begin to show their limitations. The need for precise process resolution becomes acute when feature size dips below the wavelength of light. The article explores compensating for imprecision in creating contacts and vias using optical precision correction (OPC).

More Than Just Black or White

More Than Just Black or White Maximizing process yield and minimizing manufacturing costs often appear to be mutually exclusive goals. Though a few years old, this white paper accurately tells how to reduce the conflict. Recognize that grading each design element as Pass/Fail to predict process yield no longer ensures that the finished device actually works. [A short registration may be required.]

Accent On . . .
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IC Packaging and Prototyping Services
Ultratape Industries

IC Packaging and Prototyping Services Quik-Pak, a division of Delphon Industries, specializes in open-cavity packages and offers IC packages, assembly, and prototype services. Backgrinding, wafer dicing, die/wire bonding, remolding, and marking/branding are just a few of the services available as part of a turn-key assembly solution.

Thin Film — RC/RCD
Universal Semiconductor, Inc.

Thin Film — RC/RCD Integrated thin film resistor capacitor diode network termination products are built on silicon substrates from Universal Semiconductor, Inc. USI's thin film resistors, capacitors, and diodes are fabricated using proprietary, state-of-the-art thin film technology that offers high performance at very high frequencies.

Semiconductor Test & Measurement . . .
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Reducing IC Flicker Noise

Reducing IC Flicker Noise Along with other unwelcome characteristics of semiconductors, excess flicker can produce large numbers of bit errors in data storage or communication. The very technology that makes measuring flicker more important also makes performing that measurement more difficult. Read about a test system whose approach makes the challenge more manageable.

A Period of Ups and Downs

A Period of Ups and Downs The test industry has undergone considerable turmoil. Companies facing higher manufacturing costs reluctantly make major capital purchases. In semiconductor test, pushing the test equipment to pace device technology contributes to the bumpy road. Test & Measurement World explores company performance and mergers in a narrowing competitive landscape.

Manufacturing Process Equipment . . .
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Who Develops Intellectual Property?

Who Develops Intellectual Property? Despite resistance to NIH (not invented here) technology, companies turn outward to acquire intellectual property (IP). This report examines the challenges of matching industry innovation, and the advantages and challenges of handing over some of that responsibility, and covers the six categories of the physical view to consider.

How Low Can It Go?

How Low Can It Go? How small can you make device features using existing manufacturing processes? Companies reach 45 nm with difficulty; the migration to 32 nm has mixed success. Using a technique called scanning beam lithography, MIT researchers have demonstrated 25 nm circuits, and predict they will be able to halve that number.

Focus On . . .
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Semitron® CMP XL20
Quadrant Engineering Plastic Products

Semitron® CMP XL20 Based on a modified polyamide-imide, Semitron® CMP XL20 consistently outlasts all other engineering plastics in all major process environments. Compared to PPS, it lasts up to 20 times longer.

More information about Quadrant.

Semiconductor Tutorials
American Microsemiconductor, Inc.

Semiconductor Tutorials AMS provides tutorials to help their customers better understand semiconductors and other electronic devices. Whether you have a question regarding a particular component, or simply want to know more about semiconductors, browse through their tutorial section for help.

More information about American Microsemiconductor.

Careers & Commentary . . .
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A Generation Dress Gap

A Generation Dress Gap How does a woman dress appropriately for work? According to this article from Business Week, it depends on what generation she comes from. Boomers tend to dress conservatively, having grown up in a culture where they had to fit into a male-dominated workplace. Younger workers embrace flip-flops and other clothing combinations that their older coworkers find — surprising.

Diversions . . .
Finally — the Ultimate Mousetrap

Finally — the Ultimate Mousetrap Call off the cyber cats. At last! That little rodent that has been moving the cursor around the display of your PC may be an endangered species. Invented at Xerox Palo Alto Research Center (PARC) in the 1970s because managers won't use keyboards, the ubiquitous mouse is slowly being supplanted by touch screens, facial-recognition devices, and other gestural techniques. This report comes from BBC News.

Share Your Thoughts . . .
About This Month's Topic...

About This Month's Topic... Is It Real, or Is it Memorex?

Counterfeit versions of popular semiconductor devices are invading the product supply line. Have you discovered fake versions of devices in your board and system-level products? What steps have you taken to prevent it?


Join the discussion...


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Archives
Past Issues of this eNewsletter
Volume 4 - Issue 8 - 08/12/2009
Precision Quality Cylindrical Lenses; Wafer-Process-Solutions; Affordable Wafer Shape and Thickness Tools; Wafer Carriers in Sapphire; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Heater and Thermal Sensors-Heaters with Sensors
Volume 4 - Issue 7 - 07/08/2009
NEW Three-axis Micromanipulator Module; Optical Lens Material: Low Birefringence COC; HVA Series High Voltage Amplifier Line; Over a Century of Thermal Processing Technology Experience; LM Guide Type SSR; Semiconductor Testing; Semi-ceramics Are Us!; Sanitary 3A Transmitter with Integrated Junction Box
Volume 4 - Issue 6 - 06/10/2009
Precision Systems for the Semiconductor Industry!; Energy Savings Dry Vacuum Pumps; CebaRIP Cores; Your AutoFocus Solution; Wafer Inspection Machine; GIG Karasek Develops POWERFILM Rotor Technology; Class 100 Thin Film Foundry and Silicon Wafer Supplier; Fuel Tanks
Volume 4 - Issue 5 - 05/13/2009
Your Partner in Semiconductor Testing, Hexoloy SG Silicon Carbide; Nano Indenter G300; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor Crystals - Silicon Carbide (SiC); Printed and Thin Film Photovoltaics and Batteries
Volume 4 - Issue 4 - 04/08/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; Vacuum Oven Rapid Drying without Residue; Ultra Pure Rubber Seals; Affordable Wafer Shape and Thickness Tools; Class 100 Thin Film Foundry and Silicon Wafer Supplier; NORTON Coated Films
Volume 4 - Issue 3 - 03/11/2009
Leading Manufacturer of Semiconductor Aftermarket IC's; High Throughput, Low-cost, Wet Processing Sytems; 10% off NESLAB ThermoFlex Recirculating Chillers; Plastics and SonicGolf's MEMS Technology Help Vijay Win Cup; EnerChip CC with Integrated Battery Management; Integrated Circuits; Semiconductor Thickness - CHRocodile IT; GIG Karasek Develops POWERFILM Rotor Technology
Volume 4 - Issue 2 - 02/11/2009
Heater and Thermal Sensors-Heaters with Sensors; Etched Foil Heaters - Semiconductor and Wafers; Exceeding Ultimate Flexibility Limits for 30% Less!; Sanitary 3A Transmitter w/ Integrated Junction Box; APTIV PEEK Films for RFID Tags; Film Laminations with Optical Films
Volume 4 - Issue 1 - 01/14/2009
Silicon Microphone; Semiconductor Crystals - Silicon Carbide (SiC); Affordable Wafer Shape and Thickness Tools; Automated Wafer-Die Inspection Services; Semiconductor Testing; Wafer Inspection Machine
Volume 3 - Issue 12 - 12/10/2008
Ultrapure Quartz Trebor Chemical Heater; ONYX-Flux Control; Thermocouples for ASM Epsilon Reactors; Plascore Cleanroom Wall Systems; Design Services; 7 CFM Two Stage Rotary Vane Vacuum Pump; Infrared Heaters for Industrial Applications; Diamond-Like Thermal Conduction Without the Diamond-Like Price
Volume 3 - Issue 11 - 11/12/2008
Thermocouples for Semi Tools; Rotary Magnetrons Reduce Thin Film Costs; #1 in Lead Screw Positioning; The Ultimate in Microwave Integrated Circuits; Wafer Carriers in Sapphire; Etched Foil Heaters - Semiconductor and Wafers; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness - CHRocodile IT
Volume 3 - Issue 10 - 10/08/2008
PPL(VUE) Safety Shields for HF Service; Fall Embedded Systems Conferences; Wire and Electrode Feedthroughs for Photovoltaic Industry; Motion Control In Semiconductor Industry; Thin Film Technology for Ceramic Substrates; UHP/UHV and Semiconductor Seals; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Semiconductor Thickness
Volume 3 - Issue 9 - 09/10/2008
Fast Delivery for ASM Epsilon Thermocouples; Motion Control in Semiconductor Industry; Semiconductor Wafer Processing Nesting; Simriz 508 for Semiconductor Applications; DI Water Best Practices: Replacing Outdated TOC (Total Organic Carbon) Sensors; Iris P700 Wafer Reader
Volume 3 - Issue 8 - 08/13/2008
Fall Embedded Systems Conferences; For Your Most Demanding UV-IR Applications; Shaping the Future of Integrated MEMS; Semiconductor Thickness -- CHRocodile IT; IC Packaging and Prototyping Services; Thin Film -- RC/RCD; Semitron CMP XL20; Semiconductor Tutorials
Volume 3 - Issue 7 - 07/09/2008
Air Bearing Performance without Air Bearings!; Thermocouples for ASM Epsilon Reactors; Attending Semicon West 2008?; Custom Ceramic Fiber and Flat Ceramic Heaters; Compact Wafer and Glass Sensors, Semicon Booth 6760; Fluoride and pH Sensors for Acid Fluoride Etching; CF and CDF Series Infrared Furnaces; Precision Machined Molybdenum and Tungsten Parts
Volume 3 - Issue 6 - 06/11/2008
Fully Integrated, High Speed Wafer Thickness Measurement; Hermetic Electrical and Optical Components; Your Partner in Semiconductor Testing; Who's Checking Your Bath Water?; Wafer Sensors for the Semiconductor and Flat Panel OEM; HP EDA Solutions; Diamond-Like Thermal Conduction Without the Diamond-Like Price; Infrared Heaters for Industrial Applications
Volume 3 - Issue 5 - 05/14/2008
New TY Series High Speed Linear Actuator; Multi-Tasking Liquid Distribution Manifolds; ; Tubing for Miniature Fluid Power Components; TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM; PPL(VUE) Safety Shields for HF Service ;Revolutionaly Vaisala Dewpoint Technology (-112�° F); Revetest - Advanced Mechanical Surface Testing; Moisture-free Wafer Probing to -55�° C at Your Prober!; HP EDA Solutions; Thermocouples for ASM Epsilon Reactors; CX Series High Frequency RF Power Supplies
Volume 3 - Issue 4 - 04/09/2008
Precision Machined Molybdenum and Tungsten Parts; MEMS at Nanotech 2008 and Clean Technology & Sustainable Industries 2008; Nano-Indentation Tester with IBIS Technology; Semiconductor Products â?? Slurries; Wafer Inspection Machine; Thin Film Coating Instrumentation
Volume 3 - Issue 3 - 03/12/2008
ESC Silicon Valley 2008; Trebor PureBlend® Chemical Drum Mixer; Learn About Newark's Live Edge Design Challenge Today!; Silicon Photodiodes; 150 Amp 25 kV High Voltage Relay — GIGAVAC G52; CF and CDF Series Infrared Furnaces
Volume 3 - Issue 2 - 02/13/2008
Caged Ball LM Guide; ESC Silicon Valley 2008; Isolated Sigma-Delta Modulator Evaluation Board; Heater and Thermal Sensors-Heaters with Sensors; SurePower™ RF Generators; Scroll Vacuum Pumps
Volume 3 - Issue 1 - 01/09/2008
O3MEGA Integrated Ozone Delivery System, ScrewLine SP250, Miniature Vacuum Gauge, Fluoride and pH Sensors for Acid Fluoride Etching, Thin Film — RC/RCD, RF/Microwave GaAs Foundry Services
Volume 2 - Issue 12 - 12/12/2007
Liquid Manifold System with Endless Flexibility, Custom Radiant Heaters Elements Etched Foil, ECG Semiconductors, ScrewLine SP630, New Ultra-Miniature Check Valve, Linear Stepper Motor Stage
Volume 2 - Issue 11 - 11/14/2007
Advanced Nanoscale Surface Technology, Miniature Single-Stage Diaphragm Vacuum Regulators, Helium Leak Detector Custom RF Microwave and Optical Ceramic Packages, Micro EDM Machining Services, Series 999 Quattro 4-in-1 Vacuum Transducer
Volume 2 - Issue 10 - 10/10/2007
Metrology Solutions for Nanotechnology, DigiFlex Performance Servo Drives, Nine of the Top 10 High-tech and Electronics Manufacturers, Unmanaged Industrial Ethernet Switches, piMFC Pressure Insensitive Mass Flow Controller, CF and CDF Series Infrared Furnaces, RF/Microwave GaAs Foundry Services, A Better Job Search by Design
Volume 2 - Issue 9 - 09/12/2007
Semiconductor Technology at Its Best, Liquid Flow Controllers, Avago Technologies Advances Its Gate Drive Optocoupler Portfolio, Wafer Inspection Machine, Silicon Diodes, Fast Recovery 1N5811 Silicon Diode, Custom Thin Film Materials, Silicon Photodiodes, A Better Job Search by Design
Volume 2 - Issue 8 - 08/08/2007
Innovative Solutions for High- and Low-Temperature Process Monitoring; High Purity Fluoromaterials; Chemical Drum Mixer; Hermetic Electrical and Optical Components; Hermetic Electrical and Optical Components; Live Edge Design Challenge Today; New Led Hexadecimal Display; Thin Film - RC / RCD
Volume 2 - Issue 7 - 07/11/2007
Monitor and Control Flow of Pure Liquids, Precision Vacuum Sensors, Trebor PureBlend Chemical Drum Mixer, Etched Foil Heaters - Semiconductor and Wafers, Ceramaseal Products - Hermetic Electrical and Optical Components, Baratron Compact, Low Current, Heated Manometer, 150 Amp 25 kV High Voltage Relay GIGAVAC G52, Scroll Vacuum Pumps, A Better Job Search by Design,
Volume 2 - Issue 6 - 06/13/2007
Power Supplies Featuring SEMI F47 Sag Immunity, Innovative Solutions to Improve Process Capabilities, TAKEX Wafer Sensors for the Semiconductor and Flat Panel OEM, Buy Wafer Probes Online, Semicon West is Only a Few Weeks Away, Gas Mass Flow Instruments, #1 in Lead Screw Positioning, Appearing at Semicon West, A Better Job Search by Design, Legal Border Crossings
Volume 2 - Issue 5 - 05/09/2007
Higher Ratings for REALI-SLIM Bearings; Cassette/Wafer Carrier; 250K, 16-bit, 64-channel Analog Input Card; Fabrication and Assembly for Amicon Plastics; Fabrication and Assembly for Amicon Plastics; Accurate Die-Cut
Volume 2 - Issue 4 - 04/11/2007
Increase Production Levels with Integrated Distance Measuring; Semiconductor Probes; Compact-High Precision Piezo Driven Stage; Radiography Digital Systems; Products Machined; MicroSystems Solutions
Volume 2 - Issue 3 - 03/14/2007
Temperature Labels Monitor Overheat Conditions, Multi-Chip SDRAM-DDR, 128-Channel Isolated Digital I/O Card, Procurement and Backend Services, Customer Care, Electroforming
Volume 2 - Issue 2 - 02/14/2007
Precise Humidity and Temperature Control, Extreme Environment Field Power Supply, Safety Shields, Polyimide Cure Tool, Hermetically Sealed Electrical Feedthrough Subassemblies, High Purity Components and Supplies, Capacitance Manometers, Reaction Engineering Lab
Volume 2 - Issue 1 - 01/10/2007
M3 Threaded Needle Valve, Metal Stamping Company, Twin Wire Arc Spray Coating, Custom Radiant Flat Panel Heaters, Advanced Mechanical Surface Testing, Clean Room Storage Equipment
Volume 1 - Issue 10 - 12/13/2006
Pulsed UV Curing System, Vertical Integration to Semiconductor OEMs, Hybrid Turbomolecular Pump, Atmospheric Plasma System, Supercritical Fluid Extraction Systems, Leak Detectors
Volume 1 - Issue 9 - 11/08/2006
Wafers in Stock, UV Curing System, Coating Systems, Ceramic Machining, MicroSystems Solutions, Metal Fabrication
Volume 1 - Issue 8 - 10/11/2006
Cold Ablation Industrial Laser, Wafers, CFD Simulation Products, Wafer Grinding Spindles, DI Water Heater, All-Digital Pressure Transducers, Infrared Heaters, Opto-Mechanical Hardware Available Online
Volume 1 - Issue 7 - 09/13/2006
CFD Simulator for Semiconductor Applications, Flow Measurement Solutions, Ultra-Miniature Compression Fittings, Scratch Testers, Cleanroom Cables, High Frequency RF Power Supplies
Volume 1 - Issue 6 - 08/09/2006
Resist Strip System, Automated Photoresist Bake Tool, High Performance Laser Optics, Precision Vertical Stage, Auger Electron Spectroscopy;, Turnkey Logistics Solutions
Volume 1 - Issue 5 - 07/12/2006
World's First Inline Security IP, Dual Xeon RAID 5 Server, Etched Foil Heaters, Highly Sensitive Photo Transistors, Portable, Compact Dry Pumping System, Rotational Transfer Wet Benches
Volume 1 - Issue 4 - 06/14/2006
High Reliability Connectors, Understanding GaAs Substrates, Ultrasonic Machining Services, Modular Cleanrooms, Printable Paste Adhesive, Accurate and Repeatable Pulse Measurement, Automated Wafer Instrumentation, Revolutionary Sub-Micron Particle Removal
Volume 1 - Issue 3 - 05/10/2006
Wafer Dicing Spindles, Chemical Pumps/DI Water Heater, Accupol Lapping and Polishing Wafer Thinning Jig, Optical Profiler,High Performance Perfluoroelastomer, Surface Engineering and Modification Solutions, Biology and Your Engineering Product Design Problem, Laser Marking System
Volume 1 - Issue 2 - 04/12/2006
Wafer Metrology Measurement Tool, Silicon Components, UV Curing System, Vision Measuring System, High-Temperature Semiconductor Molding Compound, Projection Welding
Volume 1 - Issue 1 - 03/08/2006
Simplify Shipping Heavy Freight, Ultrasonic Machining Services, Automated Semiconductor Equipment, Semiconductor Reliability Test System, Semiconductor Development; Die Attach Adhesive