Semiconductor & MEMS Fabrication News

From GlobalSpec - a leader in industrial and engineering product news and information

About this eNewsletter

Frequency: 12 issues/year
Description: GlobalSpec's Semiconductor & MEMS Fabrication free eNewsletter focuses on silicon-based technologies and manufacturing processes. This free email publication keeps subscribers up-to-date on the latest devices, manufacturing techniques, and applications to improve silicon-based product design, production, and testing. Product news covers microelectronic and optoelectronic devices (transistors, photo detectors, and solar cells) as well as fabrication techniques used in making chip-size motors, actuators, and other micro electrical mechanical systems.
Markets Served: Semiconductor Manufacturing; Electronic Products; Consumer Appliances; Medical Equipment; Aerospace; Automotive; Military; National Defense

FREE Subscription

Get this eNewsletter delivered to your inbox every month!

View Online

Add to safe senders list

IHS GlobalSpec: Semiconductor & MEMs Fabrication
Home  |  Subscriptions  |  Past Issues  |  Upcoming Events  |  On-Demand Events  |  Videos | Send to a Friend
Industry Trends & Events . . .
Solar Cell Thin Films Get Thinner

Solar Cell Thin Films Get Thinner In the ever-expanding world of "less is more," researchers at North Carolina State University have created a new model for predicting the maximum light-efficiency of semiconductor materials. Using the model as a starting point, they have developed a technique that allows reducing the thickness of photovoltaic materials in thin-film solar cells by an order of magnitude while making the cells both more efficient and less expensive. The researchers consider their innovation a game-changer, producing previously unachievable light-absorption efficiencies. Their approach even allows manufacturing the new cells using existing thin-film deposition and lithography techniques.

New Low Power MEMS Accelerometer at
Mouser

Mouser Electronics, Inc.
Conax Thermocouples for ASM Epsilon®
Reactors

Conax Technologies

New Low Power MEMS Accelerometer at Mouser Consuming less than 2μA at a 100 Hz output data rate, Analog Devices ADXL362 is an ultra-low power, 3-axis MEMS accelerometer that provides 12-bit output resolution and samples the full bandwidth of the sensor at all data rates.

Conax Thermocouples for ASM Epsilon® Reactors Highest quality. Longest performance. Customized designs. Selectable set configurations. On-time delivery anywhere in the world. Conax semiconductor products offers our customers all of this and more with all the precision you should expect. And be sure to ask us about our profile and spike thermocouples for diffusion furnaces.

Galil Motion Control — We Move the World
 

Galil Motion Control
Custom Manufacturing of Silicon Substrates
and Optical Components

Cimcoop

Galil Motion Control — We Move the World With over 750,000 controllers sold, Galil is a leading manufacturer of powerful, cost-effective, easy-to-use motion controllers and PLCs. Galil's controllers are backed by our superior technical support and can accommodate the most demanding applications. Speak directly to an engineer at 800-377-6329 if you have questions.

Custom Manufacturing of Silicon Substrates and Optical Components Cimcoop is a custom grower of Silicon material and a manufacturer of precision optical components. Modern production equipment, combined with substantial engineering experience and a favorable location allow us to deliver a premium product at competitive prices. Cimcoop is ISO 9001:2008 certified and ITAR registered. For more information, contact us at info@cimcoop.com.

Design . . .
Learn More
Intel Invades the Mobile World

Intel Invades the Mobile World While some insiders consider Intel a late starter into the chip world for mobile devices, the company has kept busy. This article and the accompanying video introduce their latest creation, which will find its way into cellphones and tablets later this year. It features a 64-bit architecture and a 2.7 GHz processor, and promises phones with a battery life of up to 20 hours.

A New Dimension for Moore's Law

A New Dimension for Moore's Law The dramatically escalating demands of manufacturing ICs has forced the industry to look for new approaches to improving device performance. This article concentrates on 2.5D (silicon interposers containing through-silicon vias [TSVs]) and 3D (such as heterogeneous stacked die connected with TSVs) packaging solutions. It explores the associated challenges, including evolving standards, the increasing demand to design chips for testability, and — inevitably — cost.

Materials. . .
Learn More
Shrinking Transistors — Stuck in Sand

Shrinking Transistors — Stuck in Sand This year may mark a turning point, when cost-per-transistor begins to rise. Microprocessor features that shrank by a factor of almost 500 in the last half-century face formidable obstacles to continuing that trend, including the ever-approaching limits of physics and the strain of economics. Using materials other than silicon may stem the tide for awhile, but long-term success may require more fundamental changes.

Graphene — High Speeds Without Heat

Graphene — High Speeds Without Heat Since its discovery, graphene has looked tantalizingly like a panacea for the electronics industry without ever becoming one. Until now, perhaps? These scientists at Atlanta's Georgia Institute of Technology have constructed graphene nanoribbons that conduct electricity the way light travels along an optical fiber, three orders of magnitude farther than previous versions and 10x better than theory predicted.

Temperature Control Experts in Semi
Compliance

Thermo Fisher Scientific — Thermo Scientific Baths, Circulators & Chillers
Speed Up Your Project Timeline with TI
Designs Reference Design Library

Texas Instruments High-Performance Analog
 

Temperature Control Experts in Semi Compliance Maintain precise temperature control of critical process components in the semiconductor industry with Thermo Scientific ThermoFlex Recirculating Chillers.

•  Ensures process stability
•  Minimizes total cost of ownership
•  Maximizes tool up-time

View our entire Temperature Control product portfolio to see the full breadth of our product offerings.

Speed Up Your Project Timeline with TI Designs Reference Design Library Speed up your project timeline and time to market with this extensive library. Navigate through 150+ comprehensive designs each including test data, a schematic or block diagram, bill of materials (BOM), and design files that help explain the circuit's function and performance. Search by keyword, application or product.

Actually... It IS Easy Being Green

Indium Corporation
Now at Digi-Key — Allegro Position
Sensor ICs

Digi-Key Corporation

Actually... It IS Easy Being Green We make it easy for you to go green with our Pb-free solders. Made using In, Bi, Sn, and Ag, they're precision-engineered in low-, medium-, and high-melting point formulations.

E-mail our engineers now. From One Engineer To Another® Visit us here.

Now at Digi-Key — Allegro Position Sensor ICs Allegro MicroSystems, LLC has developed a line of fully-integrated Hall-Effect digital position sensor ICs that detect changes in magnetic flux density, allowing them to distinguish movement and position. These contactless sensing solutions require few external components and can withstand the hostile operating conditions of automotive applications.

Test & Measurement . . .
Learn More
SoC Verification from the Inside Out

SoC Verification from the Inside Out It should come as no surprise that the considerable and increasing complexity of systems-on-chip (SoCs) complicates efforts to verify them. Effective verification improves yields and throughput while reducing manufacturing and test costs, but device programmability limits the usefulness of device-specific verification tools. This round-table discussion clarifies the issues involved, focusing on using the SoC's own processing capability to reduce the pain.

Testing SoCs at the Other End

Testing SoCs at the Other End Once you've verified the design and constructed the SoC, including its ever-increasing IP content and limited I/O, how do you test it? This article describes the necessary shifts in test strategies to cope and ensure that good devices go out the door. The author advocates a hierarchical approach that allows access to both IP and logic blocks yet eliminates regenerating IP test patterns, and shows how to implement it.

Applications & Commercialization . . .
Learn More
Wafer-level Packaging — Size Doesn't Matter

Wafer-level Packaging — Size Doesn't Matter The need to reduce costs and address capacity constraints puts pressure on semiconductor fabs to migrate to larger wafers. But retooling a fab to make them remains an expensive proposition, especially when not all wafers will conform to that size. This company has introduced a new wafer-level package manufacturing method that operates seamlessly, regardless of the size of the incoming wafer, and can produce both fan-in and fan-out packages.

Gesturing to Play the Field

Gesturing to Play the Field Touchscreens offer a handy way to interact with your computer or mobile device. But touching screens isn't always convenient (dirty hands?) and leaves fingerprints and other marks. This company has created a device that establishes an electrical field so it can interpret even casual gestures. The patented technology won the Electronic Products Product of the Year award for products introduced in 2013.

 
Sensors for Extremely High-resolution
Solutions

BAE Systems Imaging Solutions formerly Fairchild Imaging
New InGaAs and Silicon Avalanche
Photodiodes from OSI Optoelectronics

OSI Optoelectronics

Sensors for Extremely High-resolution Solutions For decades, our Fairchild Imaging products have provided strategic advantages to our electronic imaging OEM customers in various scientific markets, including:

•  Optical and electron microscopy
•  X-ray crystallography
•  X-ray imaging
•  Astronomy

New InGaAs and Silicon Avalanche Photodiodes from OSI Optoelectronics OSI Optoelectronics offers a new selection of high-speed, high-sensitivity, low-noise Silicon and InGaAs Avalanche Photodiodes capable of measuring very low light levels. We offer multiple choices of active areas in a variety of packages in visible, near-infrared, and infrared ranges. Applications include optical fiber communication, laser rangefinders, and high-speed photometry.

Industry Standards . . .
Bending Fatigue Testing of Thin-film Materials

Bending Fatigue Testing of Thin-film Materials This part of IEC 62047, available now from IHS, specifies a method for bending fatigue testing using resonant vibration of microscale MEMS mechanical structures and micromachines. The standard applies to vibrating structures ranging in size from 10 μm to 1 000 μm in the plane direction and 1 μm to 100 μm in thickness.

For more information on IHS standards, visit us here.

Newsletter Subscriptions

Newsletter Subscriptions
Your source for technology news and industry information

Questions & Discussion

Questions & Discussion
CR4: Q&A and discussion for the engineering, scientific, and technical community

Product Alerts

Product Alerts
Receive e-mail updates on new products and suppliers

Enginering News

Engineering News
Engineering and scientific news from hundreds
of sources

Events

Online Trade Shows + Events
Featuring educational presentations from industry leaders and product and technical content presented by participating manufacturer exhibitors.
Call for Speakers — submit your proposal

Product Announcements

Product Announcements
New and featured products from manufacturers and suppliers

Directory of Companies
Part Number Search

Technical Articles
Engineering & Scientific Links

Follow IHS GlobalSpec On . . .  Facebook    Facebook
Feedback | Media Kit | Forward to a Friend

April 9, 2014 - Volume 6 Issue 4
© %%=Datepart(Now(),"year")=%% IHS. IHS, the IHS globe design, GlobalSpec, SpecSearch and The Engineering Web are registered trademarks of IHS, 30 Tech Valley Drive, Suite 102, East Greenbush, NY 12061 - 800.261.2052. All other products, company names, or other marks appearing in this e-newsletter are the trademarks and property of their respective owners.

To ensure prompt delivery, add do-not-reply@email.globalspec.com to your safe senders list. Learn how.

Please do not reply to this e-mail, as we are unable to respond from this address. If you would like to contact us, please send an email to: GS-newslettercomments@ihs.com

To unsubscribe from this e-newsletter, click here.
To unsubscribe from all IHS GlobalSpec email communications, click here.
To edit your user profile, visit Your Profile.
If a friend forwarded this e-newsletter and you'd like to receive it in the future, subscribe directly.

About Our eNewsletters
GlobalSpec offers over 60 eNewsletters designed to keep you abreast of news and information in your industry.

See All Titles
You Might Also Like
See More

Also on GlobalSpec...
  • Receive email updates on new products and suppliers of interest to you
  • Online, interactive conferences / trade shows featuring latest news and industry trends
  • CR4
    Q&A and discussion for the engineering, scientific, and technical community
  • Engineering and scientific news from hundreds of sources
  • Industrial manufacturers and distributors

Not yet a Free Subscriber?

Sign up to receive the newest issue of this newsletter in your inbox FREE.

Archives
Past Issues of this eNewsletter
Volume 6 - Issue 4 - 04/09/2014
New Low Power MEMS Accelerometer; Thermocouples for ASM Epsilon Reactors; We Move the World; Custom Manufacturing of Silicon Substrates and Optical Components; Temperature Control Experts in Semi Compliance; Speed Up Your Project Timeline with Designs Reference Design Library; Actually It IS Easy Being Green; Allegro Position Sensor ICs; Sensors for Extremely High-resolution Solutions; New InGaAs and Silicon Avalanche Photodiodes
Volume 6 - Issue 3 - 03/12/2014
Custom Rotary Sealing Solutions; Improved Metal Lift-off Performance!; Innovative, Single-chip MEMS Oscillator Evaluation Kit; Despatch LCC Ovens for Semiconductor Manufacturing ; Example of Robust Pressure Switch Offering; PRIME MOVER Hermetic Bellows Linear Actuators
Volume 6 - Issue 2 - 02/12/2014
High-Res Inspection Microscope for Large Sensors; Sealing Solutions for Critical Semicon Applications; ETEL's LMS Ironcore Linear Motor Series Limits Thermal Drift; All the Right Moves for Ultimate Precision; RF Transistor - NPN, 12 V, 8 GHZ; Allegro Position Sensor ICs; G-Band Transmitters - Cutting Edge Performance
Volume 6 - Issue 1 - 01/08/2014
Temperature Control Experts in Semi Compliance; LIC 4000 Encoder - Absolute position values to 1 nm; LIP 400 Advances Vacuum Encoder Technology; New IQ+ Vacuum Pressure Control Valves; New MEMS Thermal Sensors; Purely Sealing Your Success; Imaging in Space and Aerial Reconnaisance; Micron RLDRAM Memory; Extreme High-performance MEMS Aerospace Accelerometers
Volume 5 - Issue 12 - 12/11/2013
MEMS Foundry Service; Extended Seal Life Comes as Standard; UV-enhanced Planar Diffused Photodiodes; AMS-IRKT250-16 Dual Thyristors; PRIME MOVER Hermetic Bellows Linear Actuators; G-Band Transmitters - Cutting Edge Performance
Volume 5 - Issue 11 - 11/13/2013
Revolutionary Eddy Current Technology; Purity is the Key to Efficiency; Universal Swivel Bulkhead Fittings; Ovens for Semiconductor Manufacturing; Vacuum Valves...New N-Series; All the Right Moves for Ultimate Precision; Avoiding Semiconductor Failures; Rotary Feedthrough; How-to Guide for Understanding Fluid Chillers; SC TruStability Board Mount Pressure Sensors; 1.5 uA Ultra-low Power TMR Magnetic Switches
Volume 5 - Issue 10 - 10/09/2013
Extremely Compact Brushless DC Servo Motors; New MEMS Motion Sensor; Looking to Increase Your Wafer Yield?; New Avalanche Photodiodes; MIC 6 Aluminum Cast Plate - The Best of the Best; LIC 4000 Encoder - Absolute Position Values to 1 nm; Vacuum Products Catalog; Valuable Partner for Semiconductor Industry; Cost-effective Alternative to Automated Wafer Inspection Systems; Rotary Feedthrough; New Mechanical Lift Table
Volume 5 - Issue 9 - 09/11/2013
Temperature Control Experts in Semi Compliance; Semiconductor and MEMS Device Manufacturing; Simplify Your Liquid Cooling System; All the Right Moves for Ultimate Precision; Ultra Low Outgassing Lubricants; PIC24F: Low-power 16-bit MCUs; Keep an Eye on Wafer Thickness; Rotary Feedthrough
Volume 5 - Issue 8 - 08/14/2013
Innovative, Single-chip MEMS Oscillator Evaluation Kit; Built for the Highest Levels of Efficiency; High Temperature Vacuum Sensing Manometers; Vacuum Sealing and Throttling Butterfly Valve; Simplify Your Liquid Cooling System; Keep an Eye on Wafer Thickness; PRIME MOVER Hermetic Bellows Linear Actuators; Companies Worldwide Taking Advantage of the Accumeasure Systems
Volume 5 - Issue 7 - 07/10/2013
Single-chip MEMS Oscillator Architecture; Joining Forces to Fuel M2M Innovation; PRIME MOVER Hermetic Bellows Linear Actuators; Need a JEDEC Tray for Your New Device Fast?; Vacuum Sealing and Throttling Butterfly Valve; Need a Smaller and Lighter Control Cable?; Simplify Your Liquid Cooling System
Volume 5 - Issue 6 - 06/12/2013
Materials and Technology for Semiconductor Manufacturing; Rotary Systems Provides Rotary Unions for the Asian Market ; THK Caged Ball LM Guide Type RSR and SRS7 ; Need a JEDEC Tray for Your New Device Fast?; LIC 4000 Encoder - Absolute Position Values to 1 nm; Lower Machine Costs and Increase Efficiency; Semi-ceramics Are Us!; PIC24F: Low-power 16-bit MCUs; PRIME MOVER Hermetic Bellows Linear Actuators; TMR Gear Tooth Sensors
Volume 5 - Issue 5 - 05/08/2013
Microcircuit Materials - Large Batch Electronics Grade; Tiny MEMS Pressure/Vacuum Sensor Coming Soon!; Companies Worldwide Taking Advantage of the Accumeasure Systems; Titanate Nano Powders (Barium, Strontium Titanate); Bellows Pumps and Compressors; Hexoloy SG Silicon Carbide
Volume 5 - Issue 4 - 04/10/2013
New Capacitive Measurement Catalog; Wire and Electrode Feedthroughs for Photovoltaic Industry; New Xtrinsic Accelerometers; Apiezon Launches PFPE High Temperature Lubricating Vacuum Grease; New IQ+ Vacuum Pressure Control Valves; Purely Sealing Your Success; PRIME MOVER Hermetic Bellows Linear Actuators; Integrate Micro-imaging Quickly and Easily; Nano-precision Positioners/Aligners Up to Six Axes; Surface Mount Fuses with 72 V Interrupt Rating
Volume 5 - Issue 3 - 03/13/2013
New Three-axis Digital MEMS Gyroscope; Leading-edge Precious Metal Processes for Semiconductors; Purely Sealing Your Success; Analog ASICs Copy-protected by Process; Keep an Eye on Wafer Thickness; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Prime Mover Hermetic Bellows Linear Actuators
Volume 5 - Issue 2 - 02/13/2013
LIC 4000 Encoder - Absolute position values to 1 nm; New Sensor for Wafer Thickness; High Performance MEMS G100Z Gyro - Ultra Low Noise; We've Gone 2D!; PRIME MOVER Hermetic Bellows Linear Actuators; Precision CNC and Conventional Custom Mfg.
Volume 5 - Issue 1 - 01/09/2013
Piezo Motors Nanometer-scale Precision; confocalDT Distance/Thickness Spectrometer; Thermocouples for ASM Epsilon Reactors; Large Industrial Transformers for Alternative Energy; Vacuum Chamber Experts; Transfer Valve/Insert/Door FlapVAT; Purely Sealing Your Success; Bellows Pumps and Compressors; Measure Vibration, Ultrasound, and Temperature Simultaneously; 40 Years of Quality Printed Circuit Boards
Volume 4 - Issue 12 - 12/12/2012
Oil-less Rocking Piston Lab Compressor; Wafer Cleaning - Etch, Strip, Clean, In Control.; Avoiding Semiconductor Failures; Custom Chemical Synthesis ; Rugged Ultra Low Noise Dual Axis Gyro - G200
Volume 4 - Issue 11 - 11/14/2012
STMicroelectronics L3G4200D Gyroscopes; TLC5929: 16-Ch Constant Current LED Driver; Semiconductor Leaders Reduce Processing Costs; Custom Bearings
Volume 4 - Issue 10 - 10/10/2012
New Ultra-versatile Micro Imaging Lens System ; AMOLED and MEMS Device Manufacturing; Precious Metal Plating for Semiconductor Applications; Thermocouples for ASM Epsilon Reactors; New IQ+ Vacuum Pressure Control Valves; PolySim: An ESD-Resistant Enclosure Curtain; Medical Metal Parts in as Little as Two Days!; NASA Low Outgassing Approved, UV Curable Epoxy; Logistics Helps Predict the Future of High-tech Supply Chains
Volume 4 - Issue 9 - 09/12/2012
Advanced MEMS Microphones; Fully Automated Wafer Wet Bench; Precision Analog IMU - MRM30 IMU; High-sensitivity Magnetic Field Sensor; Chillers for Semiconductor Equipment Cooling
Volume 4 - Issue 8 - 08/08/2012
The Next Level of Precision Adjustment; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Manual and Pneumatic Ball Valves; Zero Power Millimeter Sensors Using EnerChips;
Volume 4 - Issue 7 - 07/11/2012
Motorized Precision Positioners for High Vacuum /EUV; Epoxy Offers Shock and Impact Resistance; STT-MRAM Metrology Tool for 300 mm Wafers; New Zooming Single-objective Probing Microscope; Modular Cleanrooms Mean Profits; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 6 - 06/13/2012
Flexible Designs Boost Customer Productivity!; Ultra-high Purity Pump for Semiconductor Manufacturing; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Extend the Life of Your Wet Bench; Chemcassette Paper Tape: The Reel Deal; New Trap for MOCVD; Semiconductor LPCVD Silicon Nitride Film; New Magnetic Angle Sensors by MultiDimension; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 5 - 05/09/2012
New STM32 F4 Series; Get Control of Your Batch Making!; Stop Over Greasing Bearings; HEMP/EMP Filters
Volume 4 - Issue 4 - 04/11/2012
Miniaturized Positioning Stages Offer Micron-level Accuracy; confocalDT High End Spectrometer; Breakthrough Hyper-pure Silicon Finishing; Increase Heat Sink Cooling Efficiency; Wire and Electrode Feedthroughs for Photovoltaic Industry; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; SMT Rework Stations and Inspection Systems
Volume 4 - Issue 3 - 03/14/2012
Profile Thermocouples and Spike Thermocouples for Furnaces; Increase Heat Sink Cooling Efficiency; Aluminum Vacuum Chambers; Ultra Pure Rubber Seals; 200/300 mm Fully Automated Process Station; Leading Edge E-beam Technology Solutions Provider; Offshore and Domestic PCB Manufacturing at Any Volume;
Volume 4 - Issue 2 - 02/08/2012
Micromotors Speed Up PCB Assembly; M2M Application Platform Perfected; 3-axis Light Source Holder Machining Services; Air Conditioning/Refrigeration Compressors and Pressure Vessels; OLED Takes FPD to New Level; Miniature Linear Scale for Tight Spaces; Electrically Insulative Snap Cure Epoxy; New Magnetic Switches Feature High-speed, Low-power
Volume 4 - Issue 1 - 01/11/2012
New Capacitive Measurement Catalog; Reduced Footprint Batch Wafer Wet Bench; New Gamma Detector; Semiconductor Imaging Solutions; New IQ+ Vacuum Pressure Control Valves; SMT Rework Stations and Inspection Systems
Volume 3 - Issue 12 - 12/14/2011
Where Applications Demand Optimum Surface Finish; Single-element Silicon PIN Photodiodes; Extend the Life of your Wet Processing Systems; New Cryopump Remanufacturing Facility; Semiconductor LPCVD Silicon Nitride Film; CMC Offers Toll Milling
Volume 3 - Issue 11 - 11/09/2011
2SMPP MEMS Gauge Pressure Sensors; NexGen Film Frame Probers; Optimal Surface Quality During Bulk Reduction; Tightly Controlled Batch Wet Processing; Miniature Linear Scale for Tight Spaces; Semitracks Online and Public Training Courses; Vacuum Chamber Experts; Manual Wet Process and Support Tools; Semiconductor LPCVD Silicon Nitride Film
Volume 3 - Issue 10 - 10/12/2011
Using Induction Heating for Crystal Growing; Complete Automated Wet Process Solutions; Point and Shoot Microscopy; SANYO Motor Driver ICs Available; New Ultra-high Performance Multi-axis Gyro Module; Electroglas PCB Repair and Amp Service; Combined Gas Source and Distribution System; Dragline Bucket Wear Parts; Quick Curing Chemically Resistant Epoxy;
Volume 3 - Issue 9 - 09/14/2011
ADXL345 Digital iMEMS Motion Sensors; Mass Imaging Makes Semi Manufacture More Productive; Industry Leading Four to Six Week Lead Time; Automated Wet Process Systems, Fume Hoods; CLA LED Illumination Bars; Dual-in-Line Sockets RA Mounts; An ASIC Solves Your Design Challenges; Powders into Liquids
Volume 3 - Issue 8 - 08/10/2011
Point and Shoot Microscopy; Rapid Curing for Heat Sensitive Materials; Transfer Valve/Insert/Door FlapVAT; Caged Ball LM Guide Type RSR and SRS7; Semiconductor Passivation and Electropolishing
Volume 3 - Issue 7 - 07/13/2011
1-axis and 2-axis Analog Gyroscopes; Metal Liftoff and Stripping Batch Tool; How Clean Are Your Elastomer Seals?; Cable Solutions for the Semiconductor Industry; Heating Jackets and Controls; Custom Touchscreen Solutions; Titanate Nano Powders (Barium, Strontium Titanate); Hexoloy SG Silicon Carbide
Volume 3 - Issue 6 - 06/08/2011
DI Water/Nitrogen Heater and Pure Steam Generators; Buying Refurbished Equipment Yields a Greater ROI; Brush Engineered Materials Companies Are Now Materion; Extend the Life of your Wet Processing Systems; New Ultra Low Outgassing Lubricants; Non-contact Thickness Measurements; EnerChip CC with Integrated Battery Management; Etched Foil Heaters - Semiconductor and Wafers
Volume 3 - Issue 5 - 05/11/2011
1-axis and 2-axis Analog Gyroscopes; Buying Refurbished Equipment Yields a Greater ROI; RF MEMS Switch; Thickness Made Easy; Infrared Microscopev; 3-axis Light Source Holder Machining Services; Low Noise G50Z-LN High Performance MEMS Gyro; Three-Channel Signal Conditioner; Wafer Carriers in Sapphire
Volume 3 - Issue 4 - 04/13/2011
Confocal Displacement Sensor; Reduced Footprint Batch Wafer Wet Bench; Surface Metrology Performance and Value; Crystal Growing: Ambrell Induction Heating Solutions; Buying Refurbished Equipment Yields a Greater ROI; Chemical Resistant Seals; Ammonia Scrubbing in Semiconductor Manufacturing; Diffractive Optics, Micro-optics, Photonics
Volume 3 - Issue 3 - 03/09/2011
Profile and Spike Thermocouples for Furnaces; Unique Pressure sensor for Battery and Wireless Operation; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor and AMHS Installation and Maintenance Services; Ultra Low-power ADXL345 Three-axis iMEMS Digital Accelerometer; EnerChip CC with Integrated Battery Management
Volume 3 - Issue 2 - 02/09/2011
Wafer and Substrate Clean Drying; Dedicated Mask Aligner Solutions for HB-LEDs; Surface Metrology Performance and Value; Low Noise G50Z-LN High Performance MEMS Gyro; Passivation and Electropolishing for the Semiconductor Industry; Buying Refurbished Equipment Yeilds a Greater ROI; UniCond Sensors with Ultra-wide Range and Accuracy; Flexible, Thermally Conductive Epoxy; Heater and Thermal Sensors-Heaters with Sensors
Volume 3 - Issue 1 - 01/12/2011
Revolutionary Eddy Current Technology; Spin Rinse Dryers - New; High Throughput, Low-cost, Wet Processing Sytems; Dedicated Mask Aligner Solutions for HB-LEDs; The Economical Answer to Wafer Metrology; New M800 Multiparameter Transmitter With Predictive Diagnostics; Motor Insulation for Flexibility, Durability, and Stability; Diffractive Optics, Micro-optics, Photonics; RF MEMS Switch
Volume 2 - Issue 12 - 12/08/2010
Continuous Monitoring System Pays for Itself in One Year; High-temperature Memory for Harsh Environments; Affordable Wafer Shape and Thickness Tools; We Solve Your Sub-micron MEMS Automation Challenges
Volume 2 - Issue 11 - 11/10/2010
Continuous Monitoring System Pays for Itself in One Year; Profile and Spike Thermocouples for Furnaces; Low Noise G50Z-LN High Performance MEMS Gyro; IPA Dryer - Surface Tension Gradient; Three-channel Signal Conditioner; Cost-effective Production for Analog ASICs; Improved Crystal Growth with Induction Heating
Volume 2 - Issue 10 - 10/13/2010
32-bit Power Architecture Microcontrollers from Freescale; Precision Machined Components for the Semiconductor Industry; Pure Processes, Safer Solutions; Chart Recorder Replacement ROI in 1-year; Industrial Femtosecond Lasers for Micromachining; PURA High Purity Gas Dewpoint Transmitter; UniCond Sensors with Ultra-wide Range and Accuracy; MEMS Module; Multiple Automation Platforms to Meet Your Needs; RF MEMS Switch
Volume 2 - Issue 9 - 09/08/2010
TI's CSD86350Q5D Synchronous Buck NexFET Power Block; Solve Your Microelectronics Failure Analysis Challenges; Profile and Spike Thermocouples for Furnaces; Heater and Thermal Sensors-Heaters with Sensors; New Sensor for Wafer Thickness; Wafer Carriers in Sapphire; JPE Needle Valve; Vacuum Wet Process Equipment for MEMS Manufacturing
Volume 2 - Issue 8 - 08/11/2010
Compact Thermo Chiller; In-Motion Solution; OX400 Low Oxygen Concentration Analyzer; MEMS Gyro Sensors Replacing FOGs; Diffractive Optics, Micro-optics, Photonics; New Energy Efficient Tool; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 2 - Issue 7 - 07/14/2010
Calcium Fluoride (CaF2) Single Crystal; Wire and Electrode Feedthroughs for Photovoltaic Industry; 5000TOCe Smart TOC Sensor; Three-Channel Signal Conditioner; New State-of-the-Art Cooling Technology ; MIL-STD Thermal Shock Environmental Test Chambers
Volume 2 - Issue 6 - 06/09/2010
Thermocouples for ASM Epsilon Reactors; Mega ION; Laser Technology For Semiconductor Applications; RF MEMS Switch; High-speed Type SKR Actuator; JPE Ball Valve; New Sensor for Wafer Thickness
Volume 2 - Issue 5 - 05/12/2010
Microchip's PIC32 32-Bit MCU; Leading the Metal Sealing Industry; New State of the Art Cooling Technology; We Solve Your Sub-micron MEMS Automation Challenges; Don't Miss Microtech 2010 - June 21-24 - Anaheim, CA; Low Noise G50Z-LN High Performance MEMS Gyro; NEW Actuator Type GL-N; Chemical Dispense/Waste Cabinets; JPE Tube Fitting
Volume 2 - Issue 4 - 04/14/2010
Inline Metrology with the XE-3DM; Mass Imaging Makes Semi Manufacture More Productive; New Cool-ORing Active ORing Solutions; New Thermal Insulation Increases Heater Efficiency; An ASIC Resolves Your Design Challenges; World's 1st Combination Cleaner and Cleanliness Tester; Linear Technology's Ultra-tiny ADCs
Volume 2 - Issue 3 - 03/10/2010
World's 1st Combination Cleaner and Cleanliness Tester; We Make the Labyrinth Seal Specifically for You; Inline Metrology with the XE-3DM; Gyro Sensor with Low In-run bias Stability; New Accelerometer Sensors for User Interfaces; Gas Handling Systems for Semiconductor Production; Single Wafer Spray Module; Analog Devices' ADA4501 Operational Amplifiers; Thin Film - RC/RCD
Volume 2 - Issue 2 - 02/10/2010
Complete Thermal Solutions for Semiconductor Processing; Vapor Flow Control without MFCs; Analog Devices' ADXL345 MEMs Accelerometer; Thin-section Bearings: Precision with Space Savings; Reduce Pricing Pressures and Gain Global Operational Visibility; Extend the Life of your Wet Process Systems; Prototype Electronic Assembly Services; SMT Rework Stations and Inspection Systems
Volume 2 - Issue 1 - 01/13/2010
Global High Tech Summit, Feb 11/San Jose; Gain Global Operational Visibility and Reduce Pricing Pressures; Polysilicon Wafer, Ingot, and Chunk Cleaning; Understanding the Fundamental Conductivity and Resistivity of Pure Water; In-Motion Solution; Complete Device Fabrication Available; Communications Custom Cable Molding
Volume 1 - Issue 4 - 12/09/2009
MEMS Gyro Sensors Replacing FOGs; PoP Paste Indium9.88-HF; Automated, Precise, Efficient; Low Noise G50Z-LN High Performance MEMS Gyro; MEMS Foundry Leadership; RF MEMS Switch; STMicroelectronics' MEMS Gyroscopes; Thin Film - RC/RCD
Volume 1 - Issue 3 - 11/11/2009
PoP Paste Indium9.88-HF; Extend the Life of Your Wet Process Systems; Bringing Answers to the Surface; Reduce Pricing Pressures While Increasing Visibility into Global Operations; MEMS Device Fabrication; High Temperature Acoustic Measurement System; Thin Film and Silicon Wafer Supplier; Sensors for Modal Analysis Testing
Volume 1 - Issue 2 - 10/14/2009
Bringing Answers to the Surface; Vapor Flow Control without MFCs; Low Cost, High Efficiency Actuator Type VLA; Analog Devices' ADXL345 MEMS Accelerometer; Thin Film and Silicon Wafer Supplier; Cost-effective Automation; Semi-Gas Centurion Gas Cabinet
Volume 1 - Issue 1 - 09/09/2009
Low Noise G50Z-LN High Performance MEMS Gyro; Vacuum Solutions for Semiconductor Applications; High-speed Type SKR Actuator; Semiconductor Thickness - CHRocodile IT; Don't Settle - Choose Superior RF/MMIC Technologies; Film Laminations with Optical Films