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GlobalSpec: DirectU2 Semiconductor Fabrication
September 9, 2009
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The Signals Are Just Passing Through

The Signals Are Just Passing Through Microelectromechanical systems (MEMS) owe their growing importance to the marriage of electronics with tiny moving parts. Their latest incarnation — as band-pass filters and signal amplifiers — will markedly improve performance of cellphones and more exotic products. Incoming signals generate an electrostatic force, which causes the devices to vibrate. That vibration allows MEMS devices to serve as resonators, canceling out some frequencies and transmitting others. This technology promises to reduce both the size and power consumption of conventional filters and can be used to create a new class of chemical and biological sensors.

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Spotlight On . . .
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Low Noise G50Z-LN High Performance
MEMS Gyro

Gladiator Technologies, Inc.

Low Noise G50Z-LN High Performance MEMS Gyro GTI's all new simple analog output MEMS gyro with low noise of 0.007/sec/√Hz combined with exceptional short-term bias stability of 0.005/sec, enables the G50Z-LN to offer best-in-class performance. Unmodelled bias over temperature of 0.3/sec, low weight of 32 grams and ultra low power consumption at 60 mA.

Vacuum Solutions for Semiconductor
Applications

DEKKER Vacuum Technologies

Vacuum Solutions for Semiconductor Applications Dekker's liquid ring and rotary vane vacuum pumps and systems are specifically designed for a variety of semiconductor applications. With pumps and systems available in several configurations and materials, Dekker has a vacuum solution for your application. Contact us today at www.dekkervacuum.com or 888-925-5444.

Semiconductor Materials . . .
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DNA Makes Things Even Smaller

DNA Makes Things Even Smaller How can you reduce circuit features beyond what we can currently achieve — below 22 nm? You could turn to a phenomenon of nature that already stores large amounts of logic in tiny spaces. Scientists at IBM and the California Institute of Technology are doing exactly that — attempting to use DNA strands as support structure for lithographic patterning, depositing millions of carbon nanotubes that will assemble themselves by taking advantage of the DNA substructure.

Keeping Their Balance

Keeping Their Balance For centuries, gyroscopes have helped to maintain stability in a host of mechanical systems. But as the systems shrink, the gyroscopes need to shrink as well. Some engineers suggest that MEMS will provide the ideal vehicle for that purpose. But how do you match gyroscope performance with system function? This white paper from Coventor describes a software simulation technique that will significantly simplify designing such solutions.

Products & Services . . .
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Zinc — the Next Silicon?

Zinc — the Next Silicon? The effort to find materials from which to construct new electronic devices has often concentrated on exotic alloys like gallium arsenide (GaAs) and compounds of indium (In). The latest attempt combines common zinc oxide with dopants like beryllium, cadmium, and selenium to form photonic layers that can emit a range of frequencies, improving the performance of LEDs and other diodes, UV detectors and transmitters, and other types of devices.

Getting There From Here

Getting There From Here Most companies would relish the idea of being compared to Microsoft. But for Silicon Image, creator of HDMI data-interface technology, the comparison stems from their reputation as "the company that everyone loves to hate." The latest controversy involves efforts to standardize consumer products using a new protocol suite that incorporates Ethernet support into HDMI spec-based chips. Unfortunately, no other chip maker has yet signed up to license the idea.

Accent On . . .
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THK's High-speed Type SKR Actuator
THK America, Inc.

THK's High-speed Type SKR Actuator THK's high-speed Type SKR Actuator is now available in two new smaller sizes of 20 mm and 26 mm. With the Type SKR, customers can experience the benefits of both THK's Caged Technology Ball Screw and Caged Ball™ LM Guide Technology in one high-speed actuator.

Semiconductor Thickness — CHRocodile IT
Precitec

Semiconductor Thickness — CHRocodile IT The new CHRocodile IT from Precitec offers simple and highly accurate distance and thickness measurements for semiconductor wafers and multi-layered thin film. It provides non-contact silicon scanning with just one measuring point and can measure a wafer precisely to a thickness of 1 mm in all production environments.

Semiconductor Test & Measurement . . .
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Reporting from the Front

Reporting from the Front Where is device test headed? How will chip-tester manufacturers keep pace with device technologies? In this report from the recent Semicon West, Test & Measurement World Editor-in-Chief Rick Nelson asked the presidents of four of the leading test-system vendors for their take on the industry's future. The topics covered include the current economic situation, the increased use of built-in test, and other challenges to the dominance of conventional test.

Testing From the Ground Up

Testing From the Ground Up Among the most common phenomena reducing measurement accuracy is the ground loop — a current generated because the ground potential of the measurement system and that of the device under test can differ by hundreds of millivolts. Ground loops can severely compromise accuracy, especially of high-precision measurements of low-level signals. This white paper from Data Translation describes a solution that can eliminate this pernicious impediment.

Manufacturing Process Equipment . . .
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Rigid Becomes Flexible

Rigid Becomes Flexible Devices on flexible substrates have existed for a number of years, but cost and reliability issues, as well as the lack of a "killer app" have prevented their emergence into the mainstream. According to this piece from Machine Design, however, revolution is in the air. Current technology relies on techniques derived from printing jobs like newspapers. A new approach called a Camara Oscura will tightly control the manufacturing environment to permit a wide range of inexpensive fabrication alternatives.

Moving Closer to Nature

Moving Closer to Nature "Build a better mousetrap," goes the old adage, "and the world will beat a path to your door." To build a better radio, study how human anatomy collects and processes sounds. Scientists and students at MIT have done exactly that, creating a small inexpensive radio chip by basing their design on the signal-handling capability of the human cochlea. This device works by emulating the capabilities of an analog spectrum analyzer. This description of the innovation includes a short video interview with the professor who leads the research team.

Focus On . . .
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Don't Settle — Choose Superior RF/MMIC
Technologies

TriQuint Semiconductor, Inc.

Don't Settle — Choose Superior RF/MMIC Technologies To effectively compete in today's wireless markets, you have to be first to market with solutions offering superior performance and competitive pricing. TriQuint's Foundry Services offers customers access to innovative technology for building high-performance yet cost-effective RF solutions. Learn more about our processes, support, and services by viewing our Webinar.

Film Laminations with Optical Films

General Digital Corp.

Film Laminations with Optical Films General Digital™ Optical Bonding Laboratories™ can passively enhance a display by applying optical films to its front surface, thereby improving brightness and contrast by reducing surface reflections. General Digital™ Optical Bonding Laboratories™ is a National Distributor of Tigold Films (formerly known as OCLI). We also integrate films from other third party film manufacturers.

Careers & Commentary . . .
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Bad Boss! BAD Boss?

Bad Boss!  BAD Boss? Everyone has a favorite "bad boss" story. From the one who takes credit for the efforts of her staff to the boss who plays favorites and seeks out brown-noses and snitches. The common element showing up in many of these situations is a communications breakdown, either accidental or manufactured. This column from Susan Heathfield at About.com summarizes the results from a recent survey and provides a link to the original comment thread. Apparently, bad bosses are as numerous as the people they supervise.

Diversions . . .
I Guess We're All Aliens

I Guess We're All Aliens Where did life on Earth originate? Although there is no shortage of answers to this age-old question, one theory that has been gaining popularity in recent years contends that the organic building blocks of life didn't originate on Earth at all, but were brought here intentionally or accidentally from deep space. Now that once outlandish idea has been given additional credence. In 2006, the NASA space probe Stardust brought back with it comet samples containing the amino acid glycine, one of the fundamental building blocks of life as we know it.

Share Your Thoughts . . .
About This Month's Topic

About This Month's Topic Where Do We Go From Here?

How will future developments in technology displace the fabric of the society we have come to accept? How will it affect business? Engineering? The shape of the overall economy? How will you adapt to these changes?


Join the discussion...


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September 9, 2009 - Volume 1 Issue 1
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Archives
Past Issues of this eNewsletter
Volume 6 - Issue 4 - 04/09/2014
New Low Power MEMS Accelerometer; Thermocouples for ASM Epsilon Reactors; We Move the World; Custom Manufacturing of Silicon Substrates and Optical Components; Temperature Control Experts in Semi Compliance; Speed Up Your Project Timeline with Designs Reference Design Library; Actually It IS Easy Being Green; Allegro Position Sensor ICs; Sensors for Extremely High-resolution Solutions; New InGaAs and Silicon Avalanche Photodiodes
Volume 6 - Issue 3 - 03/12/2014
Custom Rotary Sealing Solutions; Improved Metal Lift-off Performance!; Innovative, Single-chip MEMS Oscillator Evaluation Kit; Despatch LCC Ovens for Semiconductor Manufacturing ; Example of Robust Pressure Switch Offering; PRIME MOVER Hermetic Bellows Linear Actuators
Volume 6 - Issue 2 - 02/12/2014
High-Res Inspection Microscope for Large Sensors; Sealing Solutions for Critical Semicon Applications; ETEL's LMS Ironcore Linear Motor Series Limits Thermal Drift; All the Right Moves for Ultimate Precision; RF Transistor - NPN, 12 V, 8 GHZ; Allegro Position Sensor ICs; G-Band Transmitters - Cutting Edge Performance
Volume 6 - Issue 1 - 01/08/2014
Temperature Control Experts in Semi Compliance; LIC 4000 Encoder - Absolute position values to 1 nm; LIP 400 Advances Vacuum Encoder Technology; New IQ+ Vacuum Pressure Control Valves; New MEMS Thermal Sensors; Purely Sealing Your Success; Imaging in Space and Aerial Reconnaisance; Micron RLDRAM Memory; Extreme High-performance MEMS Aerospace Accelerometers
Volume 5 - Issue 12 - 12/11/2013
MEMS Foundry Service; Extended Seal Life Comes as Standard; UV-enhanced Planar Diffused Photodiodes; AMS-IRKT250-16 Dual Thyristors; PRIME MOVER Hermetic Bellows Linear Actuators; G-Band Transmitters - Cutting Edge Performance
Volume 5 - Issue 11 - 11/13/2013
Revolutionary Eddy Current Technology; Purity is the Key to Efficiency; Universal Swivel Bulkhead Fittings; Ovens for Semiconductor Manufacturing; Vacuum Valves...New N-Series; All the Right Moves for Ultimate Precision; Avoiding Semiconductor Failures; Rotary Feedthrough; How-to Guide for Understanding Fluid Chillers; SC TruStability Board Mount Pressure Sensors; 1.5 uA Ultra-low Power TMR Magnetic Switches
Volume 5 - Issue 10 - 10/09/2013
Extremely Compact Brushless DC Servo Motors; New MEMS Motion Sensor; Looking to Increase Your Wafer Yield?; New Avalanche Photodiodes; MIC 6 Aluminum Cast Plate - The Best of the Best; LIC 4000 Encoder - Absolute Position Values to 1 nm; Vacuum Products Catalog; Valuable Partner for Semiconductor Industry; Cost-effective Alternative to Automated Wafer Inspection Systems; Rotary Feedthrough; New Mechanical Lift Table
Volume 5 - Issue 9 - 09/11/2013
Temperature Control Experts in Semi Compliance; Semiconductor and MEMS Device Manufacturing; Simplify Your Liquid Cooling System; All the Right Moves for Ultimate Precision; Ultra Low Outgassing Lubricants; PIC24F: Low-power 16-bit MCUs; Keep an Eye on Wafer Thickness; Rotary Feedthrough
Volume 5 - Issue 8 - 08/14/2013
Innovative, Single-chip MEMS Oscillator Evaluation Kit; Built for the Highest Levels of Efficiency; High Temperature Vacuum Sensing Manometers; Vacuum Sealing and Throttling Butterfly Valve; Simplify Your Liquid Cooling System; Keep an Eye on Wafer Thickness; PRIME MOVER Hermetic Bellows Linear Actuators; Companies Worldwide Taking Advantage of the Accumeasure Systems
Volume 5 - Issue 7 - 07/10/2013
Single-chip MEMS Oscillator Architecture; Joining Forces to Fuel M2M Innovation; PRIME MOVER Hermetic Bellows Linear Actuators; Need a JEDEC Tray for Your New Device Fast?; Vacuum Sealing and Throttling Butterfly Valve; Need a Smaller and Lighter Control Cable?; Simplify Your Liquid Cooling System
Volume 5 - Issue 6 - 06/12/2013
Materials and Technology for Semiconductor Manufacturing; Rotary Systems Provides Rotary Unions for the Asian Market ; THK Caged Ball LM Guide Type RSR and SRS7 ; Need a JEDEC Tray for Your New Device Fast?; LIC 4000 Encoder - Absolute Position Values to 1 nm; Lower Machine Costs and Increase Efficiency; Semi-ceramics Are Us!; PIC24F: Low-power 16-bit MCUs; PRIME MOVER Hermetic Bellows Linear Actuators; TMR Gear Tooth Sensors
Volume 5 - Issue 5 - 05/08/2013
Microcircuit Materials - Large Batch Electronics Grade; Tiny MEMS Pressure/Vacuum Sensor Coming Soon!; Companies Worldwide Taking Advantage of the Accumeasure Systems; Titanate Nano Powders (Barium, Strontium Titanate); Bellows Pumps and Compressors; Hexoloy SG Silicon Carbide
Volume 5 - Issue 4 - 04/10/2013
New Capacitive Measurement Catalog; Wire and Electrode Feedthroughs for Photovoltaic Industry; New Xtrinsic Accelerometers; Apiezon Launches PFPE High Temperature Lubricating Vacuum Grease; New IQ+ Vacuum Pressure Control Valves; Purely Sealing Your Success; PRIME MOVER Hermetic Bellows Linear Actuators; Integrate Micro-imaging Quickly and Easily; Nano-precision Positioners/Aligners Up to Six Axes; Surface Mount Fuses with 72 V Interrupt Rating
Volume 5 - Issue 3 - 03/13/2013
New Three-axis Digital MEMS Gyroscope; Leading-edge Precious Metal Processes for Semiconductors; Purely Sealing Your Success; Analog ASICs Copy-protected by Process; Keep an Eye on Wafer Thickness; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Prime Mover Hermetic Bellows Linear Actuators
Volume 5 - Issue 2 - 02/13/2013
LIC 4000 Encoder - Absolute position values to 1 nm; New Sensor for Wafer Thickness; High Performance MEMS G100Z Gyro - Ultra Low Noise; We've Gone 2D!; PRIME MOVER Hermetic Bellows Linear Actuators; Precision CNC and Conventional Custom Mfg.
Volume 5 - Issue 1 - 01/09/2013
Piezo Motors Nanometer-scale Precision; confocalDT Distance/Thickness Spectrometer; Thermocouples for ASM Epsilon Reactors; Large Industrial Transformers for Alternative Energy; Vacuum Chamber Experts; Transfer Valve/Insert/Door FlapVAT; Purely Sealing Your Success; Bellows Pumps and Compressors; Measure Vibration, Ultrasound, and Temperature Simultaneously; 40 Years of Quality Printed Circuit Boards
Volume 4 - Issue 12 - 12/12/2012
Oil-less Rocking Piston Lab Compressor; Wafer Cleaning - Etch, Strip, Clean, In Control.; Avoiding Semiconductor Failures; Custom Chemical Synthesis ; Rugged Ultra Low Noise Dual Axis Gyro - G200
Volume 4 - Issue 11 - 11/14/2012
STMicroelectronics L3G4200D Gyroscopes; TLC5929: 16-Ch Constant Current LED Driver; Semiconductor Leaders Reduce Processing Costs; Custom Bearings
Volume 4 - Issue 10 - 10/10/2012
New Ultra-versatile Micro Imaging Lens System ; AMOLED and MEMS Device Manufacturing; Precious Metal Plating for Semiconductor Applications; Thermocouples for ASM Epsilon Reactors; New IQ+ Vacuum Pressure Control Valves; PolySim: An ESD-Resistant Enclosure Curtain; Medical Metal Parts in as Little as Two Days!; NASA Low Outgassing Approved, UV Curable Epoxy; Logistics Helps Predict the Future of High-tech Supply Chains
Volume 4 - Issue 9 - 09/12/2012
Advanced MEMS Microphones; Fully Automated Wafer Wet Bench; Precision Analog IMU - MRM30 IMU; High-sensitivity Magnetic Field Sensor; Chillers for Semiconductor Equipment Cooling
Volume 4 - Issue 8 - 08/08/2012
The Next Level of Precision Adjustment; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Manual and Pneumatic Ball Valves; Zero Power Millimeter Sensors Using EnerChips;
Volume 4 - Issue 7 - 07/11/2012
Motorized Precision Positioners for High Vacuum /EUV; Epoxy Offers Shock and Impact Resistance; STT-MRAM Metrology Tool for 300 mm Wafers; New Zooming Single-objective Probing Microscope; Modular Cleanrooms Mean Profits; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 6 - 06/13/2012
Flexible Designs Boost Customer Productivity!; Ultra-high Purity Pump for Semiconductor Manufacturing; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Extend the Life of Your Wet Bench; Chemcassette Paper Tape: The Reel Deal; New Trap for MOCVD; Semiconductor LPCVD Silicon Nitride Film; New Magnetic Angle Sensors by MultiDimension; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 5 - 05/09/2012
New STM32 F4 Series; Get Control of Your Batch Making!; Stop Over Greasing Bearings; HEMP/EMP Filters
Volume 4 - Issue 4 - 04/11/2012
Miniaturized Positioning Stages Offer Micron-level Accuracy; confocalDT High End Spectrometer; Breakthrough Hyper-pure Silicon Finishing; Increase Heat Sink Cooling Efficiency; Wire and Electrode Feedthroughs for Photovoltaic Industry; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; SMT Rework Stations and Inspection Systems
Volume 4 - Issue 3 - 03/14/2012
Profile Thermocouples and Spike Thermocouples for Furnaces; Increase Heat Sink Cooling Efficiency; Aluminum Vacuum Chambers; Ultra Pure Rubber Seals; 200/300 mm Fully Automated Process Station; Leading Edge E-beam Technology Solutions Provider; Offshore and Domestic PCB Manufacturing at Any Volume;
Volume 4 - Issue 2 - 02/08/2012
Micromotors Speed Up PCB Assembly; M2M Application Platform Perfected; 3-axis Light Source Holder Machining Services; Air Conditioning/Refrigeration Compressors and Pressure Vessels; OLED Takes FPD to New Level; Miniature Linear Scale for Tight Spaces; Electrically Insulative Snap Cure Epoxy; New Magnetic Switches Feature High-speed, Low-power
Volume 4 - Issue 1 - 01/11/2012
New Capacitive Measurement Catalog; Reduced Footprint Batch Wafer Wet Bench; New Gamma Detector; Semiconductor Imaging Solutions; New IQ+ Vacuum Pressure Control Valves; SMT Rework Stations and Inspection Systems
Volume 3 - Issue 12 - 12/14/2011
Where Applications Demand Optimum Surface Finish; Single-element Silicon PIN Photodiodes; Extend the Life of your Wet Processing Systems; New Cryopump Remanufacturing Facility; Semiconductor LPCVD Silicon Nitride Film; CMC Offers Toll Milling
Volume 3 - Issue 11 - 11/09/2011
2SMPP MEMS Gauge Pressure Sensors; NexGen Film Frame Probers; Optimal Surface Quality During Bulk Reduction; Tightly Controlled Batch Wet Processing; Miniature Linear Scale for Tight Spaces; Semitracks Online and Public Training Courses; Vacuum Chamber Experts; Manual Wet Process and Support Tools; Semiconductor LPCVD Silicon Nitride Film
Volume 3 - Issue 10 - 10/12/2011
Using Induction Heating for Crystal Growing; Complete Automated Wet Process Solutions; Point and Shoot Microscopy; SANYO Motor Driver ICs Available; New Ultra-high Performance Multi-axis Gyro Module; Electroglas PCB Repair and Amp Service; Combined Gas Source and Distribution System; Dragline Bucket Wear Parts; Quick Curing Chemically Resistant Epoxy;
Volume 3 - Issue 9 - 09/14/2011
ADXL345 Digital iMEMS Motion Sensors; Mass Imaging Makes Semi Manufacture More Productive; Industry Leading Four to Six Week Lead Time; Automated Wet Process Systems, Fume Hoods; CLA LED Illumination Bars; Dual-in-Line Sockets RA Mounts; An ASIC Solves Your Design Challenges; Powders into Liquids
Volume 3 - Issue 8 - 08/10/2011
Point and Shoot Microscopy; Rapid Curing for Heat Sensitive Materials; Transfer Valve/Insert/Door FlapVAT; Caged Ball LM Guide Type RSR and SRS7; Semiconductor Passivation and Electropolishing
Volume 3 - Issue 7 - 07/13/2011
1-axis and 2-axis Analog Gyroscopes; Metal Liftoff and Stripping Batch Tool; How Clean Are Your Elastomer Seals?; Cable Solutions for the Semiconductor Industry; Heating Jackets and Controls; Custom Touchscreen Solutions; Titanate Nano Powders (Barium, Strontium Titanate); Hexoloy SG Silicon Carbide
Volume 3 - Issue 6 - 06/08/2011
DI Water/Nitrogen Heater and Pure Steam Generators; Buying Refurbished Equipment Yields a Greater ROI; Brush Engineered Materials Companies Are Now Materion; Extend the Life of your Wet Processing Systems; New Ultra Low Outgassing Lubricants; Non-contact Thickness Measurements; EnerChip CC with Integrated Battery Management; Etched Foil Heaters - Semiconductor and Wafers
Volume 3 - Issue 5 - 05/11/2011
1-axis and 2-axis Analog Gyroscopes; Buying Refurbished Equipment Yields a Greater ROI; RF MEMS Switch; Thickness Made Easy; Infrared Microscopev; 3-axis Light Source Holder Machining Services; Low Noise G50Z-LN High Performance MEMS Gyro; Three-Channel Signal Conditioner; Wafer Carriers in Sapphire
Volume 3 - Issue 4 - 04/13/2011
Confocal Displacement Sensor; Reduced Footprint Batch Wafer Wet Bench; Surface Metrology Performance and Value; Crystal Growing: Ambrell Induction Heating Solutions; Buying Refurbished Equipment Yields a Greater ROI; Chemical Resistant Seals; Ammonia Scrubbing in Semiconductor Manufacturing; Diffractive Optics, Micro-optics, Photonics
Volume 3 - Issue 3 - 03/09/2011
Profile and Spike Thermocouples for Furnaces; Unique Pressure sensor for Battery and Wireless Operation; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor and AMHS Installation and Maintenance Services; Ultra Low-power ADXL345 Three-axis iMEMS Digital Accelerometer; EnerChip CC with Integrated Battery Management
Volume 3 - Issue 2 - 02/09/2011
Wafer and Substrate Clean Drying; Dedicated Mask Aligner Solutions for HB-LEDs; Surface Metrology Performance and Value; Low Noise G50Z-LN High Performance MEMS Gyro; Passivation and Electropolishing for the Semiconductor Industry; Buying Refurbished Equipment Yeilds a Greater ROI; UniCond Sensors with Ultra-wide Range and Accuracy; Flexible, Thermally Conductive Epoxy; Heater and Thermal Sensors-Heaters with Sensors
Volume 3 - Issue 1 - 01/12/2011
Revolutionary Eddy Current Technology; Spin Rinse Dryers - New; High Throughput, Low-cost, Wet Processing Sytems; Dedicated Mask Aligner Solutions for HB-LEDs; The Economical Answer to Wafer Metrology; New M800 Multiparameter Transmitter With Predictive Diagnostics; Motor Insulation for Flexibility, Durability, and Stability; Diffractive Optics, Micro-optics, Photonics; RF MEMS Switch
Volume 2 - Issue 12 - 12/08/2010
Continuous Monitoring System Pays for Itself in One Year; High-temperature Memory for Harsh Environments; Affordable Wafer Shape and Thickness Tools; We Solve Your Sub-micron MEMS Automation Challenges
Volume 2 - Issue 11 - 11/10/2010
Continuous Monitoring System Pays for Itself in One Year; Profile and Spike Thermocouples for Furnaces; Low Noise G50Z-LN High Performance MEMS Gyro; IPA Dryer - Surface Tension Gradient; Three-channel Signal Conditioner; Cost-effective Production for Analog ASICs; Improved Crystal Growth with Induction Heating
Volume 2 - Issue 10 - 10/13/2010
32-bit Power Architecture Microcontrollers from Freescale; Precision Machined Components for the Semiconductor Industry; Pure Processes, Safer Solutions; Chart Recorder Replacement ROI in 1-year; Industrial Femtosecond Lasers for Micromachining; PURA High Purity Gas Dewpoint Transmitter; UniCond Sensors with Ultra-wide Range and Accuracy; MEMS Module; Multiple Automation Platforms to Meet Your Needs; RF MEMS Switch
Volume 2 - Issue 9 - 09/08/2010
TI's CSD86350Q5D Synchronous Buck NexFET Power Block; Solve Your Microelectronics Failure Analysis Challenges; Profile and Spike Thermocouples for Furnaces; Heater and Thermal Sensors-Heaters with Sensors; New Sensor for Wafer Thickness; Wafer Carriers in Sapphire; JPE Needle Valve; Vacuum Wet Process Equipment for MEMS Manufacturing
Volume 2 - Issue 8 - 08/11/2010
Compact Thermo Chiller; In-Motion Solution; OX400 Low Oxygen Concentration Analyzer; MEMS Gyro Sensors Replacing FOGs; Diffractive Optics, Micro-optics, Photonics; New Energy Efficient Tool; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 2 - Issue 7 - 07/14/2010
Calcium Fluoride (CaF2) Single Crystal; Wire and Electrode Feedthroughs for Photovoltaic Industry; 5000TOCe Smart TOC Sensor; Three-Channel Signal Conditioner; New State-of-the-Art Cooling Technology ; MIL-STD Thermal Shock Environmental Test Chambers
Volume 2 - Issue 6 - 06/09/2010
Thermocouples for ASM Epsilon Reactors; Mega ION; Laser Technology For Semiconductor Applications; RF MEMS Switch; High-speed Type SKR Actuator; JPE Ball Valve; New Sensor for Wafer Thickness
Volume 2 - Issue 5 - 05/12/2010
Microchip's PIC32 32-Bit MCU; Leading the Metal Sealing Industry; New State of the Art Cooling Technology; We Solve Your Sub-micron MEMS Automation Challenges; Don't Miss Microtech 2010 - June 21-24 - Anaheim, CA; Low Noise G50Z-LN High Performance MEMS Gyro; NEW Actuator Type GL-N; Chemical Dispense/Waste Cabinets; JPE Tube Fitting
Volume 2 - Issue 4 - 04/14/2010
Inline Metrology with the XE-3DM; Mass Imaging Makes Semi Manufacture More Productive; New Cool-ORing Active ORing Solutions; New Thermal Insulation Increases Heater Efficiency; An ASIC Resolves Your Design Challenges; World's 1st Combination Cleaner and Cleanliness Tester; Linear Technology's Ultra-tiny ADCs
Volume 2 - Issue 3 - 03/10/2010
World's 1st Combination Cleaner and Cleanliness Tester; We Make the Labyrinth Seal Specifically for You; Inline Metrology with the XE-3DM; Gyro Sensor with Low In-run bias Stability; New Accelerometer Sensors for User Interfaces; Gas Handling Systems for Semiconductor Production; Single Wafer Spray Module; Analog Devices' ADA4501 Operational Amplifiers; Thin Film - RC/RCD
Volume 2 - Issue 2 - 02/10/2010
Complete Thermal Solutions for Semiconductor Processing; Vapor Flow Control without MFCs; Analog Devices' ADXL345 MEMs Accelerometer; Thin-section Bearings: Precision with Space Savings; Reduce Pricing Pressures and Gain Global Operational Visibility; Extend the Life of your Wet Process Systems; Prototype Electronic Assembly Services; SMT Rework Stations and Inspection Systems
Volume 2 - Issue 1 - 01/13/2010
Global High Tech Summit, Feb 11/San Jose; Gain Global Operational Visibility and Reduce Pricing Pressures; Polysilicon Wafer, Ingot, and Chunk Cleaning; Understanding the Fundamental Conductivity and Resistivity of Pure Water; In-Motion Solution; Complete Device Fabrication Available; Communications Custom Cable Molding
Volume 1 - Issue 4 - 12/09/2009
MEMS Gyro Sensors Replacing FOGs; PoP Paste Indium9.88-HF; Automated, Precise, Efficient; Low Noise G50Z-LN High Performance MEMS Gyro; MEMS Foundry Leadership; RF MEMS Switch; STMicroelectronics' MEMS Gyroscopes; Thin Film - RC/RCD
Volume 1 - Issue 3 - 11/11/2009
PoP Paste Indium9.88-HF; Extend the Life of Your Wet Process Systems; Bringing Answers to the Surface; Reduce Pricing Pressures While Increasing Visibility into Global Operations; MEMS Device Fabrication; High Temperature Acoustic Measurement System; Thin Film and Silicon Wafer Supplier; Sensors for Modal Analysis Testing
Volume 1 - Issue 2 - 10/14/2009
Bringing Answers to the Surface; Vapor Flow Control without MFCs; Low Cost, High Efficiency Actuator Type VLA; Analog Devices' ADXL345 MEMS Accelerometer; Thin Film and Silicon Wafer Supplier; Cost-effective Automation; Semi-Gas Centurion Gas Cabinet
Volume 1 - Issue 1 - 09/09/2009
Low Noise G50Z-LN High Performance MEMS Gyro; Vacuum Solutions for Semiconductor Applications; High-speed Type SKR Actuator; Semiconductor Thickness - CHRocodile IT; Don't Settle - Choose Superior RF/MMIC Technologies; Film Laminations with Optical Films