Semiconductor & MEMS Fabrication News

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Description: GlobalSpec's Semiconductor & MEMS Fabrication free eNewsletter focuses on silicon-based technologies and manufacturing processes. This free email publication keeps subscribers up-to-date on the latest devices, manufacturing techniques, and applications to improve silicon-based product design, production, and testing. Product news covers microelectronic and optoelectronic devices (transistors, photo detectors, and solar cells) as well as fabrication techniques used in making chip-size motors, actuators, and other micro electrical mechanical systems.
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GlobalSpec: DirectU2 Semiconductor Fabrication
January 13, 2010    
Industry Trends & Events . . .
You Can See Through It

You Can See Through It One of the two most power-hungry features of any battery-driven electronic product is its display. (The other is the hard disk drive). Now, a team of scientists at Johns Hopkins University have found a material that can reduce that load. A form of sodium beta-alumina, it exists as a conductor under certain conditions and as an insulator under others. Initially a liquid, allowing easy deposition on printed circuits, it becomes a transparent film when heated. Because it operates at low voltages, when used in a hand-held application such as a book reader, it requires much less power than conventional semiconductors, extending battery life.

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Global High Tech Summit, Feb 11/San Jose
Fullscope

Global High Tech Summit, Feb 11/San Jose The Global High Tech Summit represents Microsoft's premier business event for the High Tech and Semi-Conductor industry. The summit brings together luminaries from every segment of the industry to speak about the sustained business value realized from innovative IT solutions.

Get information on 2010's hottest high tech, invitation-only conference — space is limited.

MEMS Module
COMSOL, Inc.

MEMS Module The MEMS Module addresses design issues that arise in the micro-world. It models physical phenomena in actuators and sensors plus microfluidic and small piezoelectric devices. The module includes analyses in the stationary and transient domains as well as eigen-frequency, parametric, quasi-static, and frequency-response analyses. Learn more.

Semiconductor/MEMS Manufacturing Solutions . . .
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Gain Global Operational Visibility and Reduce Pricing Pressures
Fullscope

Gain Global Operational Visibility and Reduce Pricing Pressures Savvy semiconductor and high tech companies need — but may not have — ERP solutions that support a single global database with multiple companies using intercompany orders, multi currency, and multi sites. Such systems can lead to real-time visibility into operations and optimal pricing decisions.

Download a new Microsoft High Tech ERP white paper that shows how to tackle these challenges at significantly less expense than Oracle or SAP.

Learn how other High Tech/Semi-conductor Companies Use Microsoft ERP.

Semiconductor Materials . . .
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Keeping Transistors in Tune

Keeping Transistors in Tune How do you design the tiniest semiconductors so that they work together efficiently with the highest possible yield out of manufacturing and the lowest possible failure rate? You perform simulations that would overwhelm the most powerful stand-alone computer by running them on a network like the UK's e-science grid, which consists of thousands of computers working together.

How Many Cores to Run a Cloud?

How Many Cores to Run a Cloud? Manufacturers designing products for the ubiquitous "cloud" need microprocessors powerful enough to perform many tasks simultaneously. With that in mind, Intel has developed a single chip that contains 48 cores. An engineer with the company describes the devices as clouds of computers on a single piece of silicon. Intel expects eventually to adapt the process to build devices with more than 100 cores.

Products & Services . . .
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One Wafer at a Time

One Wafer at a Time The explosion of potential MEMS applications has challenged manufacturers to find production methods that can guarantee both the quality and profitability necessary to maintain a viable operation. This paper from Memsstar's Tony McKie describes how techniques for MEMS fabrication have evolved to accomplish that goal. He points out the similarities with CMOS manufacture, as well as the late-stage aspects that make the MEMS process unique.

Devices That Swing Both Ways

Devices That Swing Both Ways The ever-shrinking features of digital circuits have freed up real estate, initiating a dramatic rise in the number and variety of available mixed-signal devices. This comprehensive analysis from Electronic Design offers a survey of the products that have emerged in the past year, showing both how far the industry has progressed and the likely path of future development.

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Polysilicon Wafer, Ingot, and Chunk
Cleaning

MEI, LLC

Polysilicon Wafer, Ingot, and Chunk Cleaning Remove organic and metallic contamination. Fast, oxide-free drying in a small footprint.

MEI Polysilicon chunk cleaning system for removal of organic and metallic contamination found on polysilicon. MEI's high throughput wet etch system with good process control and outstanding drying capabilities achieve optimal purity with cool to the touch output.

Understanding the Fundamental
Conductivity and Resistivity of Pure Water

Mettler-Toledo Thornton Inc.

Understanding the Fundamental Conductivity and Resistivity of Pure Water Pure water has a very low — but not quite zero — electrical conductivity. This conductivity provides insight into fundamental properties of pure water used in chip fabrication for semiconductors, intravenous solutions for pharmaceuticals, and in high-pressure boilers for power generation. More.

Unique Microsystem for Battery and
Wireless Operation

Sensonor Technologies AS

Unique Microsystem for Battery and Wireless Operation Sensonor Technologies is now launching their low-power SP300-series with programmable embedded µC and LF interface, ideal for remote or inaccessible operation. Pressure, acceleration, temperature, and voltage sensors are included. Read more: SP300.

In-Motion™ Solution

Veeco Instruments

In-Motion™ Solution The In-Motion™ Solution: MEMS Package for Wyko® NT9000 Series Optical Profilers enables detailed characterization of MEMS and other micro-devices during operation, including optical switches, micro-mirrors, and accelerometers. Slow-motion video provides a visual display of sample movement in 3D, providing fast static, and dynamic surface metrology on a single system. Learn more.

Semiconductor Test & Measurement . . .
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Get a Hunting License — for Bugs

Get a Hunting License — for Bugs Ever-increasing device complexity presents a distinct challenge: making sure that those intricate devices will work properly. To quote Star Trek's Montgomery Scott, "The more they complicate the plumbing, the easier it is to stop up the drain." This item from Cadence describes a new tool that can dramatically reduce the effort required to simulate and verify new designs. One of its most powerful features is the ability to alternate between simulation and analysis to iterate toward a viable solution.

Parallel Testing with a Single Power Meter

Parallel Testing with a Single Power Meter One drawback to testing several devices in parallel is the number of resources necessary to make the tests as efficient as possible. In this short video from National Instruments, David Hall describes lowering test costs when performing RF testing on four devices by using a single power meter instead of requiring a vector signal analyzer for each device.

Manufacturing Process Equipment . . .
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Lowering Lithography's Footprint

Lowering Lithography's Footprint Manufacturing processes have been moving toward extreme ultraviolet (EUV) lithography to replace deep ultraviolet lithography for a number of years. In a recent presentation for an International Electron Devices Meeting on scaling issues, however, Director Burn Lin of TSMC Lithography implored attendees to modify that strategy. He contends that the large energy requirements of the EUV approach will ultimately cause its downfall. Instead, he proposes devoting more resources to developing a multi-column, e-beam, direct-write approach.

Who's on First?

Who's on First? Looking at company movement among Gartner's top 10 IC rankings for 2009 can help describe the progress of the industry and its technology. Hardly surprisingly, Intel came in first for the 18th year in a row. Less obvious was the designation of Advanced Micro Devices as a "winner" in the semiconductor sweepstakes. This article from EE Times invites readers to submit their own assessments.

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Complete Device Fabrication Available
Rogue Valley Microdevices, Inc.
 

Complete Device Fabrication Available In addition to the wide offering of Silicon Wafers and high quality Thin Film processing, Rogue Valley Microdevices now provides full device fabrication. Our MEMS and Microelectronic fabrication capabilities include mask design and Layout, Photolithography, Thin Films, Oxide and nitride plasma etch, KOH Etch, and Metal Lift Off.

Communications Custom Cable Molding
National Cable Molding a division of National Wire
& Cable

Communications Custom Cable Molding National Cable Molding offers custom cable assemblies with integral-molded connectors. These assemblies have superior mechanical durability as well as better sealing action. Their products are designed mainly for the medical environment, where quality is at the top of every list.

Careers & Commentary . . .
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Stuck on the Corporate Ladder

Stuck on the Corporate Ladder You work your heart out and your company doesn't appreciate your efforts. Have you been passed over for a promotion? Are you working ridiculous hours to get things done (approximately) on time? Is it time to raise your voice? To seek other employment? This piece from hr.com presents a variety of symptoms of professional burnout, how to recognize what they mean to you, and how to decide your next course of action. [A short registration may be required.]

Diversions . . .
Where the Virtual Becomes Real

Where the Virtual Becomes Real The media has buzzed with news of virtual reality for many years. Yet despite the hype, it has never progressed beyond a curiosity at high-tech playgrounds. This video from Euronews describes the edge of the current technology, offering insight into how it has developed, the technology's future, and its potential applications.

Share Your Thoughts . . .
About This Month's Topic

About This Month's Topic Working Separately Closer Together

Do you agree with some industry experts that the recent settlement between Intel and AMD will be the last word on the matter? Cross-licensing agreements and settlements represent a step in the right direction, but will they be enough for AMD to pull itself out of the doldrums of the past few years? How will the results affect the way you work?


Join the discussion...


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January 13, 2010 - Volume 2 Issue 1
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Archives
Past Issues of this eNewsletter
Volume 5 - Issue 5 - 05/08/2013
Microcircuit Materials - Large Batch Electronics Grade; Tiny MEMS Pressure/Vacuum Sensor Coming Soon!; Companies Worldwide Taking Advantage of the Accumeasure Systems; Titanate Nano Powders (Barium, Strontium Titanate); Bellows Pumps and Compressors; Hexoloy SG Silicon Carbide
Volume 5 - Issue 4 - 04/10/2013
New Capacitive Measurement Catalog; Wire and Electrode Feedthroughs for Photovoltaic Industry; New Xtrinsic Accelerometers; Apiezon Launches PFPE High Temperature Lubricating Vacuum Grease; New IQ+ Vacuum Pressure Control Valves; Purely Sealing Your Success; PRIME MOVER Hermetic Bellows Linear Actuators; Integrate Micro-imaging Quickly and Easily; Nano-precision Positioners/Aligners Up to Six Axes; Surface Mount Fuses with 72 V Interrupt Rating
Volume 5 - Issue 3 - 03/13/2013
New Three-axis Digital MEMS Gyroscope; Leading-edge Precious Metal Processes for Semiconductors; Purely Sealing Your Success; Analog ASICs Copy-protected by Process; Keep an Eye on Wafer Thickness; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Prime Mover Hermetic Bellows Linear Actuators
Volume 5 - Issue 2 - 02/13/2013
LIC 4000 Encoder - Absolute position values to 1 nm; New Sensor for Wafer Thickness; High Performance MEMS G100Z Gyro - Ultra Low Noise; We've Gone 2D!; PRIME MOVER Hermetic Bellows Linear Actuators; Precision CNC and Conventional Custom Mfg.
Volume 5 - Issue 1 - 01/09/2013
Piezo Motors Nanometer-scale Precision; confocalDT Distance/Thickness Spectrometer; Thermocouples for ASM Epsilon Reactors; Large Industrial Transformers for Alternative Energy; Vacuum Chamber Experts; Transfer Valve/Insert/Door FlapVAT; Purely Sealing Your Success; Bellows Pumps and Compressors; Measure Vibration, Ultrasound, and Temperature Simultaneously; 40 Years of Quality Printed Circuit Boards
Volume 4 - Issue 12 - 12/12/2012
Oil-less Rocking Piston Lab Compressor; Wafer Cleaning - Etch, Strip, Clean, In Control.; Avoiding Semiconductor Failures; Custom Chemical Synthesis ; Rugged Ultra Low Noise Dual Axis Gyro - G200
Volume 4 - Issue 11 - 11/14/2012
STMicroelectronics L3G4200D Gyroscopes; TLC5929: 16-Ch Constant Current LED Driver; Semiconductor Leaders Reduce Processing Costs; Custom Bearings
Volume 4 - Issue 10 - 10/10/2012
New Ultra-versatile Micro Imaging Lens System ; AMOLED and MEMS Device Manufacturing; Precious Metal Plating for Semiconductor Applications; Thermocouples for ASM Epsilon Reactors; New IQ+ Vacuum Pressure Control Valves; PolySim: An ESD-Resistant Enclosure Curtain; Medical Metal Parts in as Little as Two Days!; NASA Low Outgassing Approved, UV Curable Epoxy; Logistics Helps Predict the Future of High-tech Supply Chains
Volume 4 - Issue 9 - 09/12/2012
Advanced MEMS Microphones; Fully Automated Wafer Wet Bench; Precision Analog IMU - MRM30 IMU; High-sensitivity Magnetic Field Sensor; Chillers for Semiconductor Equipment Cooling
Volume 4 - Issue 8 - 08/08/2012
The Next Level of Precision Adjustment; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Manual and Pneumatic Ball Valves; Zero Power Millimeter Sensors Using EnerChips;
Volume 4 - Issue 7 - 07/11/2012
Motorized Precision Positioners for High Vacuum /EUV; Epoxy Offers Shock and Impact Resistance; STT-MRAM Metrology Tool for 300 mm Wafers; New Zooming Single-objective Probing Microscope; Modular Cleanrooms Mean Profits; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 6 - 06/13/2012
Flexible Designs Boost Customer Productivity!; Ultra-high Purity Pump for Semiconductor Manufacturing; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Extend the Life of Your Wet Bench; Chemcassette Paper Tape: The Reel Deal; New Trap for MOCVD; Semiconductor LPCVD Silicon Nitride Film; New Magnetic Angle Sensors by MultiDimension; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 5 - 05/09/2012
New STM32 F4 Series; Get Control of Your Batch Making!; Stop Over Greasing Bearings; HEMP/EMP Filters
Volume 4 - Issue 4 - 04/11/2012
Miniaturized Positioning Stages Offer Micron-level Accuracy; confocalDT High End Spectrometer; Breakthrough Hyper-pure Silicon Finishing; Increase Heat Sink Cooling Efficiency; Wire and Electrode Feedthroughs for Photovoltaic Industry; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; SMT Rework Stations and Inspection Systems
Volume 4 - Issue 3 - 03/14/2012
Profile Thermocouples and Spike Thermocouples for Furnaces; Increase Heat Sink Cooling Efficiency; Aluminum Vacuum Chambers; Ultra Pure Rubber Seals; 200/300 mm Fully Automated Process Station; Leading Edge E-beam Technology Solutions Provider; Offshore and Domestic PCB Manufacturing at Any Volume;
Volume 4 - Issue 2 - 02/08/2012
Micromotors Speed Up PCB Assembly; M2M Application Platform Perfected; 3-axis Light Source Holder Machining Services; Air Conditioning/Refrigeration Compressors and Pressure Vessels; OLED Takes FPD to New Level; Miniature Linear Scale for Tight Spaces; Electrically Insulative Snap Cure Epoxy; New Magnetic Switches Feature High-speed, Low-power
Volume 4 - Issue 1 - 01/11/2012
New Capacitive Measurement Catalog; Reduced Footprint Batch Wafer Wet Bench; New Gamma Detector; Semiconductor Imaging Solutions; New IQ+ Vacuum Pressure Control Valves; SMT Rework Stations and Inspection Systems
Volume 3 - Issue 12 - 12/14/2011
Where Applications Demand Optimum Surface Finish; Single-element Silicon PIN Photodiodes; Extend the Life of your Wet Processing Systems; New Cryopump Remanufacturing Facility; Semiconductor LPCVD Silicon Nitride Film; CMC Offers Toll Milling
Volume 3 - Issue 11 - 11/09/2011
2SMPP MEMS Gauge Pressure Sensors; NexGen Film Frame Probers; Optimal Surface Quality During Bulk Reduction; Tightly Controlled Batch Wet Processing; Miniature Linear Scale for Tight Spaces; Semitracks Online and Public Training Courses; Vacuum Chamber Experts; Manual Wet Process and Support Tools; Semiconductor LPCVD Silicon Nitride Film
Volume 3 - Issue 10 - 10/12/2011
Using Induction Heating for Crystal Growing; Complete Automated Wet Process Solutions; Point and Shoot Microscopy; SANYO Motor Driver ICs Available; New Ultra-high Performance Multi-axis Gyro Module; Electroglas PCB Repair and Amp Service; Combined Gas Source and Distribution System; Dragline Bucket Wear Parts; Quick Curing Chemically Resistant Epoxy;
Volume 3 - Issue 9 - 09/14/2011
ADXL345 Digital iMEMS Motion Sensors; Mass Imaging Makes Semi Manufacture More Productive; Industry Leading Four to Six Week Lead Time; Automated Wet Process Systems, Fume Hoods; CLA LED Illumination Bars; Dual-in-Line Sockets RA Mounts; An ASIC Solves Your Design Challenges; Powders into Liquids
Volume 3 - Issue 8 - 08/10/2011
Point and Shoot Microscopy; Rapid Curing for Heat Sensitive Materials; Transfer Valve/Insert/Door FlapVAT; Caged Ball LM Guide Type RSR and SRS7; Semiconductor Passivation and Electropolishing
Volume 3 - Issue 7 - 07/13/2011
1-axis and 2-axis Analog Gyroscopes; Metal Liftoff and Stripping Batch Tool; How Clean Are Your Elastomer Seals?; Cable Solutions for the Semiconductor Industry; Heating Jackets and Controls; Custom Touchscreen Solutions; Titanate Nano Powders (Barium, Strontium Titanate); Hexoloy SG Silicon Carbide
Volume 3 - Issue 6 - 06/08/2011
DI Water/Nitrogen Heater and Pure Steam Generators; Buying Refurbished Equipment Yields a Greater ROI; Brush Engineered Materials Companies Are Now Materion; Extend the Life of your Wet Processing Systems; New Ultra Low Outgassing Lubricants; Non-contact Thickness Measurements; EnerChip CC with Integrated Battery Management; Etched Foil Heaters - Semiconductor and Wafers
Volume 3 - Issue 5 - 05/11/2011
1-axis and 2-axis Analog Gyroscopes; Buying Refurbished Equipment Yields a Greater ROI; RF MEMS Switch; Thickness Made Easy; Infrared Microscopev; 3-axis Light Source Holder Machining Services; Low Noise G50Z-LN High Performance MEMS Gyro; Three-Channel Signal Conditioner; Wafer Carriers in Sapphire
Volume 3 - Issue 4 - 04/13/2011
Confocal Displacement Sensor; Reduced Footprint Batch Wafer Wet Bench; Surface Metrology Performance and Value; Crystal Growing: Ambrell Induction Heating Solutions; Buying Refurbished Equipment Yields a Greater ROI; Chemical Resistant Seals; Ammonia Scrubbing in Semiconductor Manufacturing; Diffractive Optics, Micro-optics, Photonics
Volume 3 - Issue 3 - 03/09/2011
Profile and Spike Thermocouples for Furnaces; Unique Pressure sensor for Battery and Wireless Operation; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor and AMHS Installation and Maintenance Services; Ultra Low-power ADXL345 Three-axis iMEMS Digital Accelerometer; EnerChip CC with Integrated Battery Management
Volume 3 - Issue 2 - 02/09/2011
Wafer and Substrate Clean Drying; Dedicated Mask Aligner Solutions for HB-LEDs; Surface Metrology Performance and Value; Low Noise G50Z-LN High Performance MEMS Gyro; Passivation and Electropolishing for the Semiconductor Industry; Buying Refurbished Equipment Yeilds a Greater ROI; UniCond Sensors with Ultra-wide Range and Accuracy; Flexible, Thermally Conductive Epoxy; Heater and Thermal Sensors-Heaters with Sensors
Volume 3 - Issue 1 - 01/12/2011
Revolutionary Eddy Current Technology; Spin Rinse Dryers - New; High Throughput, Low-cost, Wet Processing Sytems; Dedicated Mask Aligner Solutions for HB-LEDs; The Economical Answer to Wafer Metrology; New M800 Multiparameter Transmitter With Predictive Diagnostics; Motor Insulation for Flexibility, Durability, and Stability; Diffractive Optics, Micro-optics, Photonics; RF MEMS Switch
Volume 2 - Issue 12 - 12/08/2010
Continuous Monitoring System Pays for Itself in One Year; High-temperature Memory for Harsh Environments; Affordable Wafer Shape and Thickness Tools; We Solve Your Sub-micron MEMS Automation Challenges
Volume 2 - Issue 11 - 11/10/2010
Continuous Monitoring System Pays for Itself in One Year; Profile and Spike Thermocouples for Furnaces; Low Noise G50Z-LN High Performance MEMS Gyro; IPA Dryer - Surface Tension Gradient; Three-channel Signal Conditioner; Cost-effective Production for Analog ASICs; Improved Crystal Growth with Induction Heating
Volume 2 - Issue 10 - 10/13/2010
32-bit Power Architecture Microcontrollers from Freescale; Precision Machined Components for the Semiconductor Industry; Pure Processes, Safer Solutions; Chart Recorder Replacement ROI in 1-year; Industrial Femtosecond Lasers for Micromachining; PURA High Purity Gas Dewpoint Transmitter; UniCond Sensors with Ultra-wide Range and Accuracy; MEMS Module; Multiple Automation Platforms to Meet Your Needs; RF MEMS Switch
Volume 2 - Issue 9 - 09/08/2010
TI's CSD86350Q5D Synchronous Buck NexFET Power Block; Solve Your Microelectronics Failure Analysis Challenges; Profile and Spike Thermocouples for Furnaces; Heater and Thermal Sensors-Heaters with Sensors; New Sensor for Wafer Thickness; Wafer Carriers in Sapphire; JPE Needle Valve; Vacuum Wet Process Equipment for MEMS Manufacturing
Volume 2 - Issue 8 - 08/11/2010
Compact Thermo Chiller; In-Motion Solution; OX400 Low Oxygen Concentration Analyzer; MEMS Gyro Sensors Replacing FOGs; Diffractive Optics, Micro-optics, Photonics; New Energy Efficient Tool; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 2 - Issue 7 - 07/14/2010
Calcium Fluoride (CaF2) Single Crystal; Wire and Electrode Feedthroughs for Photovoltaic Industry; 5000TOCe Smart TOC Sensor; Three-Channel Signal Conditioner; New State-of-the-Art Cooling Technology ; MIL-STD Thermal Shock Environmental Test Chambers
Volume 2 - Issue 6 - 06/09/2010
Thermocouples for ASM Epsilon Reactors; Mega ION; Laser Technology For Semiconductor Applications; RF MEMS Switch; High-speed Type SKR Actuator; JPE Ball Valve; New Sensor for Wafer Thickness
Volume 2 - Issue 5 - 05/12/2010
Microchip's PIC32 32-Bit MCU; Leading the Metal Sealing Industry; New State of the Art Cooling Technology; We Solve Your Sub-micron MEMS Automation Challenges; Don't Miss Microtech 2010 - June 21-24 - Anaheim, CA; Low Noise G50Z-LN High Performance MEMS Gyro; NEW Actuator Type GL-N; Chemical Dispense/Waste Cabinets; JPE Tube Fitting
Volume 2 - Issue 4 - 04/14/2010
Inline Metrology with the XE-3DM; Mass Imaging Makes Semi Manufacture More Productive; New Cool-ORing Active ORing Solutions; New Thermal Insulation Increases Heater Efficiency; An ASIC Resolves Your Design Challenges; World's 1st Combination Cleaner and Cleanliness Tester; Linear Technology's Ultra-tiny ADCs
Volume 2 - Issue 3 - 03/10/2010
World's 1st Combination Cleaner and Cleanliness Tester; We Make the Labyrinth Seal Specifically for You; Inline Metrology with the XE-3DM; Gyro Sensor with Low In-run bias Stability; New Accelerometer Sensors for User Interfaces; Gas Handling Systems for Semiconductor Production; Single Wafer Spray Module; Analog Devices' ADA4501 Operational Amplifiers; Thin Film - RC/RCD
Volume 2 - Issue 2 - 02/10/2010
Complete Thermal Solutions for Semiconductor Processing; Vapor Flow Control without MFCs; Analog Devices' ADXL345 MEMs Accelerometer; Thin-section Bearings: Precision with Space Savings; Reduce Pricing Pressures and Gain Global Operational Visibility; Extend the Life of your Wet Process Systems; Prototype Electronic Assembly Services; SMT Rework Stations and Inspection Systems
Volume 2 - Issue 1 - 01/13/2010
Global High Tech Summit, Feb 11/San Jose; Gain Global Operational Visibility and Reduce Pricing Pressures; Polysilicon Wafer, Ingot, and Chunk Cleaning; Understanding the Fundamental Conductivity and Resistivity of Pure Water; In-Motion Solution; Complete Device Fabrication Available; Communications Custom Cable Molding
Volume 1 - Issue 4 - 12/09/2009
MEMS Gyro Sensors Replacing FOGs; PoP Paste Indium9.88-HF; Automated, Precise, Efficient; Low Noise G50Z-LN High Performance MEMS Gyro; MEMS Foundry Leadership; RF MEMS Switch; STMicroelectronics' MEMS Gyroscopes; Thin Film - RC/RCD
Volume 1 - Issue 3 - 11/11/2009
PoP Paste Indium9.88-HF; Extend the Life of Your Wet Process Systems; Bringing Answers to the Surface; Reduce Pricing Pressures While Increasing Visibility into Global Operations; MEMS Device Fabrication; High Temperature Acoustic Measurement System; Thin Film and Silicon Wafer Supplier; Sensors for Modal Analysis Testing
Volume 1 - Issue 2 - 10/14/2009
Bringing Answers to the Surface; Vapor Flow Control without MFCs; Low Cost, High Efficiency Actuator Type VLA; Analog Devices' ADXL345 MEMS Accelerometer; Thin Film and Silicon Wafer Supplier; Cost-effective Automation; Semi-Gas Centurion Gas Cabinet
Volume 1 - Issue 1 - 09/09/2009
Low Noise G50Z-LN High Performance MEMS Gyro; Vacuum Solutions for Semiconductor Applications; High-speed Type SKR Actuator; Semiconductor Thickness - CHRocodile IT; Don't Settle - Choose Superior RF/MMIC Technologies; Film Laminations with Optical Films