Semiconductor & MEMS Fabrication News

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Description: GlobalSpec's Semiconductor & MEMS Fabrication free eNewsletter focuses on silicon-based technologies and manufacturing processes. This free email publication keeps subscribers up-to-date on the latest devices, manufacturing techniques, and applications to improve silicon-based product design, production, and testing. Product news covers microelectronic and optoelectronic devices (transistors, photo detectors, and solar cells) as well as fabrication techniques used in making chip-size motors, actuators, and other micro electrical mechanical systems.
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Industry Trends & Events . . .
PC Sales Will Stay Strong

Sales Will Stay Strong Not many years ago, microprocessor companies were asked whether netbooks would erode the demand for conventional PCs with their higher-end processors and more-sophisticated operating systems. Today's chipmakers find themselves answering the same question. This time the interlopers are tablets. According to this item, the consensus contends that although tablets are seriously denting netbook sales, sales of higher-end PCs — particularly laptops — will stay strong. Tablets' lack of a keyboard mark them out as an additive rather than a cannibalizing market entry, although some pundits predict that the tablet's popularity will affect future PC designs.

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ADXL345 Digital iMEMS® Motion Sensors,
at Digi-Key

Digi-Key Corporation

ADXL345 Digital iMEMS® Motion Sensors, at Digi-Key Analog Devices' ADXL345 ultra-low-power digital accelerometer has an output data range that scales from 0.1 Hz to 3.2 kHz, unlike competing devices, which have fixed 100 Hz, 400 Hz, or 1 kHz data rates. This allows portable system designers to better manage energy consumption by precisely allocating power.

Buying Refurbished Equipment Yields a
Greater ROI

Capovani Brothers Inc.

Buying Refurbished Equipment Yields a Greater ROI CBI has been supplying their customers with quality refurbished equipment at a great value since 1987. With over 2,000 items in stock from Silicon Etchers and Lithography Equipment to Vacuum Pumps and Chillers, our entire inventory can be viewed on our Web site. All equipment is refurbished and sold with a warranty.

Mass Imaging Makes Semi Manufacture
More Productive

DEK

Mass Imaging Makes Semi Manufacture More Productive DEK's unparalleled Mass Imaging equipment and process expertise offers semiconductor manufacturers more productive methods of wafer bumping, coating, encapsulation, and ball placement. With DEK's Galaxy platform, enclosed print head technology and new Wafer Transport Solution, mass imaging delivers dramatic semiconductor productivity improvements in IC, CSP, SOP, and MEMS applications.

Industry Leading Four to Six Week Lead
Time

Leoni Elocab Ltd.

Industry Leading Four to Six Week Lead Time LEONI is proud to announce our new production facility is up and running! With this new capacity, LEONI is announcing industry leading lead time of four to six weeks, with order minimums of 300 ft on newly designed custom composite cables combining data, power, fiber optics, coax, twisted pairs, and even hoses!

Design . . .
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Learn More
Examining the Design Process

Examining the Design Process Rather than present some theoretical or ideal version of chip design, this dialogue follows two real principal applications engineers as they walk through their steps for creating a system-on-chip. Where did the idea come from, for example? Who was the target market, and what were the design requirements? The design constraints? What challenges appeared along the way?

Analyze the Parts as Well as the Whole

Analyze the Parts as Well as the Whole The time-honored IC design approach where analysis and verification occur only after completion of the electrical and physical (layout) steps creates an enormous bottleneck that can significantly reduce overall designer productivity. These authors call for a paradigm shift, moving verification up the line to speed up the process. To achieve their goals, they advocate a major change in the performance of electronic-design-automation (EDA) tools.

Materials. . .
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EUV Takes Off

EUV Takes Off Extreme ultraviolet (EUV) lithography, the latest technology touted to extend the reach of Moore's Law, has struggled to achieve a level of performance to permit commercialization. According to this piece from IEEE Spectrum, however, EUV suppliers are promising a big jump in brightness that will bring the technology into the mainstream, allowing manufacturers to expose wafers reliably and quickly enough to meet production requirements.

Will Heat Derail Moore's Law?

Will Heat Derail Moore's Law? Moore's Law insists that we can continue to cram more transistors onto a piece of silicon. Although people have long predicted its demise, the law continues to describe the industry's progress quite well. Yet according to this item, its downfall may result not from an inability to shrink the transistors sufficiently, but to cope with the heat they generate and the power they consume.

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Automated Wet Process Systems, Fume
Hoods

MEI, LLC

Automated Wet Process Systems, Fume Hoods The MEI Advancer series wet processing systems are highly configurable, semi-automated, modular wet stations, suitable for a wide variety of etch, strip, and clean steps. Quality systems are custom built, fully documented, and SEMI S2 compliant. Applications include processing for semiconductor devices, medical devices, nano research, MEMS manufacturing, and parts cleaning.

Get a Complimentary Trial of the IEEE
Xplore® Digital Library

IEEE — Institute of Electrical and Electronics Engineers, Inc.

Get a Complimentary Trial of the IEEE Xplore® Digital Library The IEEE Xplore Digital Library provides instant, full-text access to all IEEE journal articles, conference papers, and standards — all the cutting-edge research in all aspects of technology. Get a complimentary trial for your company.

Test & Measurement . . .
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New Memories Challenge Test

New Memories Challenge Test The call for memories that can process data more quickly while consuming less power will rise to cacophonous levels over the next year or so. The challenges include not only how to design the new devices, but the implications of those designs on test and measurement requirements. This video specifically addresses those issues.

Testers Accommodate Device Scale

Testers Accommodate Device Scale Contrary to popular conception, one tester featuring a single test-head size cannot provide the best results for testing all devices. Instead, these testers provide different-sized test heads geared toward specific device applications. The manufacturer has also introduced several new digital-channel cards with a range of specifications, so that customers can buy only the capability that they need.

Applications & Commercialization . . .
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Extending E-beam Lithography

Extending E-beam Lithography As devices continue to shrink, designers are looking for alternatives to conventional e-beam lithography, such as extreme ultraviolet (EUV) — for printing the wafers. Instead, these MIT researchers have taken a different approach. They are breathing new life into the e-beam approach by incorporating a thinner photoresist layer to reduce scattering of high-energy electrons and "developing" the resist using a solution containing ordinary table salt.

One Step Closer to Robots Like You

One Step Closer to Robots Like You Computers have a long way to go before they think the way people do. Search engines that cater to your history, for example, process information in a narrow range. A revolutionary device recently revealed by IBM aims to bridge the gap to human-like thought. Key to the development is the device's ability to deal not only with unexpected information, but with unexpected types of information.

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CLA LED Illumination Bars
Patlite (USA) Corporation

CLA LED Illumination Bars The CLA LED light bar gives a bright uniform light pattern. The sturdy polycarbonate housing requires no additional protective enclosures. Its operating temperature of -40 C to +60 C allow it to be used in many environments. Choose from seven lengths (100 mm to 1500 mm). Learn more.

Dual-in-Line Sockets RA Mounts, at Digi-Key
Digi-Key Corporation

Dual-in-Line Sockets RA Mounts, at Digi-Key Mill-Max offers DIP closed frame, right angle sockets for mounting components perpendicular to the PCB on projects such as LED displays. These sockets allow for interfacing with the front panel of units for optimum legibility. Horizontal mount solder tails are available with either .300 in. (standard) or .100 in. row spacing.

An ASIC Solves Your Design Challenges
Custom Silicon Solutions, Inc.

An ASIC Solves Your Design Challenges A custom Mixed-Signal IC (ASIC) from Custom Silicon Solutions will help you to: reduce system power requirements, improve analog circuit accuracy, reduce production costs, reduce overall system size, and improve system reliability. All this for a surprisingly practical ASIC development cost. Learn more.

Powders into Liquids
Admix

Powders into Liquids Looking for a better way to mix powders into liquids? The Fastfeed Powder Induction & Dispersion System is designed to offer controlled powder feed rates from 3 to 400 lbs per minute! It's an inline, skid-mounted dispersion system that feeds powders and disperses them instantly. Go here for more information.

Careers & Commentary . . .
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Semitracks Online and Public Training
Courses

Semitracks Inc.

Semitracks Online and Public Training Courses October 3rd-6th Semitracks is offering Failure and Yield Analysis training, and Semiconductor Reliability training October 11th-13th in San Jose, CA. Sign up now to master the knowledge your business needs!

Leave Legacy Software Behind

 

Leave Legacy Software Behind Every time you upgrade your computer's operating system, some of your old software refuses to run. You don't even get any kind of a warning. You don't want to replace the software, but what choice do you have? This story from BBC News looks at the issue of software obsolescence and offers some advice on how to cope.

If you find this subject interesting, subscribe to the GlobalSpec e-Newsletter, DirectU2 the world of Engineering Management.

Diversions . . .
Do the Math in Your Head

Do the Math in Your Head Have you ever wanted to perform amazing calculations without pencil, paper, or computer? In this short video, Dr. Arthur Benjamin — a prominent professor and magician — demonstrates his own prowess and presents some of the techniques he uses to accomplish it. You can do it too. Take a look! Amaze your friends!

Share Your Thoughts . . .
About This Month's Topic

About This Month's Topic Ready for the Trash Can?

Have you ever bought a new computer or upgraded the operating system on an existing machine only to discover that critical software won't run? Did you replace the software or continue to use an older operating system? How successful was your solution?


Join the discussion...


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September 14, 2011 - Volume 3 Issue 9
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Archives
Past Issues of this eNewsletter
Volume 6 - Issue 4 - 04/09/2014
New Low Power MEMS Accelerometer; Thermocouples for ASM Epsilon Reactors; We Move the World; Custom Manufacturing of Silicon Substrates and Optical Components; Temperature Control Experts in Semi Compliance; Speed Up Your Project Timeline with Designs Reference Design Library; Actually It IS Easy Being Green; Allegro Position Sensor ICs; Sensors for Extremely High-resolution Solutions; New InGaAs and Silicon Avalanche Photodiodes
Volume 6 - Issue 3 - 03/12/2014
Custom Rotary Sealing Solutions; Improved Metal Lift-off Performance!; Innovative, Single-chip MEMS Oscillator Evaluation Kit; Despatch LCC Ovens for Semiconductor Manufacturing ; Example of Robust Pressure Switch Offering; PRIME MOVER Hermetic Bellows Linear Actuators
Volume 6 - Issue 2 - 02/12/2014
High-Res Inspection Microscope for Large Sensors; Sealing Solutions for Critical Semicon Applications; ETEL's LMS Ironcore Linear Motor Series Limits Thermal Drift; All the Right Moves for Ultimate Precision; RF Transistor - NPN, 12 V, 8 GHZ; Allegro Position Sensor ICs; G-Band Transmitters - Cutting Edge Performance
Volume 6 - Issue 1 - 01/08/2014
Temperature Control Experts in Semi Compliance; LIC 4000 Encoder - Absolute position values to 1 nm; LIP 400 Advances Vacuum Encoder Technology; New IQ+ Vacuum Pressure Control Valves; New MEMS Thermal Sensors; Purely Sealing Your Success; Imaging in Space and Aerial Reconnaisance; Micron RLDRAM Memory; Extreme High-performance MEMS Aerospace Accelerometers
Volume 5 - Issue 12 - 12/11/2013
MEMS Foundry Service; Extended Seal Life Comes as Standard; UV-enhanced Planar Diffused Photodiodes; AMS-IRKT250-16 Dual Thyristors; PRIME MOVER Hermetic Bellows Linear Actuators; G-Band Transmitters - Cutting Edge Performance
Volume 5 - Issue 11 - 11/13/2013
Revolutionary Eddy Current Technology; Purity is the Key to Efficiency; Universal Swivel Bulkhead Fittings; Ovens for Semiconductor Manufacturing; Vacuum Valves...New N-Series; All the Right Moves for Ultimate Precision; Avoiding Semiconductor Failures; Rotary Feedthrough; How-to Guide for Understanding Fluid Chillers; SC TruStability Board Mount Pressure Sensors; 1.5 uA Ultra-low Power TMR Magnetic Switches
Volume 5 - Issue 10 - 10/09/2013
Extremely Compact Brushless DC Servo Motors; New MEMS Motion Sensor; Looking to Increase Your Wafer Yield?; New Avalanche Photodiodes; MIC 6 Aluminum Cast Plate - The Best of the Best; LIC 4000 Encoder - Absolute Position Values to 1 nm; Vacuum Products Catalog; Valuable Partner for Semiconductor Industry; Cost-effective Alternative to Automated Wafer Inspection Systems; Rotary Feedthrough; New Mechanical Lift Table
Volume 5 - Issue 9 - 09/11/2013
Temperature Control Experts in Semi Compliance; Semiconductor and MEMS Device Manufacturing; Simplify Your Liquid Cooling System; All the Right Moves for Ultimate Precision; Ultra Low Outgassing Lubricants; PIC24F: Low-power 16-bit MCUs; Keep an Eye on Wafer Thickness; Rotary Feedthrough
Volume 5 - Issue 8 - 08/14/2013
Innovative, Single-chip MEMS Oscillator Evaluation Kit; Built for the Highest Levels of Efficiency; High Temperature Vacuum Sensing Manometers; Vacuum Sealing and Throttling Butterfly Valve; Simplify Your Liquid Cooling System; Keep an Eye on Wafer Thickness; PRIME MOVER Hermetic Bellows Linear Actuators; Companies Worldwide Taking Advantage of the Accumeasure Systems
Volume 5 - Issue 7 - 07/10/2013
Single-chip MEMS Oscillator Architecture; Joining Forces to Fuel M2M Innovation; PRIME MOVER Hermetic Bellows Linear Actuators; Need a JEDEC Tray for Your New Device Fast?; Vacuum Sealing and Throttling Butterfly Valve; Need a Smaller and Lighter Control Cable?; Simplify Your Liquid Cooling System
Volume 5 - Issue 6 - 06/12/2013
Materials and Technology for Semiconductor Manufacturing; Rotary Systems Provides Rotary Unions for the Asian Market ; THK Caged Ball LM Guide Type RSR and SRS7 ; Need a JEDEC Tray for Your New Device Fast?; LIC 4000 Encoder - Absolute Position Values to 1 nm; Lower Machine Costs and Increase Efficiency; Semi-ceramics Are Us!; PIC24F: Low-power 16-bit MCUs; PRIME MOVER Hermetic Bellows Linear Actuators; TMR Gear Tooth Sensors
Volume 5 - Issue 5 - 05/08/2013
Microcircuit Materials - Large Batch Electronics Grade; Tiny MEMS Pressure/Vacuum Sensor Coming Soon!; Companies Worldwide Taking Advantage of the Accumeasure Systems; Titanate Nano Powders (Barium, Strontium Titanate); Bellows Pumps and Compressors; Hexoloy SG Silicon Carbide
Volume 5 - Issue 4 - 04/10/2013
New Capacitive Measurement Catalog; Wire and Electrode Feedthroughs for Photovoltaic Industry; New Xtrinsic Accelerometers; Apiezon Launches PFPE High Temperature Lubricating Vacuum Grease; New IQ+ Vacuum Pressure Control Valves; Purely Sealing Your Success; PRIME MOVER Hermetic Bellows Linear Actuators; Integrate Micro-imaging Quickly and Easily; Nano-precision Positioners/Aligners Up to Six Axes; Surface Mount Fuses with 72 V Interrupt Rating
Volume 5 - Issue 3 - 03/13/2013
New Three-axis Digital MEMS Gyroscope; Leading-edge Precious Metal Processes for Semiconductors; Purely Sealing Your Success; Analog ASICs Copy-protected by Process; Keep an Eye on Wafer Thickness; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Prime Mover Hermetic Bellows Linear Actuators
Volume 5 - Issue 2 - 02/13/2013
LIC 4000 Encoder - Absolute position values to 1 nm; New Sensor for Wafer Thickness; High Performance MEMS G100Z Gyro - Ultra Low Noise; We've Gone 2D!; PRIME MOVER Hermetic Bellows Linear Actuators; Precision CNC and Conventional Custom Mfg.
Volume 5 - Issue 1 - 01/09/2013
Piezo Motors Nanometer-scale Precision; confocalDT Distance/Thickness Spectrometer; Thermocouples for ASM Epsilon Reactors; Large Industrial Transformers for Alternative Energy; Vacuum Chamber Experts; Transfer Valve/Insert/Door FlapVAT; Purely Sealing Your Success; Bellows Pumps and Compressors; Measure Vibration, Ultrasound, and Temperature Simultaneously; 40 Years of Quality Printed Circuit Boards
Volume 4 - Issue 12 - 12/12/2012
Oil-less Rocking Piston Lab Compressor; Wafer Cleaning - Etch, Strip, Clean, In Control.; Avoiding Semiconductor Failures; Custom Chemical Synthesis ; Rugged Ultra Low Noise Dual Axis Gyro - G200
Volume 4 - Issue 11 - 11/14/2012
STMicroelectronics L3G4200D Gyroscopes; TLC5929: 16-Ch Constant Current LED Driver; Semiconductor Leaders Reduce Processing Costs; Custom Bearings
Volume 4 - Issue 10 - 10/10/2012
New Ultra-versatile Micro Imaging Lens System ; AMOLED and MEMS Device Manufacturing; Precious Metal Plating for Semiconductor Applications; Thermocouples for ASM Epsilon Reactors; New IQ+ Vacuum Pressure Control Valves; PolySim: An ESD-Resistant Enclosure Curtain; Medical Metal Parts in as Little as Two Days!; NASA Low Outgassing Approved, UV Curable Epoxy; Logistics Helps Predict the Future of High-tech Supply Chains
Volume 4 - Issue 9 - 09/12/2012
Advanced MEMS Microphones; Fully Automated Wafer Wet Bench; Precision Analog IMU - MRM30 IMU; High-sensitivity Magnetic Field Sensor; Chillers for Semiconductor Equipment Cooling
Volume 4 - Issue 8 - 08/08/2012
The Next Level of Precision Adjustment; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Manual and Pneumatic Ball Valves; Zero Power Millimeter Sensors Using EnerChips;
Volume 4 - Issue 7 - 07/11/2012
Motorized Precision Positioners for High Vacuum /EUV; Epoxy Offers Shock and Impact Resistance; STT-MRAM Metrology Tool for 300 mm Wafers; New Zooming Single-objective Probing Microscope; Modular Cleanrooms Mean Profits; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 6 - 06/13/2012
Flexible Designs Boost Customer Productivity!; Ultra-high Purity Pump for Semiconductor Manufacturing; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Extend the Life of Your Wet Bench; Chemcassette Paper Tape: The Reel Deal; New Trap for MOCVD; Semiconductor LPCVD Silicon Nitride Film; New Magnetic Angle Sensors by MultiDimension; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 5 - 05/09/2012
New STM32 F4 Series; Get Control of Your Batch Making!; Stop Over Greasing Bearings; HEMP/EMP Filters
Volume 4 - Issue 4 - 04/11/2012
Miniaturized Positioning Stages Offer Micron-level Accuracy; confocalDT High End Spectrometer; Breakthrough Hyper-pure Silicon Finishing; Increase Heat Sink Cooling Efficiency; Wire and Electrode Feedthroughs for Photovoltaic Industry; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; SMT Rework Stations and Inspection Systems
Volume 4 - Issue 3 - 03/14/2012
Profile Thermocouples and Spike Thermocouples for Furnaces; Increase Heat Sink Cooling Efficiency; Aluminum Vacuum Chambers; Ultra Pure Rubber Seals; 200/300 mm Fully Automated Process Station; Leading Edge E-beam Technology Solutions Provider; Offshore and Domestic PCB Manufacturing at Any Volume;
Volume 4 - Issue 2 - 02/08/2012
Micromotors Speed Up PCB Assembly; M2M Application Platform Perfected; 3-axis Light Source Holder Machining Services; Air Conditioning/Refrigeration Compressors and Pressure Vessels; OLED Takes FPD to New Level; Miniature Linear Scale for Tight Spaces; Electrically Insulative Snap Cure Epoxy; New Magnetic Switches Feature High-speed, Low-power
Volume 4 - Issue 1 - 01/11/2012
New Capacitive Measurement Catalog; Reduced Footprint Batch Wafer Wet Bench; New Gamma Detector; Semiconductor Imaging Solutions; New IQ+ Vacuum Pressure Control Valves; SMT Rework Stations and Inspection Systems
Volume 3 - Issue 12 - 12/14/2011
Where Applications Demand Optimum Surface Finish; Single-element Silicon PIN Photodiodes; Extend the Life of your Wet Processing Systems; New Cryopump Remanufacturing Facility; Semiconductor LPCVD Silicon Nitride Film; CMC Offers Toll Milling
Volume 3 - Issue 11 - 11/09/2011
2SMPP MEMS Gauge Pressure Sensors; NexGen Film Frame Probers; Optimal Surface Quality During Bulk Reduction; Tightly Controlled Batch Wet Processing; Miniature Linear Scale for Tight Spaces; Semitracks Online and Public Training Courses; Vacuum Chamber Experts; Manual Wet Process and Support Tools; Semiconductor LPCVD Silicon Nitride Film
Volume 3 - Issue 10 - 10/12/2011
Using Induction Heating for Crystal Growing; Complete Automated Wet Process Solutions; Point and Shoot Microscopy; SANYO Motor Driver ICs Available; New Ultra-high Performance Multi-axis Gyro Module; Electroglas PCB Repair and Amp Service; Combined Gas Source and Distribution System; Dragline Bucket Wear Parts; Quick Curing Chemically Resistant Epoxy;
Volume 3 - Issue 9 - 09/14/2011
ADXL345 Digital iMEMS Motion Sensors; Mass Imaging Makes Semi Manufacture More Productive; Industry Leading Four to Six Week Lead Time; Automated Wet Process Systems, Fume Hoods; CLA LED Illumination Bars; Dual-in-Line Sockets RA Mounts; An ASIC Solves Your Design Challenges; Powders into Liquids
Volume 3 - Issue 8 - 08/10/2011
Point and Shoot Microscopy; Rapid Curing for Heat Sensitive Materials; Transfer Valve/Insert/Door FlapVAT; Caged Ball LM Guide Type RSR and SRS7; Semiconductor Passivation and Electropolishing
Volume 3 - Issue 7 - 07/13/2011
1-axis and 2-axis Analog Gyroscopes; Metal Liftoff and Stripping Batch Tool; How Clean Are Your Elastomer Seals?; Cable Solutions for the Semiconductor Industry; Heating Jackets and Controls; Custom Touchscreen Solutions; Titanate Nano Powders (Barium, Strontium Titanate); Hexoloy SG Silicon Carbide
Volume 3 - Issue 6 - 06/08/2011
DI Water/Nitrogen Heater and Pure Steam Generators; Buying Refurbished Equipment Yields a Greater ROI; Brush Engineered Materials Companies Are Now Materion; Extend the Life of your Wet Processing Systems; New Ultra Low Outgassing Lubricants; Non-contact Thickness Measurements; EnerChip CC with Integrated Battery Management; Etched Foil Heaters - Semiconductor and Wafers
Volume 3 - Issue 5 - 05/11/2011
1-axis and 2-axis Analog Gyroscopes; Buying Refurbished Equipment Yields a Greater ROI; RF MEMS Switch; Thickness Made Easy; Infrared Microscopev; 3-axis Light Source Holder Machining Services; Low Noise G50Z-LN High Performance MEMS Gyro; Three-Channel Signal Conditioner; Wafer Carriers in Sapphire
Volume 3 - Issue 4 - 04/13/2011
Confocal Displacement Sensor; Reduced Footprint Batch Wafer Wet Bench; Surface Metrology Performance and Value; Crystal Growing: Ambrell Induction Heating Solutions; Buying Refurbished Equipment Yields a Greater ROI; Chemical Resistant Seals; Ammonia Scrubbing in Semiconductor Manufacturing; Diffractive Optics, Micro-optics, Photonics
Volume 3 - Issue 3 - 03/09/2011
Profile and Spike Thermocouples for Furnaces; Unique Pressure sensor for Battery and Wireless Operation; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor and AMHS Installation and Maintenance Services; Ultra Low-power ADXL345 Three-axis iMEMS Digital Accelerometer; EnerChip CC with Integrated Battery Management
Volume 3 - Issue 2 - 02/09/2011
Wafer and Substrate Clean Drying; Dedicated Mask Aligner Solutions for HB-LEDs; Surface Metrology Performance and Value; Low Noise G50Z-LN High Performance MEMS Gyro; Passivation and Electropolishing for the Semiconductor Industry; Buying Refurbished Equipment Yeilds a Greater ROI; UniCond Sensors with Ultra-wide Range and Accuracy; Flexible, Thermally Conductive Epoxy; Heater and Thermal Sensors-Heaters with Sensors
Volume 3 - Issue 1 - 01/12/2011
Revolutionary Eddy Current Technology; Spin Rinse Dryers - New; High Throughput, Low-cost, Wet Processing Sytems; Dedicated Mask Aligner Solutions for HB-LEDs; The Economical Answer to Wafer Metrology; New M800 Multiparameter Transmitter With Predictive Diagnostics; Motor Insulation for Flexibility, Durability, and Stability; Diffractive Optics, Micro-optics, Photonics; RF MEMS Switch
Volume 2 - Issue 12 - 12/08/2010
Continuous Monitoring System Pays for Itself in One Year; High-temperature Memory for Harsh Environments; Affordable Wafer Shape and Thickness Tools; We Solve Your Sub-micron MEMS Automation Challenges
Volume 2 - Issue 11 - 11/10/2010
Continuous Monitoring System Pays for Itself in One Year; Profile and Spike Thermocouples for Furnaces; Low Noise G50Z-LN High Performance MEMS Gyro; IPA Dryer - Surface Tension Gradient; Three-channel Signal Conditioner; Cost-effective Production for Analog ASICs; Improved Crystal Growth with Induction Heating
Volume 2 - Issue 10 - 10/13/2010
32-bit Power Architecture Microcontrollers from Freescale; Precision Machined Components for the Semiconductor Industry; Pure Processes, Safer Solutions; Chart Recorder Replacement ROI in 1-year; Industrial Femtosecond Lasers for Micromachining; PURA High Purity Gas Dewpoint Transmitter; UniCond Sensors with Ultra-wide Range and Accuracy; MEMS Module; Multiple Automation Platforms to Meet Your Needs; RF MEMS Switch
Volume 2 - Issue 9 - 09/08/2010
TI's CSD86350Q5D Synchronous Buck NexFET Power Block; Solve Your Microelectronics Failure Analysis Challenges; Profile and Spike Thermocouples for Furnaces; Heater and Thermal Sensors-Heaters with Sensors; New Sensor for Wafer Thickness; Wafer Carriers in Sapphire; JPE Needle Valve; Vacuum Wet Process Equipment for MEMS Manufacturing
Volume 2 - Issue 8 - 08/11/2010
Compact Thermo Chiller; In-Motion Solution; OX400 Low Oxygen Concentration Analyzer; MEMS Gyro Sensors Replacing FOGs; Diffractive Optics, Micro-optics, Photonics; New Energy Efficient Tool; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 2 - Issue 7 - 07/14/2010
Calcium Fluoride (CaF2) Single Crystal; Wire and Electrode Feedthroughs for Photovoltaic Industry; 5000TOCe Smart TOC Sensor; Three-Channel Signal Conditioner; New State-of-the-Art Cooling Technology ; MIL-STD Thermal Shock Environmental Test Chambers
Volume 2 - Issue 6 - 06/09/2010
Thermocouples for ASM Epsilon Reactors; Mega ION; Laser Technology For Semiconductor Applications; RF MEMS Switch; High-speed Type SKR Actuator; JPE Ball Valve; New Sensor for Wafer Thickness
Volume 2 - Issue 5 - 05/12/2010
Microchip's PIC32 32-Bit MCU; Leading the Metal Sealing Industry; New State of the Art Cooling Technology; We Solve Your Sub-micron MEMS Automation Challenges; Don't Miss Microtech 2010 - June 21-24 - Anaheim, CA; Low Noise G50Z-LN High Performance MEMS Gyro; NEW Actuator Type GL-N; Chemical Dispense/Waste Cabinets; JPE Tube Fitting
Volume 2 - Issue 4 - 04/14/2010
Inline Metrology with the XE-3DM; Mass Imaging Makes Semi Manufacture More Productive; New Cool-ORing Active ORing Solutions; New Thermal Insulation Increases Heater Efficiency; An ASIC Resolves Your Design Challenges; World's 1st Combination Cleaner and Cleanliness Tester; Linear Technology's Ultra-tiny ADCs
Volume 2 - Issue 3 - 03/10/2010
World's 1st Combination Cleaner and Cleanliness Tester; We Make the Labyrinth Seal Specifically for You; Inline Metrology with the XE-3DM; Gyro Sensor with Low In-run bias Stability; New Accelerometer Sensors for User Interfaces; Gas Handling Systems for Semiconductor Production; Single Wafer Spray Module; Analog Devices' ADA4501 Operational Amplifiers; Thin Film - RC/RCD
Volume 2 - Issue 2 - 02/10/2010
Complete Thermal Solutions for Semiconductor Processing; Vapor Flow Control without MFCs; Analog Devices' ADXL345 MEMs Accelerometer; Thin-section Bearings: Precision with Space Savings; Reduce Pricing Pressures and Gain Global Operational Visibility; Extend the Life of your Wet Process Systems; Prototype Electronic Assembly Services; SMT Rework Stations and Inspection Systems
Volume 2 - Issue 1 - 01/13/2010
Global High Tech Summit, Feb 11/San Jose; Gain Global Operational Visibility and Reduce Pricing Pressures; Polysilicon Wafer, Ingot, and Chunk Cleaning; Understanding the Fundamental Conductivity and Resistivity of Pure Water; In-Motion Solution; Complete Device Fabrication Available; Communications Custom Cable Molding
Volume 1 - Issue 4 - 12/09/2009
MEMS Gyro Sensors Replacing FOGs; PoP Paste Indium9.88-HF; Automated, Precise, Efficient; Low Noise G50Z-LN High Performance MEMS Gyro; MEMS Foundry Leadership; RF MEMS Switch; STMicroelectronics' MEMS Gyroscopes; Thin Film - RC/RCD
Volume 1 - Issue 3 - 11/11/2009
PoP Paste Indium9.88-HF; Extend the Life of Your Wet Process Systems; Bringing Answers to the Surface; Reduce Pricing Pressures While Increasing Visibility into Global Operations; MEMS Device Fabrication; High Temperature Acoustic Measurement System; Thin Film and Silicon Wafer Supplier; Sensors for Modal Analysis Testing
Volume 1 - Issue 2 - 10/14/2009
Bringing Answers to the Surface; Vapor Flow Control without MFCs; Low Cost, High Efficiency Actuator Type VLA; Analog Devices' ADXL345 MEMS Accelerometer; Thin Film and Silicon Wafer Supplier; Cost-effective Automation; Semi-Gas Centurion Gas Cabinet
Volume 1 - Issue 1 - 09/09/2009
Low Noise G50Z-LN High Performance MEMS Gyro; Vacuum Solutions for Semiconductor Applications; High-speed Type SKR Actuator; Semiconductor Thickness - CHRocodile IT; Don't Settle - Choose Superior RF/MMIC Technologies; Film Laminations with Optical Films