Semiconductor & MEMS Fabrication News

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Description: GlobalSpec's Semiconductor & MEMS Fabrication free eNewsletter focuses on silicon-based technologies and manufacturing processes. This free email publication keeps subscribers up-to-date on the latest devices, manufacturing techniques, and applications to improve silicon-based product design, production, and testing. Product news covers microelectronic and optoelectronic devices (transistors, photo detectors, and solar cells) as well as fabrication techniques used in making chip-size motors, actuators, and other micro electrical mechanical systems.
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Industry Trends & Events . . .
How Small is too Small?

How Small is too Small? At what point do we decide that shrinking circuitry any further will preclude achieving adequate yields from the manufacturing process and acceptable performance from the devices themselves? Apparently, those issues are already emerging with the 28 nm process being developed by foundries such as the Taiwan Semiconductor Manufacturing Company (TSMC), which according to one source is falling short of expectations. As a result, some industry analysts predict that the existing 32 nm process may remain the state of the art for some time to come.

 
Now at Digi-Key: STMicroelectronics
L3G4200D Gyroscope

Digi-Key Corporation
Profile Thermocouples and Spike
Thermocouples for Furnaces

Conax Technologies

Now at Digi-Key: STMicroelectronics L3G4200D Gyroscope Providing unprecedented stability of zero rate level and sensitivity over temperature and time, the L3G4200D, a low power, three-axis angular rate sensor, includes a sensing element and an IC interface capable of providing the measured angular rate to the external world through a digital interface such as I²C or SPI.

Profile Thermocouples and Spike Thermocouples for Furnaces Conax Semiconductor supplies Profile Thermocouples and Spike Thermocouples for most common brands of horizontal and vertical diffusion furnaces. The thermocouples are available in R, B, and K calibrations and in wire sizes ranging from 0.5 mm (0.020 in.) to 0.25 mm (0.010 in.). We also offer a platinum exchange program.

Mouser Supplying Complex Gesture
Recognition Solution

Mouser Electronics, Inc.
Increase Heat Sink Cooling Efficiency

Sensor Products Inc.

Mouser Supplying Complex Gesture Recognition Solution Freescale Semiconductor MMA8450Q 3-axis digital accelerometer is a 12-bit, low-G I²C capacitive acceleration sensor with extremely low power that offers additional embedded intelligence, including orientation, tap, double tap, jolt, freefall, and shake detection. The device is made for next-gen mobile applications that go beyond basic algorithms.

Increase Heat Sink Cooling Efficiency Our tactile surface pressure sensors allow you to measure the surface contact pressure distribution and magnitude between a heat sink (transistor) and heat source interface, aiding in thermal analysis.

Learn more and request a complimentary sample.

Design . . .
Learn More
Another View of the Very Small

Another View of the Very Small Despite the inherent challenges, some companies are pushing ahead with 28 nm processes for the next generation of mobile and other consumer devices. This white paper explores a cooperative effort between two companies to create super low power devices that minimize power consumption and increase battery life while providing mixed-signal designers some distinct advantages over existing solutions.

Illuminating Semiconductor Cooling

Illuminating Semiconductor Cooling The concept of cooling by bombarding a semiconductor membrane with laser light may seem counterintuitive, but researchers at the Niels Bohr Institute have developed a technique for doing exactly that. The process, which combines aspects of quantum physics and nanophysics, has already been used to cool cesium atoms down to almost absolute zero.

Materials. . .
Learn More
Say Goodbye to Sapphire for Blue and
White LEDs

Say Goodbye to Sapphire for Blue and White LEDs One drawback to manufacturing gallium-nitride blue and white LEDs has always been the need to grow the GaN layers on a sapphire substrate. This piece proudly announces the first efforts to grow the light-emitting layers on silicon, taking advantage of existing manufacturing technology to produce less expensive high-performance devices with no loss of quality. The devices will likely hit the market in about two years.

Cutting It Close
 

Cutting It Close To avoid the cost of extra circuitry to detect or compensate for device failure, designers often try to hedge by increasing error margins. But wider margins consume more power and may compromise device timing. This article examines how to optimize the tradeoffs required to achieve the highest performance at the lowest cost. The author suggests that new materials like graphene may provide part of the solution.

 
Aluminum Vacuum Chambers
Nor-Cal Products, Inc.
Ultra Pure Rubber Seals
CT Gasket & Polymer Co., Inc.

Aluminum Vacuum Chambers Nor-Cal manufactures welded ultra-high vacuum aluminum chambers, providing several advantages including low material cost, light weight, high thermal conductivity, and low nuclear activation, low magnetic permeability. E-mail prints@n-c.com for an estimate. Or we will design an aluminum chamber to meet your specifications and provide all the components to complete your system.

Ultra Pure Rubber Seals Looking for high quality Ultra Pure Rubber Seals and O-rings? Look no further than CTG, Inc.

We offer two compounds: CTV10352 (Viton Polymer) and CTPFE11025 (PFE Polymer) from 30 in. Wafer Etching Chamber Seals to -210 Standard O-rings call CTG, Inc. for all your Ultra Pure Sealing requirements. Learn more...

Test & Measurement . . .
Learn More
Getting SoC Hardware to Talk to the Software

Getting SoC Hardware to Talk to the Software The ever-increasing complexity of systems-on-chip (SoCs) necessitates developing software and hardware together. But traditionally, software and hardware teams work in isolation. This article presents the challenges of simultaneous verification and offers some suggestions on how to make the process less painful. It includes how to build a test bed and how to debug internal device operations.

Flexible Testing with Kelvin-ready Solutions

Flexible Testing with Kelvin-ready Solutions Many device manufacturers limit use of Kelvin contacting systems to devices that require high-precision measurements, primarily because of cost and the complexity of implementation. Yet Kelvin-ready solutions offer increased flexibility by allowing reuse of contactors and reducing the complexity of load boards. Self-cleaning equipment can also improve yields for testing devices that are particularly sensitive to contact resistance.

Applications & Commercialization . . .
Learn More
Expanding Into Enemy Territory

Expanding Into Enemy Territory You wouldn't think that a Lilliputian company like Britain's ARM would encroach on territory occupied by Goliath Intel. Nor would you expect Intel to go after ARM's market. Yet in the not-always-logical world of semiconductors, that is exactly what is happening. Although ARM's microprocessors dominate mobile phones and ultrabooks, Intel introduced several devices aimed at those products. ARM, meanwhile, is traveling unfamiliar paths of its own.

Lithography Before the Mask

Lithography Before the Mask Prototyping MEMS and other small systems has to take place before making the masks that will be used in production. You chase the chicken-and-egg problem of verifying the circuitry before making the mask that will make the circuitry. This company offers a high-precision direct-write lithographic tool that boasts a small footprint and exposure times of less than an hour.

 
200/300 mm Fully Automated Process
Station

JST Manufacturing, Inc.
Semiconductor Passivation and
Electropolishing

Central Electropolishing Co., Inc. — CELCO

200/300 mm Fully Automated Process Station JST's Plating Station accommodates 200 mm and 300 mm wafers without any additional hardware or adjustments. JST's CLV Dryer provides a particle neutral dry. With JST's GENII Software, customers can track lots, trend and export data, name recipes and baths, select language, and more.

Semiconductor Passivation and Electropolishing Central Electropolishing Company performs semi-conductor quality super passivated and electropolished finishes. Their unique automated electropolishing system allows them to electropolish large quantities of small components in an expeditious manner.
CELCO has developed tooling to electropolish the ID of standard fittings such as VCR, glands, and micro-fittings in large quantities.

Leading Edge E-beam Technology Solutions
Provider

Vistec Electron Beam Lithography Group
Offshore and Domestic PCB Manufacturing
at Any Volume

Bare Board Group, Inc.

Leading Edge E-beam Technology Solutions Provider Vistec Electron Beam Lithography Group is a world leader in design and manufacture of electron beam lithography systems, usable for a wide range of existing and emerging semiconductor and nanotechnology applications. The Group consists of two business units: Vistec Electron Beam GmbH (Jena, Germany) and Vistec Lithography, Inc. (Watervliet, U.S.A.).

Offshore and Domestic PCB Manufacturing at Any Volume Printed circuit board supplier — Bare Board Group(BBG) provides high-mix, low-to-high volume PCBs built in the Far East. With an expanded catalog of manufacturing capabilities, three to five week turn production orders, and multiple stocking options, BBG can support your PCB needs anywhere in the world.

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March 14, 2012 - Volume 4 Issue 3
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Archives
Past Issues of this eNewsletter
Volume 6 - Issue 4 - 04/09/2014
New Low Power MEMS Accelerometer; Thermocouples for ASM Epsilon Reactors; We Move the World; Custom Manufacturing of Silicon Substrates and Optical Components; Temperature Control Experts in Semi Compliance; Speed Up Your Project Timeline with Designs Reference Design Library; Actually It IS Easy Being Green; Allegro Position Sensor ICs; Sensors for Extremely High-resolution Solutions; New InGaAs and Silicon Avalanche Photodiodes
Volume 6 - Issue 3 - 03/12/2014
Custom Rotary Sealing Solutions; Improved Metal Lift-off Performance!; Innovative, Single-chip MEMS Oscillator Evaluation Kit; Despatch LCC Ovens for Semiconductor Manufacturing ; Example of Robust Pressure Switch Offering; PRIME MOVER Hermetic Bellows Linear Actuators
Volume 6 - Issue 2 - 02/12/2014
High-Res Inspection Microscope for Large Sensors; Sealing Solutions for Critical Semicon Applications; ETEL's LMS Ironcore Linear Motor Series Limits Thermal Drift; All the Right Moves for Ultimate Precision; RF Transistor - NPN, 12 V, 8 GHZ; Allegro Position Sensor ICs; G-Band Transmitters - Cutting Edge Performance
Volume 6 - Issue 1 - 01/08/2014
Temperature Control Experts in Semi Compliance; LIC 4000 Encoder - Absolute position values to 1 nm; LIP 400 Advances Vacuum Encoder Technology; New IQ+ Vacuum Pressure Control Valves; New MEMS Thermal Sensors; Purely Sealing Your Success; Imaging in Space and Aerial Reconnaisance; Micron RLDRAM Memory; Extreme High-performance MEMS Aerospace Accelerometers
Volume 5 - Issue 12 - 12/11/2013
MEMS Foundry Service; Extended Seal Life Comes as Standard; UV-enhanced Planar Diffused Photodiodes; AMS-IRKT250-16 Dual Thyristors; PRIME MOVER Hermetic Bellows Linear Actuators; G-Band Transmitters - Cutting Edge Performance
Volume 5 - Issue 11 - 11/13/2013
Revolutionary Eddy Current Technology; Purity is the Key to Efficiency; Universal Swivel Bulkhead Fittings; Ovens for Semiconductor Manufacturing; Vacuum Valves...New N-Series; All the Right Moves for Ultimate Precision; Avoiding Semiconductor Failures; Rotary Feedthrough; How-to Guide for Understanding Fluid Chillers; SC TruStability Board Mount Pressure Sensors; 1.5 uA Ultra-low Power TMR Magnetic Switches
Volume 5 - Issue 10 - 10/09/2013
Extremely Compact Brushless DC Servo Motors; New MEMS Motion Sensor; Looking to Increase Your Wafer Yield?; New Avalanche Photodiodes; MIC 6 Aluminum Cast Plate - The Best of the Best; LIC 4000 Encoder - Absolute Position Values to 1 nm; Vacuum Products Catalog; Valuable Partner for Semiconductor Industry; Cost-effective Alternative to Automated Wafer Inspection Systems; Rotary Feedthrough; New Mechanical Lift Table
Volume 5 - Issue 9 - 09/11/2013
Temperature Control Experts in Semi Compliance; Semiconductor and MEMS Device Manufacturing; Simplify Your Liquid Cooling System; All the Right Moves for Ultimate Precision; Ultra Low Outgassing Lubricants; PIC24F: Low-power 16-bit MCUs; Keep an Eye on Wafer Thickness; Rotary Feedthrough
Volume 5 - Issue 8 - 08/14/2013
Innovative, Single-chip MEMS Oscillator Evaluation Kit; Built for the Highest Levels of Efficiency; High Temperature Vacuum Sensing Manometers; Vacuum Sealing and Throttling Butterfly Valve; Simplify Your Liquid Cooling System; Keep an Eye on Wafer Thickness; PRIME MOVER Hermetic Bellows Linear Actuators; Companies Worldwide Taking Advantage of the Accumeasure Systems
Volume 5 - Issue 7 - 07/10/2013
Single-chip MEMS Oscillator Architecture; Joining Forces to Fuel M2M Innovation; PRIME MOVER Hermetic Bellows Linear Actuators; Need a JEDEC Tray for Your New Device Fast?; Vacuum Sealing and Throttling Butterfly Valve; Need a Smaller and Lighter Control Cable?; Simplify Your Liquid Cooling System
Volume 5 - Issue 6 - 06/12/2013
Materials and Technology for Semiconductor Manufacturing; Rotary Systems Provides Rotary Unions for the Asian Market ; THK Caged Ball LM Guide Type RSR and SRS7 ; Need a JEDEC Tray for Your New Device Fast?; LIC 4000 Encoder - Absolute Position Values to 1 nm; Lower Machine Costs and Increase Efficiency; Semi-ceramics Are Us!; PIC24F: Low-power 16-bit MCUs; PRIME MOVER Hermetic Bellows Linear Actuators; TMR Gear Tooth Sensors
Volume 5 - Issue 5 - 05/08/2013
Microcircuit Materials - Large Batch Electronics Grade; Tiny MEMS Pressure/Vacuum Sensor Coming Soon!; Companies Worldwide Taking Advantage of the Accumeasure Systems; Titanate Nano Powders (Barium, Strontium Titanate); Bellows Pumps and Compressors; Hexoloy SG Silicon Carbide
Volume 5 - Issue 4 - 04/10/2013
New Capacitive Measurement Catalog; Wire and Electrode Feedthroughs for Photovoltaic Industry; New Xtrinsic Accelerometers; Apiezon Launches PFPE High Temperature Lubricating Vacuum Grease; New IQ+ Vacuum Pressure Control Valves; Purely Sealing Your Success; PRIME MOVER Hermetic Bellows Linear Actuators; Integrate Micro-imaging Quickly and Easily; Nano-precision Positioners/Aligners Up to Six Axes; Surface Mount Fuses with 72 V Interrupt Rating
Volume 5 - Issue 3 - 03/13/2013
New Three-axis Digital MEMS Gyroscope; Leading-edge Precious Metal Processes for Semiconductors; Purely Sealing Your Success; Analog ASICs Copy-protected by Process; Keep an Eye on Wafer Thickness; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Prime Mover Hermetic Bellows Linear Actuators
Volume 5 - Issue 2 - 02/13/2013
LIC 4000 Encoder - Absolute position values to 1 nm; New Sensor for Wafer Thickness; High Performance MEMS G100Z Gyro - Ultra Low Noise; We've Gone 2D!; PRIME MOVER Hermetic Bellows Linear Actuators; Precision CNC and Conventional Custom Mfg.
Volume 5 - Issue 1 - 01/09/2013
Piezo Motors Nanometer-scale Precision; confocalDT Distance/Thickness Spectrometer; Thermocouples for ASM Epsilon Reactors; Large Industrial Transformers for Alternative Energy; Vacuum Chamber Experts; Transfer Valve/Insert/Door FlapVAT; Purely Sealing Your Success; Bellows Pumps and Compressors; Measure Vibration, Ultrasound, and Temperature Simultaneously; 40 Years of Quality Printed Circuit Boards
Volume 4 - Issue 12 - 12/12/2012
Oil-less Rocking Piston Lab Compressor; Wafer Cleaning - Etch, Strip, Clean, In Control.; Avoiding Semiconductor Failures; Custom Chemical Synthesis ; Rugged Ultra Low Noise Dual Axis Gyro - G200
Volume 4 - Issue 11 - 11/14/2012
STMicroelectronics L3G4200D Gyroscopes; TLC5929: 16-Ch Constant Current LED Driver; Semiconductor Leaders Reduce Processing Costs; Custom Bearings
Volume 4 - Issue 10 - 10/10/2012
New Ultra-versatile Micro Imaging Lens System ; AMOLED and MEMS Device Manufacturing; Precious Metal Plating for Semiconductor Applications; Thermocouples for ASM Epsilon Reactors; New IQ+ Vacuum Pressure Control Valves; PolySim: An ESD-Resistant Enclosure Curtain; Medical Metal Parts in as Little as Two Days!; NASA Low Outgassing Approved, UV Curable Epoxy; Logistics Helps Predict the Future of High-tech Supply Chains
Volume 4 - Issue 9 - 09/12/2012
Advanced MEMS Microphones; Fully Automated Wafer Wet Bench; Precision Analog IMU - MRM30 IMU; High-sensitivity Magnetic Field Sensor; Chillers for Semiconductor Equipment Cooling
Volume 4 - Issue 8 - 08/08/2012
The Next Level of Precision Adjustment; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Manual and Pneumatic Ball Valves; Zero Power Millimeter Sensors Using EnerChips;
Volume 4 - Issue 7 - 07/11/2012
Motorized Precision Positioners for High Vacuum /EUV; Epoxy Offers Shock and Impact Resistance; STT-MRAM Metrology Tool for 300 mm Wafers; New Zooming Single-objective Probing Microscope; Modular Cleanrooms Mean Profits; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 6 - 06/13/2012
Flexible Designs Boost Customer Productivity!; Ultra-high Purity Pump for Semiconductor Manufacturing; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Extend the Life of Your Wet Bench; Chemcassette Paper Tape: The Reel Deal; New Trap for MOCVD; Semiconductor LPCVD Silicon Nitride Film; New Magnetic Angle Sensors by MultiDimension; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 5 - 05/09/2012
New STM32 F4 Series; Get Control of Your Batch Making!; Stop Over Greasing Bearings; HEMP/EMP Filters
Volume 4 - Issue 4 - 04/11/2012
Miniaturized Positioning Stages Offer Micron-level Accuracy; confocalDT High End Spectrometer; Breakthrough Hyper-pure Silicon Finishing; Increase Heat Sink Cooling Efficiency; Wire and Electrode Feedthroughs for Photovoltaic Industry; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; SMT Rework Stations and Inspection Systems
Volume 4 - Issue 3 - 03/14/2012
Profile Thermocouples and Spike Thermocouples for Furnaces; Increase Heat Sink Cooling Efficiency; Aluminum Vacuum Chambers; Ultra Pure Rubber Seals; 200/300 mm Fully Automated Process Station; Leading Edge E-beam Technology Solutions Provider; Offshore and Domestic PCB Manufacturing at Any Volume;
Volume 4 - Issue 2 - 02/08/2012
Micromotors Speed Up PCB Assembly; M2M Application Platform Perfected; 3-axis Light Source Holder Machining Services; Air Conditioning/Refrigeration Compressors and Pressure Vessels; OLED Takes FPD to New Level; Miniature Linear Scale for Tight Spaces; Electrically Insulative Snap Cure Epoxy; New Magnetic Switches Feature High-speed, Low-power
Volume 4 - Issue 1 - 01/11/2012
New Capacitive Measurement Catalog; Reduced Footprint Batch Wafer Wet Bench; New Gamma Detector; Semiconductor Imaging Solutions; New IQ+ Vacuum Pressure Control Valves; SMT Rework Stations and Inspection Systems
Volume 3 - Issue 12 - 12/14/2011
Where Applications Demand Optimum Surface Finish; Single-element Silicon PIN Photodiodes; Extend the Life of your Wet Processing Systems; New Cryopump Remanufacturing Facility; Semiconductor LPCVD Silicon Nitride Film; CMC Offers Toll Milling
Volume 3 - Issue 11 - 11/09/2011
2SMPP MEMS Gauge Pressure Sensors; NexGen Film Frame Probers; Optimal Surface Quality During Bulk Reduction; Tightly Controlled Batch Wet Processing; Miniature Linear Scale for Tight Spaces; Semitracks Online and Public Training Courses; Vacuum Chamber Experts; Manual Wet Process and Support Tools; Semiconductor LPCVD Silicon Nitride Film
Volume 3 - Issue 10 - 10/12/2011
Using Induction Heating for Crystal Growing; Complete Automated Wet Process Solutions; Point and Shoot Microscopy; SANYO Motor Driver ICs Available; New Ultra-high Performance Multi-axis Gyro Module; Electroglas PCB Repair and Amp Service; Combined Gas Source and Distribution System; Dragline Bucket Wear Parts; Quick Curing Chemically Resistant Epoxy;
Volume 3 - Issue 9 - 09/14/2011
ADXL345 Digital iMEMS Motion Sensors; Mass Imaging Makes Semi Manufacture More Productive; Industry Leading Four to Six Week Lead Time; Automated Wet Process Systems, Fume Hoods; CLA LED Illumination Bars; Dual-in-Line Sockets RA Mounts; An ASIC Solves Your Design Challenges; Powders into Liquids
Volume 3 - Issue 8 - 08/10/2011
Point and Shoot Microscopy; Rapid Curing for Heat Sensitive Materials; Transfer Valve/Insert/Door FlapVAT; Caged Ball LM Guide Type RSR and SRS7; Semiconductor Passivation and Electropolishing
Volume 3 - Issue 7 - 07/13/2011
1-axis and 2-axis Analog Gyroscopes; Metal Liftoff and Stripping Batch Tool; How Clean Are Your Elastomer Seals?; Cable Solutions for the Semiconductor Industry; Heating Jackets and Controls; Custom Touchscreen Solutions; Titanate Nano Powders (Barium, Strontium Titanate); Hexoloy SG Silicon Carbide
Volume 3 - Issue 6 - 06/08/2011
DI Water/Nitrogen Heater and Pure Steam Generators; Buying Refurbished Equipment Yields a Greater ROI; Brush Engineered Materials Companies Are Now Materion; Extend the Life of your Wet Processing Systems; New Ultra Low Outgassing Lubricants; Non-contact Thickness Measurements; EnerChip CC with Integrated Battery Management; Etched Foil Heaters - Semiconductor and Wafers
Volume 3 - Issue 5 - 05/11/2011
1-axis and 2-axis Analog Gyroscopes; Buying Refurbished Equipment Yields a Greater ROI; RF MEMS Switch; Thickness Made Easy; Infrared Microscopev; 3-axis Light Source Holder Machining Services; Low Noise G50Z-LN High Performance MEMS Gyro; Three-Channel Signal Conditioner; Wafer Carriers in Sapphire
Volume 3 - Issue 4 - 04/13/2011
Confocal Displacement Sensor; Reduced Footprint Batch Wafer Wet Bench; Surface Metrology Performance and Value; Crystal Growing: Ambrell Induction Heating Solutions; Buying Refurbished Equipment Yields a Greater ROI; Chemical Resistant Seals; Ammonia Scrubbing in Semiconductor Manufacturing; Diffractive Optics, Micro-optics, Photonics
Volume 3 - Issue 3 - 03/09/2011
Profile and Spike Thermocouples for Furnaces; Unique Pressure sensor for Battery and Wireless Operation; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor and AMHS Installation and Maintenance Services; Ultra Low-power ADXL345 Three-axis iMEMS Digital Accelerometer; EnerChip CC with Integrated Battery Management
Volume 3 - Issue 2 - 02/09/2011
Wafer and Substrate Clean Drying; Dedicated Mask Aligner Solutions for HB-LEDs; Surface Metrology Performance and Value; Low Noise G50Z-LN High Performance MEMS Gyro; Passivation and Electropolishing for the Semiconductor Industry; Buying Refurbished Equipment Yeilds a Greater ROI; UniCond Sensors with Ultra-wide Range and Accuracy; Flexible, Thermally Conductive Epoxy; Heater and Thermal Sensors-Heaters with Sensors
Volume 3 - Issue 1 - 01/12/2011
Revolutionary Eddy Current Technology; Spin Rinse Dryers - New; High Throughput, Low-cost, Wet Processing Sytems; Dedicated Mask Aligner Solutions for HB-LEDs; The Economical Answer to Wafer Metrology; New M800 Multiparameter Transmitter With Predictive Diagnostics; Motor Insulation for Flexibility, Durability, and Stability; Diffractive Optics, Micro-optics, Photonics; RF MEMS Switch
Volume 2 - Issue 12 - 12/08/2010
Continuous Monitoring System Pays for Itself in One Year; High-temperature Memory for Harsh Environments; Affordable Wafer Shape and Thickness Tools; We Solve Your Sub-micron MEMS Automation Challenges
Volume 2 - Issue 11 - 11/10/2010
Continuous Monitoring System Pays for Itself in One Year; Profile and Spike Thermocouples for Furnaces; Low Noise G50Z-LN High Performance MEMS Gyro; IPA Dryer - Surface Tension Gradient; Three-channel Signal Conditioner; Cost-effective Production for Analog ASICs; Improved Crystal Growth with Induction Heating
Volume 2 - Issue 10 - 10/13/2010
32-bit Power Architecture Microcontrollers from Freescale; Precision Machined Components for the Semiconductor Industry; Pure Processes, Safer Solutions; Chart Recorder Replacement ROI in 1-year; Industrial Femtosecond Lasers for Micromachining; PURA High Purity Gas Dewpoint Transmitter; UniCond Sensors with Ultra-wide Range and Accuracy; MEMS Module; Multiple Automation Platforms to Meet Your Needs; RF MEMS Switch
Volume 2 - Issue 9 - 09/08/2010
TI's CSD86350Q5D Synchronous Buck NexFET Power Block; Solve Your Microelectronics Failure Analysis Challenges; Profile and Spike Thermocouples for Furnaces; Heater and Thermal Sensors-Heaters with Sensors; New Sensor for Wafer Thickness; Wafer Carriers in Sapphire; JPE Needle Valve; Vacuum Wet Process Equipment for MEMS Manufacturing
Volume 2 - Issue 8 - 08/11/2010
Compact Thermo Chiller; In-Motion Solution; OX400 Low Oxygen Concentration Analyzer; MEMS Gyro Sensors Replacing FOGs; Diffractive Optics, Micro-optics, Photonics; New Energy Efficient Tool; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 2 - Issue 7 - 07/14/2010
Calcium Fluoride (CaF2) Single Crystal; Wire and Electrode Feedthroughs for Photovoltaic Industry; 5000TOCe Smart TOC Sensor; Three-Channel Signal Conditioner; New State-of-the-Art Cooling Technology ; MIL-STD Thermal Shock Environmental Test Chambers
Volume 2 - Issue 6 - 06/09/2010
Thermocouples for ASM Epsilon Reactors; Mega ION; Laser Technology For Semiconductor Applications; RF MEMS Switch; High-speed Type SKR Actuator; JPE Ball Valve; New Sensor for Wafer Thickness
Volume 2 - Issue 5 - 05/12/2010
Microchip's PIC32 32-Bit MCU; Leading the Metal Sealing Industry; New State of the Art Cooling Technology; We Solve Your Sub-micron MEMS Automation Challenges; Don't Miss Microtech 2010 - June 21-24 - Anaheim, CA; Low Noise G50Z-LN High Performance MEMS Gyro; NEW Actuator Type GL-N; Chemical Dispense/Waste Cabinets; JPE Tube Fitting
Volume 2 - Issue 4 - 04/14/2010
Inline Metrology with the XE-3DM; Mass Imaging Makes Semi Manufacture More Productive; New Cool-ORing Active ORing Solutions; New Thermal Insulation Increases Heater Efficiency; An ASIC Resolves Your Design Challenges; World's 1st Combination Cleaner and Cleanliness Tester; Linear Technology's Ultra-tiny ADCs
Volume 2 - Issue 3 - 03/10/2010
World's 1st Combination Cleaner and Cleanliness Tester; We Make the Labyrinth Seal Specifically for You; Inline Metrology with the XE-3DM; Gyro Sensor with Low In-run bias Stability; New Accelerometer Sensors for User Interfaces; Gas Handling Systems for Semiconductor Production; Single Wafer Spray Module; Analog Devices' ADA4501 Operational Amplifiers; Thin Film - RC/RCD
Volume 2 - Issue 2 - 02/10/2010
Complete Thermal Solutions for Semiconductor Processing; Vapor Flow Control without MFCs; Analog Devices' ADXL345 MEMs Accelerometer; Thin-section Bearings: Precision with Space Savings; Reduce Pricing Pressures and Gain Global Operational Visibility; Extend the Life of your Wet Process Systems; Prototype Electronic Assembly Services; SMT Rework Stations and Inspection Systems
Volume 2 - Issue 1 - 01/13/2010
Global High Tech Summit, Feb 11/San Jose; Gain Global Operational Visibility and Reduce Pricing Pressures; Polysilicon Wafer, Ingot, and Chunk Cleaning; Understanding the Fundamental Conductivity and Resistivity of Pure Water; In-Motion Solution; Complete Device Fabrication Available; Communications Custom Cable Molding
Volume 1 - Issue 4 - 12/09/2009
MEMS Gyro Sensors Replacing FOGs; PoP Paste Indium9.88-HF; Automated, Precise, Efficient; Low Noise G50Z-LN High Performance MEMS Gyro; MEMS Foundry Leadership; RF MEMS Switch; STMicroelectronics' MEMS Gyroscopes; Thin Film - RC/RCD
Volume 1 - Issue 3 - 11/11/2009
PoP Paste Indium9.88-HF; Extend the Life of Your Wet Process Systems; Bringing Answers to the Surface; Reduce Pricing Pressures While Increasing Visibility into Global Operations; MEMS Device Fabrication; High Temperature Acoustic Measurement System; Thin Film and Silicon Wafer Supplier; Sensors for Modal Analysis Testing
Volume 1 - Issue 2 - 10/14/2009
Bringing Answers to the Surface; Vapor Flow Control without MFCs; Low Cost, High Efficiency Actuator Type VLA; Analog Devices' ADXL345 MEMS Accelerometer; Thin Film and Silicon Wafer Supplier; Cost-effective Automation; Semi-Gas Centurion Gas Cabinet
Volume 1 - Issue 1 - 09/09/2009
Low Noise G50Z-LN High Performance MEMS Gyro; Vacuum Solutions for Semiconductor Applications; High-speed Type SKR Actuator; Semiconductor Thickness - CHRocodile IT; Don't Settle - Choose Superior RF/MMIC Technologies; Film Laminations with Optical Films