Semiconductor & MEMS Fabrication News

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Description: GlobalSpec's Semiconductor & MEMS Fabrication free eNewsletter focuses on silicon-based technologies and manufacturing processes. This free email publication keeps subscribers up-to-date on the latest devices, manufacturing techniques, and applications to improve silicon-based product design, production, and testing. Product news covers microelectronic and optoelectronic devices (transistors, photo detectors, and solar cells) as well as fabrication techniques used in making chip-size motors, actuators, and other micro electrical mechanical systems.
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Industry Trends & Events . . .
Putting Two Giants Together

Putting Two Giants Together What happens when two industry pioneers merge? How easily do the cultures blend? How complementary are the skills of their engineering teams? How much do their product lines overlap? In this interview, Gregg Lowe, vice president of Texas Instruments' analog business, examines the fruits of the company's acquisition of National Semiconductor six months after it occurred. He notes that the move gives TI a foothold in Silicon Valley and an enormous new influx of sophisticated and high-performance analog products, while National can reap the benefits of an applications and sales team that has grown by an order of magnitude.

 
Now Available at Digi-Key —
STMicroelectronics LIS35DE MEMS
Motion Sensor

Digi-Key Corporation
New STM32 F4 Series at Mouser


Mouser Electronics, Inc.

Now Available at Digi-Key — STMicroelectronics LIS35DE MEMS Motion Sensor STMicroelectronics' LIS35DE is an ultra-compact low-power three axis linear accelerometer. It includes a sensing element and an IC interface able to provide the measured acceleration to the external world through I²C/SPI serial interface. Additional features include RoHS compliance, embedded high-pass filter, programmable multiple interrupt generator, and < 1 mW power consumption.

New STM32 F4 Series at Mouser STMicroelectronics STM32 F4 32-bit ARM® Cortex™-M4 MCUs extends the successful STM32 family to over 300 fully compatible part numbers bringing higher performance, DSP instructions, a floating point unit, larger SRAM, audio architecture, ultra-low-dynamic power, and 2.4 MSPS 12-bit ADCs.

Design . . .
Learn More
New Substrate Alloy Prevents Cracks in
Wafers

New Substrate Alloy Prevents Cracks in Wafers A nemesis in wafer production, uneven thermal expansion of different materials in the substrate can cause defects such as cracks. Molybdenum — commonly used in sapphire-based LED devices — has a lower thermal coefficient of expansion than sapphire. A new alloy of molybdenum and copper (MoCu) matches sapphire's thermal expansion, reducing the number of defects that can arise particularly during the bonding process.

Letting High-performance Devices Keep
Their Cool

Letting High-performance Devices Keep Their Cool In an effort to develop low-temperature processing techniques that permit high-performance devices to retain their desirable characteristics during device production, Sematech has enlisted the aid of thermal experts at Centrotherm Photovoltaics to reduce their thermal budget. One goal of the collaboration will be to facilitate the manufacture of high-mobility semiconductors as channel materials.

Materials. . .
Learn More
Like the Graphene Wasn't There

Like the Graphene Wasn't There Suppose you want to coat a surface to protect it from getting wet while not disturbing the surface material's characteristic wetting properties. These researchers found — much to their surprise — that a layer of graphene, despite being totally impermeable, doesn't change the wetting of gold, copper, or silicon. The discovery may lead to a new generation of flexible electronic devices.

Here Come Graphene Semiconductors

Here Come Graphene Semiconductors Since the discovery of graphene, researchers have been falling all over themselves to identify practical applications. It won't be long now. It turns out that graphene monoxide exhibits the properties of a semiconductor impressive enough to suggest that it might eventually replace silicon as the primary semiconductor material. The next step aims to scale up making the material to production levels.

 
Get Control of Your Batch Making!
Novaflow Systems, Inc.
VR Solves Class III RoHS Soldering
VR Industries, Inc.

Get Control of Your Batch Making! Are you struggling to increase production, reduce QC times, reduce your direct labor costs, improve your product consistency, clean up your batching process? If you answer yes to any of these questions, an automated dispensing system may offer the solution.

Check out before and after. Visit www.novaflow.com for more.

VR Solves Class III RoHS Soldering A significant challenge in the defense industry is using leaded solder paste with RoHS components. The most severe challenge comes when using leaded solder paste and a RoHS BGA. VR Industries has overcome this challenge by developing specific processes and inspection capabilities in response to this unique defense industry requirement.

Test & Measurement . . .
Learn More
The "on" and "off" of Testing Power
Semiconductors

The 'on' and 'off' of Testing Power Semiconductors
Testing power semiconductors presents unique challenges. The steps to a solution include selecting instruments optimized for the task, and cabling and fixturing them carefully to prevent signal loss. Yet as discussed in this comprehensive white paper, you may already have some of the equipment you need. For example, testing most power devices requires high power at only one or two terminals. Your low-voltage power supplies can handle the rest.

Testing the Core of the System
 

Testing the Core of the System How do you test a complex device like a microprocessor core that must be "ready for anything" in the final product? A device integrator shouldn't have to wonder whether the core will perform properly. This author presents some strategies that can provide a reliable test strategy without compromising the design flexibility that customers expect.

Applications & Commercialization . . .
Learn More
Nanotechnology Produces High-yield Solar
Cells

Nanotechnology Produces High-yield Solar Cells Looking at another "revolutionary" use for nanotechnology, researchers at Rice University have announced that a fabrication process invented at Rice for producing arrays of single walled carbon nanotubes could soon lead to more efficient and less expensive dye-sensitized solar cells. The nanotubes would replace the platinum electrodes in the current crop of these cells.

Electromechanical Relays — the Past
Becomes the Future

Electromechanical Relays — the Past Becomes the Future In the never-ending search to reduce the power required to run electronic devices, one solution appears to have been with us all along. Electromechanical relays went out of fashion years ago because they couldn't cope with even vacuum-tube-based electronics. Now it turns out that existing CMOS manufacturing processes can adapt to making "nanorelays" — not as fast as the solid-state variety, but much less power-hungry.

 
Stop Over Greasing Bearings
SDT Ultrasound Solutions
HEMP/EMP Filters
Captor Corporation

Stop Over Greasing Bearings Your bearings tell you when they need grease but can you listen? The SDT270 LubeTech Kit heads the warning at an ultrasonic level, telling you when to grease and when to stop. Also perform air leak, electrical, steam, valve, gearbox, bearing, and tightness inspections. Get SDT... hear more.

HEMP/EMP Filters Meet or exceed the MIL-STD-188-125-1 requirements with Captor Corporation's HEMP/EMP Filters. We can provide custom tailoring for your unique application or accommodate existing applications such as AC/DC power, telephone lines, analog fire alarms, servo motors, and synchro transmitters. Visit us here to access drawings, electrical ratings, and PCI-HEMP Parameters.

Indium Corporation Webinar: Indium Corporation Webinar:  Alternative Soldering Alloys for Electronics Manufacturing — May 15, 2012
Alternative Soldering Alloys for Electronics Manufacturing — May 15, 2012

Indium Corporation Webinar:  Alternative Soldering Alloys for Electronics Manufacturing — May 15, 2012 On May 15, Indium Corporation will present "Alternative Soldering Alloys for Electronics Manufacturing". Join your peers for this free, informative, and interactive ONLINE webinar — right from the convenience of your desktop.

Learn about today's Pb-free soldering challenges, alternative Pb-free alloys, the future direction of the industry and more. Register today!

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May 9, 2012 - Volume 4 Issue 5
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Archives
Past Issues of this eNewsletter
Volume 6 - Issue 4 - 04/09/2014
New Low Power MEMS Accelerometer; Thermocouples for ASM Epsilon Reactors; We Move the World; Custom Manufacturing of Silicon Substrates and Optical Components; Temperature Control Experts in Semi Compliance; Speed Up Your Project Timeline with Designs Reference Design Library; Actually It IS Easy Being Green; Allegro Position Sensor ICs; Sensors for Extremely High-resolution Solutions; New InGaAs and Silicon Avalanche Photodiodes
Volume 6 - Issue 3 - 03/12/2014
Custom Rotary Sealing Solutions; Improved Metal Lift-off Performance!; Innovative, Single-chip MEMS Oscillator Evaluation Kit; Despatch LCC Ovens for Semiconductor Manufacturing ; Example of Robust Pressure Switch Offering; PRIME MOVER Hermetic Bellows Linear Actuators
Volume 6 - Issue 2 - 02/12/2014
High-Res Inspection Microscope for Large Sensors; Sealing Solutions for Critical Semicon Applications; ETEL's LMS Ironcore Linear Motor Series Limits Thermal Drift; All the Right Moves for Ultimate Precision; RF Transistor - NPN, 12 V, 8 GHZ; Allegro Position Sensor ICs; G-Band Transmitters - Cutting Edge Performance
Volume 6 - Issue 1 - 01/08/2014
Temperature Control Experts in Semi Compliance; LIC 4000 Encoder - Absolute position values to 1 nm; LIP 400 Advances Vacuum Encoder Technology; New IQ+ Vacuum Pressure Control Valves; New MEMS Thermal Sensors; Purely Sealing Your Success; Imaging in Space and Aerial Reconnaisance; Micron RLDRAM Memory; Extreme High-performance MEMS Aerospace Accelerometers
Volume 5 - Issue 12 - 12/11/2013
MEMS Foundry Service; Extended Seal Life Comes as Standard; UV-enhanced Planar Diffused Photodiodes; AMS-IRKT250-16 Dual Thyristors; PRIME MOVER Hermetic Bellows Linear Actuators; G-Band Transmitters - Cutting Edge Performance
Volume 5 - Issue 11 - 11/13/2013
Revolutionary Eddy Current Technology; Purity is the Key to Efficiency; Universal Swivel Bulkhead Fittings; Ovens for Semiconductor Manufacturing; Vacuum Valves...New N-Series; All the Right Moves for Ultimate Precision; Avoiding Semiconductor Failures; Rotary Feedthrough; How-to Guide for Understanding Fluid Chillers; SC TruStability Board Mount Pressure Sensors; 1.5 uA Ultra-low Power TMR Magnetic Switches
Volume 5 - Issue 10 - 10/09/2013
Extremely Compact Brushless DC Servo Motors; New MEMS Motion Sensor; Looking to Increase Your Wafer Yield?; New Avalanche Photodiodes; MIC 6 Aluminum Cast Plate - The Best of the Best; LIC 4000 Encoder - Absolute Position Values to 1 nm; Vacuum Products Catalog; Valuable Partner for Semiconductor Industry; Cost-effective Alternative to Automated Wafer Inspection Systems; Rotary Feedthrough; New Mechanical Lift Table
Volume 5 - Issue 9 - 09/11/2013
Temperature Control Experts in Semi Compliance; Semiconductor and MEMS Device Manufacturing; Simplify Your Liquid Cooling System; All the Right Moves for Ultimate Precision; Ultra Low Outgassing Lubricants; PIC24F: Low-power 16-bit MCUs; Keep an Eye on Wafer Thickness; Rotary Feedthrough
Volume 5 - Issue 8 - 08/14/2013
Innovative, Single-chip MEMS Oscillator Evaluation Kit; Built for the Highest Levels of Efficiency; High Temperature Vacuum Sensing Manometers; Vacuum Sealing and Throttling Butterfly Valve; Simplify Your Liquid Cooling System; Keep an Eye on Wafer Thickness; PRIME MOVER Hermetic Bellows Linear Actuators; Companies Worldwide Taking Advantage of the Accumeasure Systems
Volume 5 - Issue 7 - 07/10/2013
Single-chip MEMS Oscillator Architecture; Joining Forces to Fuel M2M Innovation; PRIME MOVER Hermetic Bellows Linear Actuators; Need a JEDEC Tray for Your New Device Fast?; Vacuum Sealing and Throttling Butterfly Valve; Need a Smaller and Lighter Control Cable?; Simplify Your Liquid Cooling System
Volume 5 - Issue 6 - 06/12/2013
Materials and Technology for Semiconductor Manufacturing; Rotary Systems Provides Rotary Unions for the Asian Market ; THK Caged Ball LM Guide Type RSR and SRS7 ; Need a JEDEC Tray for Your New Device Fast?; LIC 4000 Encoder - Absolute Position Values to 1 nm; Lower Machine Costs and Increase Efficiency; Semi-ceramics Are Us!; PIC24F: Low-power 16-bit MCUs; PRIME MOVER Hermetic Bellows Linear Actuators; TMR Gear Tooth Sensors
Volume 5 - Issue 5 - 05/08/2013
Microcircuit Materials - Large Batch Electronics Grade; Tiny MEMS Pressure/Vacuum Sensor Coming Soon!; Companies Worldwide Taking Advantage of the Accumeasure Systems; Titanate Nano Powders (Barium, Strontium Titanate); Bellows Pumps and Compressors; Hexoloy SG Silicon Carbide
Volume 5 - Issue 4 - 04/10/2013
New Capacitive Measurement Catalog; Wire and Electrode Feedthroughs for Photovoltaic Industry; New Xtrinsic Accelerometers; Apiezon Launches PFPE High Temperature Lubricating Vacuum Grease; New IQ+ Vacuum Pressure Control Valves; Purely Sealing Your Success; PRIME MOVER Hermetic Bellows Linear Actuators; Integrate Micro-imaging Quickly and Easily; Nano-precision Positioners/Aligners Up to Six Axes; Surface Mount Fuses with 72 V Interrupt Rating
Volume 5 - Issue 3 - 03/13/2013
New Three-axis Digital MEMS Gyroscope; Leading-edge Precious Metal Processes for Semiconductors; Purely Sealing Your Success; Analog ASICs Copy-protected by Process; Keep an Eye on Wafer Thickness; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Prime Mover Hermetic Bellows Linear Actuators
Volume 5 - Issue 2 - 02/13/2013
LIC 4000 Encoder - Absolute position values to 1 nm; New Sensor for Wafer Thickness; High Performance MEMS G100Z Gyro - Ultra Low Noise; We've Gone 2D!; PRIME MOVER Hermetic Bellows Linear Actuators; Precision CNC and Conventional Custom Mfg.
Volume 5 - Issue 1 - 01/09/2013
Piezo Motors Nanometer-scale Precision; confocalDT Distance/Thickness Spectrometer; Thermocouples for ASM Epsilon Reactors; Large Industrial Transformers for Alternative Energy; Vacuum Chamber Experts; Transfer Valve/Insert/Door FlapVAT; Purely Sealing Your Success; Bellows Pumps and Compressors; Measure Vibration, Ultrasound, and Temperature Simultaneously; 40 Years of Quality Printed Circuit Boards
Volume 4 - Issue 12 - 12/12/2012
Oil-less Rocking Piston Lab Compressor; Wafer Cleaning - Etch, Strip, Clean, In Control.; Avoiding Semiconductor Failures; Custom Chemical Synthesis ; Rugged Ultra Low Noise Dual Axis Gyro - G200
Volume 4 - Issue 11 - 11/14/2012
STMicroelectronics L3G4200D Gyroscopes; TLC5929: 16-Ch Constant Current LED Driver; Semiconductor Leaders Reduce Processing Costs; Custom Bearings
Volume 4 - Issue 10 - 10/10/2012
New Ultra-versatile Micro Imaging Lens System ; AMOLED and MEMS Device Manufacturing; Precious Metal Plating for Semiconductor Applications; Thermocouples for ASM Epsilon Reactors; New IQ+ Vacuum Pressure Control Valves; PolySim: An ESD-Resistant Enclosure Curtain; Medical Metal Parts in as Little as Two Days!; NASA Low Outgassing Approved, UV Curable Epoxy; Logistics Helps Predict the Future of High-tech Supply Chains
Volume 4 - Issue 9 - 09/12/2012
Advanced MEMS Microphones; Fully Automated Wafer Wet Bench; Precision Analog IMU - MRM30 IMU; High-sensitivity Magnetic Field Sensor; Chillers for Semiconductor Equipment Cooling
Volume 4 - Issue 8 - 08/08/2012
The Next Level of Precision Adjustment; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Manual and Pneumatic Ball Valves; Zero Power Millimeter Sensors Using EnerChips;
Volume 4 - Issue 7 - 07/11/2012
Motorized Precision Positioners for High Vacuum /EUV; Epoxy Offers Shock and Impact Resistance; STT-MRAM Metrology Tool for 300 mm Wafers; New Zooming Single-objective Probing Microscope; Modular Cleanrooms Mean Profits; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 6 - 06/13/2012
Flexible Designs Boost Customer Productivity!; Ultra-high Purity Pump for Semiconductor Manufacturing; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; Extend the Life of Your Wet Bench; Chemcassette Paper Tape: The Reel Deal; New Trap for MOCVD; Semiconductor LPCVD Silicon Nitride Film; New Magnetic Angle Sensors by MultiDimension; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 4 - Issue 5 - 05/09/2012
New STM32 F4 Series; Get Control of Your Batch Making!; Stop Over Greasing Bearings; HEMP/EMP Filters
Volume 4 - Issue 4 - 04/11/2012
Miniaturized Positioning Stages Offer Micron-level Accuracy; confocalDT High End Spectrometer; Breakthrough Hyper-pure Silicon Finishing; Increase Heat Sink Cooling Efficiency; Wire and Electrode Feedthroughs for Photovoltaic Industry; Compact Vortex Meters for Flow, Temperature, and Pressure Measurement; SMT Rework Stations and Inspection Systems
Volume 4 - Issue 3 - 03/14/2012
Profile Thermocouples and Spike Thermocouples for Furnaces; Increase Heat Sink Cooling Efficiency; Aluminum Vacuum Chambers; Ultra Pure Rubber Seals; 200/300 mm Fully Automated Process Station; Leading Edge E-beam Technology Solutions Provider; Offshore and Domestic PCB Manufacturing at Any Volume;
Volume 4 - Issue 2 - 02/08/2012
Micromotors Speed Up PCB Assembly; M2M Application Platform Perfected; 3-axis Light Source Holder Machining Services; Air Conditioning/Refrigeration Compressors and Pressure Vessels; OLED Takes FPD to New Level; Miniature Linear Scale for Tight Spaces; Electrically Insulative Snap Cure Epoxy; New Magnetic Switches Feature High-speed, Low-power
Volume 4 - Issue 1 - 01/11/2012
New Capacitive Measurement Catalog; Reduced Footprint Batch Wafer Wet Bench; New Gamma Detector; Semiconductor Imaging Solutions; New IQ+ Vacuum Pressure Control Valves; SMT Rework Stations and Inspection Systems
Volume 3 - Issue 12 - 12/14/2011
Where Applications Demand Optimum Surface Finish; Single-element Silicon PIN Photodiodes; Extend the Life of your Wet Processing Systems; New Cryopump Remanufacturing Facility; Semiconductor LPCVD Silicon Nitride Film; CMC Offers Toll Milling
Volume 3 - Issue 11 - 11/09/2011
2SMPP MEMS Gauge Pressure Sensors; NexGen Film Frame Probers; Optimal Surface Quality During Bulk Reduction; Tightly Controlled Batch Wet Processing; Miniature Linear Scale for Tight Spaces; Semitracks Online and Public Training Courses; Vacuum Chamber Experts; Manual Wet Process and Support Tools; Semiconductor LPCVD Silicon Nitride Film
Volume 3 - Issue 10 - 10/12/2011
Using Induction Heating for Crystal Growing; Complete Automated Wet Process Solutions; Point and Shoot Microscopy; SANYO Motor Driver ICs Available; New Ultra-high Performance Multi-axis Gyro Module; Electroglas PCB Repair and Amp Service; Combined Gas Source and Distribution System; Dragline Bucket Wear Parts; Quick Curing Chemically Resistant Epoxy;
Volume 3 - Issue 9 - 09/14/2011
ADXL345 Digital iMEMS Motion Sensors; Mass Imaging Makes Semi Manufacture More Productive; Industry Leading Four to Six Week Lead Time; Automated Wet Process Systems, Fume Hoods; CLA LED Illumination Bars; Dual-in-Line Sockets RA Mounts; An ASIC Solves Your Design Challenges; Powders into Liquids
Volume 3 - Issue 8 - 08/10/2011
Point and Shoot Microscopy; Rapid Curing for Heat Sensitive Materials; Transfer Valve/Insert/Door FlapVAT; Caged Ball LM Guide Type RSR and SRS7; Semiconductor Passivation and Electropolishing
Volume 3 - Issue 7 - 07/13/2011
1-axis and 2-axis Analog Gyroscopes; Metal Liftoff and Stripping Batch Tool; How Clean Are Your Elastomer Seals?; Cable Solutions for the Semiconductor Industry; Heating Jackets and Controls; Custom Touchscreen Solutions; Titanate Nano Powders (Barium, Strontium Titanate); Hexoloy SG Silicon Carbide
Volume 3 - Issue 6 - 06/08/2011
DI Water/Nitrogen Heater and Pure Steam Generators; Buying Refurbished Equipment Yields a Greater ROI; Brush Engineered Materials Companies Are Now Materion; Extend the Life of your Wet Processing Systems; New Ultra Low Outgassing Lubricants; Non-contact Thickness Measurements; EnerChip CC with Integrated Battery Management; Etched Foil Heaters - Semiconductor and Wafers
Volume 3 - Issue 5 - 05/11/2011
1-axis and 2-axis Analog Gyroscopes; Buying Refurbished Equipment Yields a Greater ROI; RF MEMS Switch; Thickness Made Easy; Infrared Microscopev; 3-axis Light Source Holder Machining Services; Low Noise G50Z-LN High Performance MEMS Gyro; Three-Channel Signal Conditioner; Wafer Carriers in Sapphire
Volume 3 - Issue 4 - 04/13/2011
Confocal Displacement Sensor; Reduced Footprint Batch Wafer Wet Bench; Surface Metrology Performance and Value; Crystal Growing: Ambrell Induction Heating Solutions; Buying Refurbished Equipment Yields a Greater ROI; Chemical Resistant Seals; Ammonia Scrubbing in Semiconductor Manufacturing; Diffractive Optics, Micro-optics, Photonics
Volume 3 - Issue 3 - 03/09/2011
Profile and Spike Thermocouples for Furnaces; Unique Pressure sensor for Battery and Wireless Operation; Titanate Nano Powders (Barium, Strontium Titanate); Semiconductor and AMHS Installation and Maintenance Services; Ultra Low-power ADXL345 Three-axis iMEMS Digital Accelerometer; EnerChip CC with Integrated Battery Management
Volume 3 - Issue 2 - 02/09/2011
Wafer and Substrate Clean Drying; Dedicated Mask Aligner Solutions for HB-LEDs; Surface Metrology Performance and Value; Low Noise G50Z-LN High Performance MEMS Gyro; Passivation and Electropolishing for the Semiconductor Industry; Buying Refurbished Equipment Yeilds a Greater ROI; UniCond Sensors with Ultra-wide Range and Accuracy; Flexible, Thermally Conductive Epoxy; Heater and Thermal Sensors-Heaters with Sensors
Volume 3 - Issue 1 - 01/12/2011
Revolutionary Eddy Current Technology; Spin Rinse Dryers - New; High Throughput, Low-cost, Wet Processing Sytems; Dedicated Mask Aligner Solutions for HB-LEDs; The Economical Answer to Wafer Metrology; New M800 Multiparameter Transmitter With Predictive Diagnostics; Motor Insulation for Flexibility, Durability, and Stability; Diffractive Optics, Micro-optics, Photonics; RF MEMS Switch
Volume 2 - Issue 12 - 12/08/2010
Continuous Monitoring System Pays for Itself in One Year; High-temperature Memory for Harsh Environments; Affordable Wafer Shape and Thickness Tools; We Solve Your Sub-micron MEMS Automation Challenges
Volume 2 - Issue 11 - 11/10/2010
Continuous Monitoring System Pays for Itself in One Year; Profile and Spike Thermocouples for Furnaces; Low Noise G50Z-LN High Performance MEMS Gyro; IPA Dryer - Surface Tension Gradient; Three-channel Signal Conditioner; Cost-effective Production for Analog ASICs; Improved Crystal Growth with Induction Heating
Volume 2 - Issue 10 - 10/13/2010
32-bit Power Architecture Microcontrollers from Freescale; Precision Machined Components for the Semiconductor Industry; Pure Processes, Safer Solutions; Chart Recorder Replacement ROI in 1-year; Industrial Femtosecond Lasers for Micromachining; PURA High Purity Gas Dewpoint Transmitter; UniCond Sensors with Ultra-wide Range and Accuracy; MEMS Module; Multiple Automation Platforms to Meet Your Needs; RF MEMS Switch
Volume 2 - Issue 9 - 09/08/2010
TI's CSD86350Q5D Synchronous Buck NexFET Power Block; Solve Your Microelectronics Failure Analysis Challenges; Profile and Spike Thermocouples for Furnaces; Heater and Thermal Sensors-Heaters with Sensors; New Sensor for Wafer Thickness; Wafer Carriers in Sapphire; JPE Needle Valve; Vacuum Wet Process Equipment for MEMS Manufacturing
Volume 2 - Issue 8 - 08/11/2010
Compact Thermo Chiller; In-Motion Solution; OX400 Low Oxygen Concentration Analyzer; MEMS Gyro Sensors Replacing FOGs; Diffractive Optics, Micro-optics, Photonics; New Energy Efficient Tool; Low Noise G50Z-LN High Performance MEMS Gyro
Volume 2 - Issue 7 - 07/14/2010
Calcium Fluoride (CaF2) Single Crystal; Wire and Electrode Feedthroughs for Photovoltaic Industry; 5000TOCe Smart TOC Sensor; Three-Channel Signal Conditioner; New State-of-the-Art Cooling Technology ; MIL-STD Thermal Shock Environmental Test Chambers
Volume 2 - Issue 6 - 06/09/2010
Thermocouples for ASM Epsilon Reactors; Mega ION; Laser Technology For Semiconductor Applications; RF MEMS Switch; High-speed Type SKR Actuator; JPE Ball Valve; New Sensor for Wafer Thickness
Volume 2 - Issue 5 - 05/12/2010
Microchip's PIC32 32-Bit MCU; Leading the Metal Sealing Industry; New State of the Art Cooling Technology; We Solve Your Sub-micron MEMS Automation Challenges; Don't Miss Microtech 2010 - June 21-24 - Anaheim, CA; Low Noise G50Z-LN High Performance MEMS Gyro; NEW Actuator Type GL-N; Chemical Dispense/Waste Cabinets; JPE Tube Fitting
Volume 2 - Issue 4 - 04/14/2010
Inline Metrology with the XE-3DM; Mass Imaging Makes Semi Manufacture More Productive; New Cool-ORing Active ORing Solutions; New Thermal Insulation Increases Heater Efficiency; An ASIC Resolves Your Design Challenges; World's 1st Combination Cleaner and Cleanliness Tester; Linear Technology's Ultra-tiny ADCs
Volume 2 - Issue 3 - 03/10/2010
World's 1st Combination Cleaner and Cleanliness Tester; We Make the Labyrinth Seal Specifically for You; Inline Metrology with the XE-3DM; Gyro Sensor with Low In-run bias Stability; New Accelerometer Sensors for User Interfaces; Gas Handling Systems for Semiconductor Production; Single Wafer Spray Module; Analog Devices' ADA4501 Operational Amplifiers; Thin Film - RC/RCD
Volume 2 - Issue 2 - 02/10/2010
Complete Thermal Solutions for Semiconductor Processing; Vapor Flow Control without MFCs; Analog Devices' ADXL345 MEMs Accelerometer; Thin-section Bearings: Precision with Space Savings; Reduce Pricing Pressures and Gain Global Operational Visibility; Extend the Life of your Wet Process Systems; Prototype Electronic Assembly Services; SMT Rework Stations and Inspection Systems
Volume 2 - Issue 1 - 01/13/2010
Global High Tech Summit, Feb 11/San Jose; Gain Global Operational Visibility and Reduce Pricing Pressures; Polysilicon Wafer, Ingot, and Chunk Cleaning; Understanding the Fundamental Conductivity and Resistivity of Pure Water; In-Motion Solution; Complete Device Fabrication Available; Communications Custom Cable Molding
Volume 1 - Issue 4 - 12/09/2009
MEMS Gyro Sensors Replacing FOGs; PoP Paste Indium9.88-HF; Automated, Precise, Efficient; Low Noise G50Z-LN High Performance MEMS Gyro; MEMS Foundry Leadership; RF MEMS Switch; STMicroelectronics' MEMS Gyroscopes; Thin Film - RC/RCD
Volume 1 - Issue 3 - 11/11/2009
PoP Paste Indium9.88-HF; Extend the Life of Your Wet Process Systems; Bringing Answers to the Surface; Reduce Pricing Pressures While Increasing Visibility into Global Operations; MEMS Device Fabrication; High Temperature Acoustic Measurement System; Thin Film and Silicon Wafer Supplier; Sensors for Modal Analysis Testing
Volume 1 - Issue 2 - 10/14/2009
Bringing Answers to the Surface; Vapor Flow Control without MFCs; Low Cost, High Efficiency Actuator Type VLA; Analog Devices' ADXL345 MEMS Accelerometer; Thin Film and Silicon Wafer Supplier; Cost-effective Automation; Semi-Gas Centurion Gas Cabinet
Volume 1 - Issue 1 - 09/09/2009
Low Noise G50Z-LN High Performance MEMS Gyro; Vacuum Solutions for Semiconductor Applications; High-speed Type SKR Actuator; Semiconductor Thickness - CHRocodile IT; Don't Settle - Choose Superior RF/MMIC Technologies; Film Laminations with Optical Films