Syagrus Systems' fully automated wafer dicing systems consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems they know that a good wafer dicing process sets the pace for all remaining operations. With a large variety of dicing blades in stock, we can optimize the wafer dicing process to achieve optimal yields for your critical devices. We take pride in performing customized wafer dicing services for our customer base. No job is too small or too large for Syagrus Systems. Their wafer dicing systems are flexible enough to accommodate multi die or "pizza mask" wafers, as well as high volume programs.

They can even perform wafer dicing operations on previously singulated multi die reticles and partial wafers. To achieve the highest quality wafer dicing available, double pass cutting is our standard practice. We successfully dice wafers as thin as .100mm (.004") and up to 200mm (8.0") diameter. Syagrus Systems is continually trusted by some of the leading military and medical device manufactures for delivering defect free die, packed and prepared for automated assembly operations.

Syagrus Systems' Wafer Dicing Services Offer:

• Same day cycle time available.
• .250" to 8" flexible dicing workspace capable of sawing multi die reticles.
• Singulated devices as small as .010".
• Wafers as thin as .100 mm (.004").
• Both bumped and non-bumped wafer dicing.
• Large variety of dicing blades and tapes in stock to handle all customer requirements.
• Surfactant available.
• Return shipment on saw frame, stretch rings, or continue to inspection and die sort.
• Class 10k cleanroom environment.
• Use our technical staff for your engineering and prototype runs, such as multi die or "pizza mask" wafers.

The BLACKSTAR™ Series is a silicon dicing system utilizing a basic Fantom Laser Dicing Technology™ (FLDT™) invented and patented by Fonon Technology modified to accommodate the requirements of a composite wafer or PCB singulation process without affecting the existent dicing method, processes and procedures.

PCBs and Wafers have the highest value at the dicing stage and are the primary focus of the BlackStar™ Series. The goal is to increase the number of dies, yield per wafer, and to maximize throughput while minimizing the HAZ specifically for "power hungry" RF micro devices and low-K wafer substrates. System is applicable for dicing of assorted semiconductor materials such as printed circuit boards, ceramic tiles consisting of alumina oxide, zirconia oxide, silicon carbide and silicon nitride.

The BlackStar™ Series is an alternative to mechanical saws too damaging and costly for cutting of thin and complex silicon substrates, ceramic material and composites.

Significant Advantages of Fonon DSS Dicing & Separation Systems

Minimal material loss means more parts per Wafer/PCB. The capability of a 50-micron width allows WAfer/PCB layout designers to reduce the width of the spacing between adjacent die on a Wafer/PCB. The spacing is normally reserved to allow for the width of the saw used to cut the Wafer/PCB. A reduction of the spacing width will result in an increase of the real estate available for die, which will result in a significant reduction of the cost per die.

Reduced Heat Affected Zone (HAZ). Fonon DSS method eliminates excessive thermal distortion of a conventional laser dicing and complexity of water jet. It is performing "cold laser cutting" with multiplied energy per pulse leading to the increased throughput with significantly reduces heat damage to the structure.

The elimination of wear items and consumables such as saw blades and scribes and the increased reliability associated with non-contact cutting versus a mechanical process, greatly decreases the cost of ownership of the equipment for the end-user. Enables high-yield dicing and scribing of new materials, complicated layer stacks, and thin WAfers/PCBs including low-k dielectric substrates with brittle material layers.

Higher yield for thin Wafers/PCBs. Dicing thin composite with high mechanical integrity and no chips.

• No micro-cracks, fragmentation or chipping even for composite below 100μm thick.
• Dicing PCBs with thick polymer layers such as PCB scale packages and alpha barriers.
• High precision allows for smaller street width.
• Minimized Heat Affected Zone (HAZ).
• Overall increase in speed and efficiency over the conventional mechanical and laser dicing solutions
• In double laser configuration dicing PCBs with glass on composite

BlackStar™ Series - Wafer Dicing

New & Unique Features:

• System is equipped with a new patented technology based on FLDT™ and i-Series fiber laser head especially designed for dicing semiconductor materials.
• The laser emits a specific frequency and operates in a special mode that enhances the wafer separation process.
• Laser auto focus mechanism (Optional).
• Adjustable Loading and Unloading positions for in-line integration.
• Remote Internet monitoring and diagnostics.
• Cuts on film for "Stretch and Remove" technology.
• Maintenance free optical path.
• Customized Hold Down Fixtures
• Touch screen interface.
• No need for cooling system.
• Provides multiple functions: Scribing, Dicing, Inspection, Measurement

Process Capabilities:

• Maximum stroke 450 x 330 mm.
• Capable of dicing wafers in frames up to 12".
• Frame: Standard frame types (5", 6", 8", or 12")
• Holding tape: standard low tack, thermal, or UV. (Tape-less option available for some substrates)
• Generates no chips or wafer particles
• Does not overheat the wafer surface; no long term edge microfracturing
• Ability to handle the miniature substrates and micro displays

Advantages for Users

• Low cost solution for precision wafer dicing. Priced the same as or less than precision mechanical scribers.
• Reduced training level requirements for operators
• Small footprint
• Modular design utilizes standard components for easier service.
• Produces wafer 3 to 5 times mechanically stronger without additional edge processing
• "Plug-n-play" characteristics give the system ease of installation and quick start-up times.

BlackStar™ Series - PCB Dicing

New & Unique Features:

• System is equipped with a new-patented technology based on FLDT ™ and i-Series Fiber or CO2 Laser head especially designed for dicing semiconductor materials.
• The laser emits a specific frequency and operates in a special mode that enhances the PCB separation process.
• Laser auto focus mechanism (Optional).
• Adjustable Loading and Unloading positions for in-line integration.
• Remote Internet monitoring and diagnostics.
• Cuts on film for "Stretch and Remove" technology.
• Maintenance free optical path.
• Customized Hold Down Fixtures
• Touch screen interface.
• No need for cooling system.
• Provides multiple functions: Scribing, Dicing, Inspection, Measurement

Process Capabilities:

• Maximum stroke 300 x 300 mm.
• Capable of dicing wafers in frames up to 12".
• Frame: Standard frame types (5", 6", 8", or 12")
• Holding tape: standard low tack, thermal, or UV. (Tape-less option available for some substrates)
• Generates no chips or PCB particles
• Does not overheat the PCB surface; no long term edge micro fracturing
• Ability to handle the miniature substrates and micro displays

Advantages for Users:

• Low cost solution for precision PCB dicing. Priced the same as or less than precision mechanical scribers.
• Reduced training level requirements for operators
• Small footprint
• Modular design utilizes standard components for easier service.
• Produces PCB 3 to 5 times mechanically stronger without additional edge processing
• "Plug-n-play" characteristics give the system ease of installation and quick start-up times.
• Internet ready with remote monitoring and diagnostics

Two basic systems are offered:

Model 5200 is a compact semi-automatic system for substrates up to 4" x 4" x 3/4" thick. It has a manual indexing Y-stage and a 360-degree theta stage.

Model 5255 is a fully programmable system for cutting substrates as large as 6" x 6" x 1" thick in production quantities. It has menu-driven software and indexing in steps of .0001".

Dimensions: 7.0mm x 5.2mm x 3.8mm

Dice material: AlGalnP

Lens color: red diffused

Emission color: red

Forward woltage (Min/Typ): 1.7V/2.0V (IF=20mA)

Dominant wavelength (Typ): 624 nm (IF=20mA)

Luminous intensity (Typ): 700 mcd (IF=20mA)

Reverse current: 10 uA

Degree: 70/35 deg.C

Dice material: InGaN

Lens color: water clear

Emission color: warm white

Forward voltage: 2.8V or 3.6V (IF=20mA)

Dominant wavelength: 0.428, 0.409nm (IF=20mA)

Luminous intensity: 18,0000mcd (IF=20mA)

Reverse current: 10μA

Dimension: 5mm

Laser Services is a full-service laser house providing a wide variety of materials-processing services. With a fully equipped facility—including 25 modern CNC CO₂ and YAG lasers— and over 40 trained professionals, we are your resource for laser scribing, etching, drilling, cutting and welding.

We can work with a wide variety of materials:

· Microelectronic ceramic substrates

· Metals

· Silicon wafers

· Adhesive preforms

· Glass

· Plastic

· Rubber

· Wood

· Paper and more...

We promise quality and speed, and we proudly accept any challenge. In addition to fast turnaround of standard items, we also offer application engineering support during the development stage of your products. Plus, when jobs call for turnkey service, we also provide a variety of material finishing processes, as well as ceramic dicing/lapping.