Thin Film Equipment

Equipment utilized to deposit thin films or modify the composition of a surface; e.g., through ion implantation or a nitriding or carburizing diffusion process.

MEMS processing equipment is used to create micro-electro-mechanical systems (MEMS) sensors and wafers.
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Semiconductor cluster tools and equipment are used to process semiconductor wafers for the production of microelectronic components.
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Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.  
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Thin film equipment uses vacuum processing for the modification of surfaces using CVD, PVD, plasma etching, and thermal oxidation or ion implantation.
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Thin film monitors are used to analyze and/or control thin film deposition rate, composition and properties.
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Thin film sources consist of magnetrons, evaporation thermal units, ion beams and other sources that produce deposition materials (vapors or ions) in a thin film system.
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