An automated atomic force microscopy (AFM) tool designed for photomask applications, the Dimension X3D provides comprehensive profile and critical dimension (CD) metrics for a variety of materials, including chrome, quartz, MoSi, and photoresist. The high-resolution, nondestructive CD-AFM system is insensitive to material properties and provides repeatable measurements for multiple mask generations. The tool gathers detailed information for CD elements, including lines and spaces, line and space depth, hole CD and depth, sidewall angle on vertical and reentrant profiles, linewidth variability (line edge roughness), and sidewall roughness. Nanoscope software provides quick, simple recipe setup for a variety of complex measurements. The MeRiT MG E-beam system repairs binary and phase-shift photomasks. The tool is suitable for next-generation lithography, including extreme ultraviolet (EUV), electron projection, and low-energy E-beam proximity projection lithography. It can repair opaque and clear defects on photomasks and be customized to deposit several materials, including SiO . The instrument has a high-resolution Gemini E-beam column featuring low-voltage operation and a variable-pressure mode. A five-channel gas supply provides gaseous, liquid, and solid precursors, enabling deposition and etching. The tool can treat a range of materials, including quartz in phase-shift bumps; molybdenum silicide, an attenuator for 193-nm wavelength applications; molybdenum/silicon multilayer stacks for EUV masks; and tantalum nitride, an absorber for
Products & Services
Semiconductor Metrology Instruments
Semiconductor metrology instruments are designed for wafer and thin film in-line inspection after semiconductor processing. They include capacitance gages, C-V systems, electron beam probes, ellipsometers, interferometers, I-V system, magnetometers, optical systems, profilometers, reflectometers, resistance probes, RHEED systems, and X-ray diffractometers.
Photolithography Services
Photolithography services create photomasks and use them to etch or engrave patterns on semiconductor substrates.
Nanomaterials
Nanomaterials have features or particle sizes in the range of 1 to 100 nm.
Electron Beam Welding Services
Electron beam welding services use a narrow beam with high energy density to weld metals and alloys with a narrower heat effect zone and deeper penetration compared to most other welding processes.
UV Light Systems
UV light systems provide ultraviolet light for identification, tracing, curing, disinfection or processing applications.
Product Announcements
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VICTREX® PEEK-ESD™ was selected as the key material by Gudeng EUV for their first commercialized Extreme Ultraviolet (EUV) Lithography Pods.
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Topics of Interest
3D Atomic Force Microscopy as an Alternative to X-SEM and TEM for Advanced Process Metrology double for each device node at 90nm Introduction and below, which means a significant As increasing demand...
Jerry X. Chen, Robert K. Henderson, and Franklin Kalk, DuPont Photomasks Reticle Technology Center Attenuated embedded phase shift masks (PSMs) based on molybdenum silicon (MoSi) are being...
Hailing the development as a giant step for next-generation lithography, Intel boasts it has delivered the world's first EUV photomask. The giant chipmaker claims the breakthrough will enable the...
Canon, Nikon to devise EUV prototype tool in '05 A Japanese consortium led by Canon Inc. and Nikon Corp. this year will begin the development of its initial tool based on extreme ultraviolet (EUV)...
Designed to repair photolithography mask defects at the 65-nm node, the Accura XT+ DualBeam mask-repair system combines a focused ion beam (FIB) column and an environmental scanning electron...
