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MICRO:Industry News:World Beat (Jan '99)

Partners to build Singapore fab Philips Semiconductors and TSMC have teamed up with a governmental investment board to construct a $1.2-billion wafer fab in Singapore. Work on the facility is scheduled to begin early this year, with a start-up date set for the second half of 2000. The fab will reach full production capacity in 2003, TSMC says. The facility will house a 23,100-sq-ft cleanroom for making logic chips with linewidths 0.25 µm.
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